Abstract: A heat sink includes a tank and a plate covering on the tank and hermetically engaging with the tank. The tank includes a base for absorbing heat from heat-generating members and a first wick layer formed at an inner face of base. The plate has a second wick layer formed at an inner face thereof. A chamber is defined between the tank and the plate and contains working fluid therein. An artery mesh is located in the chamber between the tank and the plate. The artery mesh is in porosity communication with the first wick layer and the second wick layer.

Abstract: An LED module includes a housing component, a frame holding an LED thereon and covered by the housing component, a fastener located in and secured to the housing component, a heat spreader located in the fastener and secured to the fastener and a heat transfer member having a heat-dissipating unit remote from the LED and a heat pipe thermally connecting with the heat spreader, the LED and the heat-dissipating unit. The housing component tightly presses the frame on the fastener to make a close contact between the heat pipe and the frame. The heat pipe transfers heat from the LED to the heat spreader and the heat-dissipating unit. The heat spreader and the heat-dissipating unit each have a large heat-dissipating surface, whereby the heat generated by the LED can be quickly dissipated by the heat spreader and the heat-dissipating unit.

Abstract: A heat dissipation device for removing heat from LED chips includes a finned heat sink, a plurality of heat pipes and a plurality of heat conductive substrates. The heat sink comprises a base plate and a plurality of fins formed on the base plate. The heat pipes which transfer heat in a unidirectional manner are embedded in the base plate. Each of the heat pipes defines a first wall and a second wall coupled to the heat sink. The heat pipes only transfer heat from the first walls to the second walls and restrict a heat transfer in a reversed direction. The substrates are in contact with first walls of the heat pipes. The LED chips are mounted on the substrates. When the LED chips generate heat, the heat is transferred to the fins via the unidirectional heat pipes to lower the temperature of the LED chips.

Abstract: A heat dissipation device for removing heat from LED chips includes a heat sink and a plurality of substrates. The heat sink comprises a base plate. A plurality of fins extends upwardly from the base plate. The substrates each have a unidirectional heat transfer and are attached to a bottom face of the heat sink. Each of the substrates defines a first wall on which The LED chips are mounted and a second wall coupled to the heat sink. The substrates only transfer heat from the first wall to the second wall and restrict the heat transfer in a reverse direction. When the LED chips generate heat, the heat is transferred to the fins of the heat sink via the unidirectional substrates to lower temperature of the LED chips.

Abstract: A fuse element comprises a substrate having a top surface, a bottom surface opposite to said top surface, and side surfaces, a heat insulation layer including a first surface and a second surface opposite to said first surface, said first surface of said heat insulation layer disposed on said top surface of said substrate, and said second surface having a surface roughness, a protective layer disposed above said heat insulation layer, and a fuse layer disposed between said heat insulation layer and said protective layer.

Abstract: Functionality is described for forming a summary representation of a video item to help a user decide whether to obtain a full version of the video item. The functionality operates by: (a) receiving a video item; (b) dividing the video item into a plurality of segments; (c) extracting at least one key frame from each of the plurality of segments to form a plurality of key frames; and (d) organizing the video segments into one or more groups corresponding to one or more respective scenes based on the plurality of key frames, to thereby form the representation of the video item. The functionality can be used to communicate search results to a user, to provide a sample of the video item in a message, etc.

Abstract: A memory module assembly includes a printed circuit board (10) having a heat-generating electronic component (14) thereon, and first and second heat-dissipation plates (20), (30) attached on opposite sides of the printed circuit board. The first heat-dissipation plate includes a first hook (24) extending from a side thereof and the first hook includes a resisting portion (242) extending from an end of the first heat-dissipation plate and a first engaging portion (244) extending from a free end of the resisting portion for resisting the printed circuit board and the second heat-dissipation plate. The second heat-dissipation plate defines a depressed portion (34) in a side thereof for engaging with the first hook. The other sides of the first and second heat-dissipation plates engage with each other to clamp the printed circuit board between the first and second heat-dissipation plates.

