Abstract: A gas-liquid separation apparatus includes an inlet pipe for transferring liquid with gas dissolved therein and a separating pipe for separating the gas from the liquid. The separating pipe has a spiral-shaped guiding member therein. The separating pipe extends from the inlet pipe and is in alignment and communicating with the inlet pipe. An outlet pipe extends from a joint of the inlet pipe and the separating pipe and communicates with the separating pipe, for transferring therein the liquid after the liquid has been degassed by the spiral-shaped guiding member in the separating pipe. A gas storage device communicates with the separating pipe and outside for collecting the gas from the separating pipe and discharging the gas to the outside.

Abstract: A miniature liquid cooling device includes a casing (10) defining a first chamber (102), a second chamber (104) and a third chamber (106) communicating with the first chamber. The first and the third chambers cooperatively form a work channel for liquid. An impeller (21) is rotatably mounted in the first chamber to circulate the liquid. A filter (17) is mounted in the second chamber and defines a plurality of orifices (1704). When the impeller rotates the liquid firstly enters the second chamber via an inlet (122) and flows through the filter, whereby air bubbles in the liquid leave the liquid and escape from the filter via the orifices. The escaped air bubbles enter the second chamber. The deaerated liquid flows into the work channel and finally is driven to flow out of the liquid cooling device via an outlet (124).

Abstract: A memory module assembly includes a printed circuit board (30) having a heat-generating electronic component (32) thereon, a heat sink (10) and a clip (20) for securing the heat sink onto the heat-generating electronic component. The heat sink includes a base (12) and a plurality of fins (14) arranged on the base. A plurality of recesses is defined in the heat sink. The clip includes a body (22) resting against a face of the printed circuit board and elastic hooks (24) extending from the body. The hooks are received in the recesses and resiliently press the base of the heat sink toward the heat-generating electronic component, whereby the clip clamps the heat sink and the printed circuit board together.

Abstract: A memory module assembly includes a printed circuit board (10) having a heat-generating electronic component (50) thereon, a pair of heat-dissipating plates (20) attached on the printed circuit board, and a pair of clamps (30) clamping the heat-dissipating plates and the printed circuit board therebetween. Each heat-dissipating plate includes a pair of supporters (28) and a handle (24) rotatably engaging with the supporters. The heat-dissipating plates are installed on the opposite sides of the printed circuit board by exerting a force to the handles to make them move toward each other wherein the force overcomes the spring force of the clamps.

Abstract: A heat dissipation device for a light emitting diode (LED) module includes a liquid cooling system. The liquid cooling system includes a heat-absorbing member, which includes an inlet, an outlet and at least one pipe extending between the inlet and the outlet. The inlet and the outlet are provided for permitting liquid to flow through the at least one pipe, which is in thermal contact with at least one LED of the LED module.

Abstract: A miniature liquid cooling device includes a casing (10) having a base (16) attached on a heat-generating electronic component for absorbing heat generated by the electronic component. The casing includes an outer wall (12) mounted on the base and a top cover (15) mounted on the outer wall. A receiving space is enclosed by the casing. A heat-absorbing member (40) is attached on the base and received in the receiving space for exchanging heat with liquid in the casing. An impeller (21) is rotatably mounted in the receiving space and above the heat-absorbing member. When the impeller rotates the liquid is driven to flow into the liquid cooling device via a liquid inlet (122) and then flow through the heat-absorbing member and finally flow out of the liquid cooling device via a liquid outlet (124).

Abstract: A new way of providing search results that include audio/video thumbnails for searches of audio and video content is disclosed. An audio/video thumbnail includes one or more audio/video segments retrieved from within the content of audio/video files selected as relevant to a search or other user input. For an audio/video thumbnail of more than one segment, the audio/video segments from an individual audio/video file responsive to the search are concatenated into a multi-segment audio/video thumbnail. The audio/video segments provide enough information to be indicative of the nature of the audio/video file from which each of the audio/video thumbnails is retrieved, while also fast enough that a user can scan through a series of audio/video thumbnails relatively quickly.