Abstract: A vapor chamber includes a base (100) for contacting a heat-generating component (500), a cover (200), a first porous capillary sheet (300) located in the base and a second porous capillary sheet (400) located in the cover and facing the first porous capillary sheet. The base comprises a block (130) extending from the base to thermally connect with the cover. The cover is mounted on the base and forms a hermetically sealed container together with the base. The first and second porous capillary sheets together form an enclosure and are contained in the container, and the block extends through the first and second porous capillary sheets and engage therewith.

Abstract: An LED module includes a latching component, a frame holding an LED thereon, a heat spreader located in the latching component and a heat transfer member having a heat-dissipating unit remote from the LED and a heat pipe thermally connecting with the heat spreader, the LED and the heat-dissipating unit. The latching component cooperates with the heat spreader to tightly press the frame being attached on the heat spreader. The heat transfer member thermally connects with the heat spreader and transfers heat from the LED to an ambient environment. The latching component has two spring pieces pushing the frame toward the heat spreader and the heat pipe. The spring pieces electrically engage with the frame to thereby electrically connect with the LED.

Abstract: The present invention provides a VLAN-based data packet transmission method and an Ethernet bridge device. The method includes: learning a member port corresponding to a VLAN according to a data packet received by an Ethernet bridge device, and storing a correspondence between a VLAN and the learnt member port; and forwarding the data packet by the Ethernet bridge device according to the correspondence between each VLAN and its member port that is stored. In the invention, the storage space of MAC address table of the Ethernet bridge device only needs to meet the requirement on the MAC address of its local user, thus the requirement of the access convergence network on the storage space of the MAC address table of the Ethernet bridge device may be lowered.

Abstract: A method for supporting source-specific multicast (SSM) forwarding over Ethernet, includes: making a Source-Specific Virtual Local Area Network (SS-VLAN) include source IP (SIP) information of the SSM; using the SS-VLAN identifier as a VLAN identifier upon Ethernet encapsulation of an SSM IP message; and performing SSM forwarding on the basis of the Ethernet encapsulation. The present invention further discloses a router and an Ethernet switching device. By employing the method and device thereof according to the present invention, the device cost and upgrade cost of the whole network can be reduced, the compatibility with the existing device to a great extent can be ensured, and investment of the operator can be reduced.

Abstract: An electrical connector comprises a longitudinal insulating housing defining a plurality of grooves and a plurality of contacts received in the groove. Each contact has a contacting arm, a retaining portion retained into the insulating housing and a soldering portion. The contacts comprises a plurality of signal contacts and grounding contacts, at least one signal contacts defining a signal group and at least one grounding contact defining a grounding group, each signal group and each grounding group are alternately arranged.

Abstract: An LED module includes a latching component, a frame holding an LED thereon, a heat spreader located in the latching component and a heat transfer member having a heat-dissipating unit remote from the LED and a heat pipe thermally connecting with the heat spreader, the LED and the heat-dissipating unit. The latching component cooperates with the heat spreader to tightly press the frame being attached on the heat spreader. The heat transfer member thermally connects with the heat spreader and transfers heat from the LED to an ambient environment. The latching component has two spring pieces pushing the frame toward the heat spreader and the heat pipe. The spring pieces electrically engage with the frame to thereby electrically connect with the LED.

Abstract: An LED module includes a housing component, a frame holding an LED thereon and covered by the housing component, a fastener located in and secured to the housing component, a heat spreader located in the fastener and secured to the fastener and a heat transfer member having a heat-dissipating unit remote from the LED and a heat pipe thermally connecting with the heat spreader, the LED and the heat-dissipating unit. The housing component tightly presses the frame on the fastener to make a close contact between the heat pipe and the frame. The heat pipe transfers heat from the LED to the heat spreader and the heat-dissipating unit. The heat spreader and the heat-dissipating unit each have a large heat-dissipating surface, whereby the heat generated by the LED can be quickly dissipated by the heat spreader and the heat-dissipating unit.