Abstract: A memory module assembly (1) includes a printed circuit board (10) having an electronic heat-generating electronic component (40) thereon, a heat sink (20) and a clip (30) for securing the heat sink onto the heat-generating electronic component. The clip includes a pressing portion (32) and a pair of latching portions (33) respectively extending from two ends of the pressing portion. Each latching portion includes a latching leg (332) and a retaining hook section (334) formed at a bottom end of the latching leg. The retaining hook sections tightly engage a bottom face of the printed circuit board and the pressing portion presses the base toward the heat-generating electronic component. The latching legs extend through an opening and a through hole in the printed circuit board. The through hole has a L-shaped configuration and does not communicate with a periphery side of the printed circuit board.

Abstract: A method is disclosed for providing a chunking utility that supports robust natural language processing. A corpus is chunked in accordance with a draft chunking specification. Chunk inconsistencies in the corpus are automatically flagged for resolution, and a chunking utility is provided in which at least some of the flagged inconsistencies are resolved. The chunking utility provides a single, consistent global chunking standard, ensuring compatibility among various applications. The chunking utility is particularly advantageous for non-alphabetic languages, such as Chinese.

Abstract: A memory module assembly includes a printed circuit board (10) having a main heat-generating electronic component (52) thereon, first and second heat sinks (20), (30) attached on opposite sides of the printed circuit board and a clamp (40) clamping the first, second heat sinks and the printed circuit board together. The first heat sink comprises a pair of positioning poles (24). The second heat sink comprises a heat pipe (36) disposed therein and thermally connecting therewith. The clamp comprises a connecting portion (42) and a pair of elastic pressing portions (44). The clamp resiliently presses the second heat sink toward the main heat-generating electronic component and the first heat sink engages with the second heat sink via the positioning poles of the first heat sink extending in and engaging with the second heat sink.

Abstract: A memory module assembly includes a printed circuit board (10) having a heat-generating electronic component (50) thereon, a pair of heat-dissipating plates (20) attached on the printed circuit board, and a pair of clamps (30) clamping the heat-dissipating plates and the printed circuit board therebetween. Each heat-dissipating plate includes a pair of supporters (28) and a handle (24) rotatably engaging with the supporters. The heat-dissipating plates are installed on the opposite sides of the printed circuit board by exerting a force to the handles to make them move toward each other wherein the force overcomes the spring force of the clamps.

Abstract: A memory module assembly includes a printed circuit board (30) having a heat-generating electronic component (32) thereon, a heat sink (10) and a clip (20) for securing the heat sink onto the heat-generating electronic component. The heat sink includes a base (12) and a plurality of fins (14) arranged on the base. A plurality of recesses is defined in the heat sink. The clip includes a body (22) resting against a face of the printed circuit board and elastic hooks (24) extending from the body. The hooks are received in the recesses and resiliently press the base of the heat sink toward the heat-generating electronic component, whereby the clip clamps the heat sink and the printed circuit board together.

Abstract: A memory module assembly includes a pair of heat-dissipation plates (10), a printed circuit board (20) sandwiched between the heat-dissipation plates (10), and four clamps (30) for securing the heat-dissipation plates (10) onto opposite sides of the printed circuit board (20). Each clamp includes a connecting portion (32) and a pair of elastic pressing portions (34) extending from opposite free ends of the connecting portion. Each pressing portion has a pair of hooks (342) extending from opposite lateral sides thereof and an engaging portion extending (344) from a free end thereof and clamping on an end of the heat-dissipation plate. The hooks are inserted into openings (18) defined in the heat-dissipation plates and engage with inner surfaces of the heat-dissipation plates.

Abstract: A miniature pump in accordance with the present invention comprises a pump casing (10) and a liquid circulating unit (20) received in the pump casing. The pump casing comprises a hollow main body (14) transversely forming a spacing plate (126) and a partition wall (144) spaced from the spacing plate. The liquid circulating unit comprises a shaft (25) mounted between the partition wall and the spacing plate, a bearing (27) rotatably mounted the shaft, an impeller (26) attached to the bearing, a first pair of spaced magnetic spacers (21,22) surrounding an upper portion of the shaft and positioned above the bearing, and a second pair of spaced magnetic spacers (23, 24) surrounding a lower portion of the shaft and positioned below the bearing. The two pairs of magnetic spacers properly suspend the impeller in a stable position in an axial direction of the pump when the impeller rotates.