Abstract: A memory module assembly includes a printed circuit board (10) having a main heat-generating electronic component (52) thereon, first and second heat sinks (20), (30) attached on opposite sides of the printed circuit board and a clamp (40) clamping the first, second heat sinks and the printed circuit board together. The first heat sink comprises a pair of positioning poles (24). The second heat sink comprises a heat pipe (36) disposed therein and thermally connecting therewith. The clamp comprises a connecting portion (42) and a pair of elastic pressing portions (44). The clamp resiliently presses the second heat sink toward the main heat-generating electronic component and the first heat sink engages with the second heat sink via the positioning poles of the first heat sink extending in and engaging with the second heat sink.

Abstract: A cooling plate of a liquid cooling includes a chamber hermetically defined therein, an outlet, and an inlet. The outlet and the inlet communicate with the chamber for circulating liquid through the chamber. One of the outlet and the inlet is located in the other one of the outlet and the inlet.

Abstract: A memory module assembly includes a pair of heat-dissipation plates (10), a printed circuit board (20) sandwiched between the heat-dissipation plates (10), and four clamps (30) for securing the heat-dissipation plates (10) onto opposite sides of the printed circuit board (20). Each clamp includes a connecting portion (32) and a pair of elastic pressing portions (34) extending from opposite free ends of the connecting portion. Each pressing portion has a pair of hooks (342) extending from opposite lateral sides thereof and an engaging portion extending (344) from a free end thereof and clamping on an end of the heat-dissipation plate. The hooks are inserted into openings (18) defined in the heat-dissipation plates and engage with inner surfaces of the heat-dissipation plates.

Abstract: A liquid cooling device includes a casing having an outer wall, a bottom base attached to a bottom end of the outer wall and a top cover attached to a top end of the outer wall. The casing defines a receiving space therein for receiving an impeller therein. A sealed chamber is defined in the casing and isolated from the receiving space. A motor driving unit is received in the sealed chamber and magnetically interacts with the impeller to drive the impeller to rotate. The motor driving unit comprises a motor having a stator and a printed circuit board electrically connecting with the stator. The top cover covers the motor driving unit and thermally contacts with electronic components on the printed circuit board for dissipating heat generated by the electronic components when the motor driving unit is operated.

Abstract: A gas-liquid separation apparatus includes a crust and a separating pipe located in the crust. The crust includes an annular wall and two lids covering two ends of the wall. The crust has a cavity surrounded by the wall and the two lids. An inlet extends through one lid and an outlet extends through the other lid. The separating pipe is disposed in the cavity of the crust and in communication with the inlet and the outlet of the crust. A plurality of apertures is defined in a body of the separating pipe and in communication with a space inside the separating pipe and the cavity of the crust. The liquid with gas dissolved therein enters into the separating pipe via the inlet of the crust. The liquid is degassed by the separating pipe. The de-gassed liquid exits the separating pipe via the outlet of the crust.

Abstract: A method for supporting Source-Specific Multicast (SSM) forwarding in Ethernet includes: taking, by the router, a Source-Specific Destination Media Access Control address containing a Multicast Source-Group address pair as a DMAC address when encapsulating an SSM multicast IP packet into an multicast Ethernet packet; and encapsulating the SS-DMAC address into the multicast Ethernet packet; forwarding, by the Ethernet switch, the encapsulated multicast Ethernet packet according to the SS-DMAC address. Through encapsulating the SS-DMAC address into the multicast Ethernet packet, the Ethernet switch may support the SSM when forwarding the multicast Ethernet packet based on VLAN+DMAC. Embodiments of the present invention also provide system and apparatus for supporting the SSM forwarding. The solution provided by embodiments of the present invention lowers device cost and upgrade cost of a whole network lowers, provides compatibility with existed devices and reduces investment of operators.