Abstract: A vapor chamber includes a base (100) for contacting a heat-generating component (500), a cover (200), a first porous capillary sheet (300) located in the base and a second porous capillary sheet (400) located in the cover and facing the first porous capillary sheet. The base comprises a block (130) extending from the base to thermally connect with the cover. The cover is mounted on the base and forms a hermetically sealed container together with the base. The first and second porous capillary sheets together form an enclosure and are contained in the container, and the block extends through the first and second porous capillary sheets and engage therewith.

Abstract: A memory module assembly (1) includes a printed circuit board (10) having an electronic heat-generating electronic component (40) thereon, a heat sink (20) and a clip (30) for securing the heat sink onto the heat-generating electronic component. The clip includes a pressing portion (32) and a pair of latching portions (33) respectively extending from two ends of the pressing portion. Each latching portion includes a latching leg (332) and a retaining hook section (334) formed at a bottom end of the latching leg. The retaining hook sections tightly engage a bottom face of the printed circuit board and the pressing portion presses the base toward the heat-generating electronic component. The latching legs extend through an opening and a through hole in the printed circuit board. The through hole has a L-shaped configuration and does not communicate with a periphery side of the printed circuit board.

Abstract: A memory module assembly includes a printed circuit board (10) having a heat-generating electronic component (14) thereon, and first and second heat-dissipation plates (20), (30) attached on opposite sides of the printed circuit board. The first heat-dissipation plate includes a first hook (24) extending from a side thereof and the first hook includes a resisting portion (242) extending from an end of the first heat-dissipation plate and a first engaging portion (244) extending from a free end of the resisting portion for resisting the printed circuit board and the second heat-dissipation plate. The second heat-dissipation plate defines a depressed portion (34) in a side thereof for engaging with the first hook. The other sides of the first and second heat-dissipation plates engage with each other to clamp the printed circuit board between the first and second heat-dissipation plates.

Abstract: A memory module assembly (1) includes a printed circuit board (30) having an electronic heat-generating component (40) thereon, a heat sink (20) and a clip (10) for securing the heat sink onto the heat-generating component mounted on the printed circuit board. The heat sink includes a base (22) and a plurality of fins (24) arranged on the base. A recess (28) is defined extending across the fins. The clip includes a retaining portion (12) resting against a face of the printed circuit board opposite the heat sink and an elastic pressing portion (16) spaced from the retaining portion. The pressing portion is received in the recess of the heat sink and resiliently presses the base of the heat sink toward the heat-generating component, whereby the clip clamps the heat sink and the printed circuit board therebetween.

Abstract: A method of controlling blister formation in a glass melt flowing through a system comprising one ore more refractory metal vessels by developing a blister index and determining the critical blister index value. The critical value of the blister index may be used to control the principal variables responsible for blister formation, including the water content of the melt, the concentration of reduced multivalent oxide compounds in the melt, and the hydrogen partial pressure of an atmosphere in contact with the outside surface of the refractory metal vessel. Also disclosed is a minimum partial pressure of hydrogen necessary to produce an essentially blister-free glass article in a glass essentially free of arsenic and antimony.

Abstract: The invention is directed to method of preparing metal fluoride single crystals and particularly to crystals where the metal is calcium, barium, magnesium or strontium, or a mixture thereof. The invention uses a decreasing fast cooling profile and an increasing slow cooling profile for the hot zone and the cold zone, respectively, after crystal formation during cooling from melt temperatures to a first temperature. A substantially constant cooling rate is then applied to the both zones during cooling from the first temperature to a final temperature, usually room temperature. It has been found that the substantially constant cooling rate during the annealing process results in crystals having improved homogeneity and birefringence.