Patents by Inventor Qin Hu

Qin Hu has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20210119222
    Abstract: A flexible battery assembly includes a positive plate, a first filling film, a separator, a second filling film, and a negative plate stacked in order. The positive plate includes a first insulating layer, spaced first current collectors, and a positive electrode active layer. The negative plate includes a second insulating layer, spaced second current collectors, and a negative electrode active layer. Each first current collector corresponds to one second current collector. The first filling film comprises first openings each corresponding to one first current collector, and the first current collectors are embedded in the first openings. The second filling film comprises second openings each corresponding to one second current collector, and the second current collectors are embedded in the second openings. An electrolyte is sealed in the first openings and the second openings. A method for manufacturing such flexible battery assembly is also disclosed.
    Type: Application
    Filed: December 2, 2019
    Publication date: April 22, 2021
    Inventors: XIAN-QIN HU, HSIAO-TING HSU
  • Publication number: 20210059058
    Abstract: A multilayer circuit board includes a first connecting wiring board comprising a first bonding layer and a liquid crystal polymer formed on the first bonding layer. The first bonding layer comprises a first insulating filler. A fusion temperature of the first bonding layer is less than a fusion temperature of the liquid crystal polymer. The multilayer circuit board further includes a first wiring board and a second wiring board disposed on opposite sides of the first connecting wiring board. The first wiring board is combined with the first bonding layer. A method for manufacturing such multilayer circuit board is also provided.
    Type: Application
    Filed: September 26, 2019
    Publication date: February 25, 2021
    Inventors: HSIAO-TING HSU, MING-JAAN HO, XIAN-QIN HU, FU-YUN SHEN, WEN-ZHU WEI
  • Publication number: 20210041333
    Abstract: A manufacturing method for mass production for a tissue or cell microarray, which is characterized in comprising: using a molding device to mold tissue particles, cultivated cells or collected exfoliated cells (such as exfoliated cells from pleural effusion and ascites), forming the tissue particles from blended fresh tissue, tissue fixed by formalin or another solvent (such as alcohol and so on) or a tissue block embedded in paraffin (blended by a tissue blender), implanting the molded tissue or cells cores in a receptor wax or adhering the molded tissue or cells cores onto a metal plate, and then slicing to obtain a tissue or cell microarray.
    Type: Application
    Filed: October 23, 2020
    Publication date: February 11, 2021
    Inventors: Yingyong HOU, Chen XU, Dongxian JIANG, Qi SONG, Haixing WANG, Yalan LIU, Jie HUANG, Lingli CHEN, Rongkui LUO, Qin HU, Yuan JI, Shaohua LU, Jun HOU, Lijuan LUAN, Jieakesu SU
  • Patent number: 10791625
    Abstract: A method for manufacturing a flexible printed circuit board, comprising: providing a flexible printed circuit substrate; defining first through holes and second through holes through the flexible printed circuit substrate; and forming first conductive pillars and second conductive pillars; and defining first grooves by removing a portion of each first conductive pillar and defining second grooves by removing a portion of each second conductive pillar; the first grooves and the second grooves are defined from an outer surface of the flexible printed circuit board on the second conductive pattern layer side to a surface of the second conductive pattern layer away from the first conductive pattern layer; each of the first grooves is aligned with and corresponds to one first conductive pillar, and each of the second grooves is aligned with and corresponds to one second conductive pillar.
    Type: Grant
    Filed: April 23, 2019
    Date of Patent: September 29, 2020
    Assignees: Avary Holding (Shenzhen) Co., Limited, HongQiSheng Precision Electronics (QinHuangDao) Co.,Ltd.
    Inventors: Xian-Qin Hu, Ming-Jaan Ho
  • Publication number: 20200236783
    Abstract: A method for manufacturing the circuit board comprises following steps of forming a silver layer on each of two opposite surfaces of an insulating substrate, and forming a copper layer on each silver layer, thereby obtaining a middle structure; defining at least one through-hole on the middle structure, and each through-hole extending through each copper layer; forming a copper wiring layer on the copper layers to cover each through-hole and a portion region of the copper layers, the copper wiring layer comprising a copper conductive structure passing through each through-hole, the copper conductive structure connecting the copper layers; removing the copper layers not covered by the copper wiring layer; and etching the silver layers to form a silver wiring layer corresponding to the copper wiring layer, wherein a first etching liquid, which does not etch the copper wiring layer, is used for etching the silver layers.
    Type: Application
    Filed: April 8, 2020
    Publication date: July 23, 2020
    Inventors: XIAN-QIN HU, MEI YANG, JUN DAI
  • Patent number: 10681824
    Abstract: A method for manufacturing a waterproof circuit board comprises steps of providing a first wiring substrate suitable for high-frequency transmissions. The first wiring substrate includes a first copper layer and a first conductive wiring layer. A waterproof layer is formed on exposed surfaces of the first wiring substrate. A second wiring substrate suitable for low-frequency transmissions defines a receiving groove. The second wiring substrate includes a second copper layer and defines a first blind hole. The first wiring substrate is pressed in the receiving groove. A first conductive portion is formed in the first blind hole to electrically connect the first conductive wiring layer and the second copper layer.
    Type: Grant
    Filed: December 6, 2019
    Date of Patent: June 9, 2020
    Assignees: HongQiSheng Precision Electronics (QinHuangDao) Co., Ltd., Avary Holding (Shenzhen) Co., Limited.
    Inventors: Jian-Yi Hao, Yan-Lu Li, Xian-Qin Hu, Ming-Hua Du
  • Patent number: 10660218
    Abstract: A multilayer circuit board comprises an inner circuit unit having at least one solder portion, and at least one outer circuit board coupled with the inner circuit unit. The inner circuit unit connects with the outer circuit board by an insulation colloid. At least one side of the inner circuit unit does not extend to edges of the multilayer circuit board. The at least one outer circuit board forms at least one through-hole and at least one conductive hole. The at least one conductive hole which is internally-plated with copper extends from the at least one outer circuit board to the inner circuit unit. A method of manufacturing the multilayer circuit board is also disclosed.
    Type: Grant
    Filed: April 19, 2018
    Date of Patent: May 19, 2020
    Assignees: HongQiSheng Precision Electronics (QinHuangDao) Co., Ltd., Avary Holding (Shenzhen) Co., Limited.
    Inventors: Xian-Qin Hu, Li-Kun Liu, Yan-Lu Li, Ming-Jaan Ho
  • Patent number: 10653015
    Abstract: A multilayer circuit board comprises an inner circuit unit having at least one solder portion, and at least one outer circuit board coupled with the inner circuit unit. The inner circuit unit connects with the outer circuit board by an insulation colloid. At least one side of the inner circuit unit does not extend to edges of the multilayer circuit board. The at least one outer circuit board forms at least one through-hole and at least one conductive hole. The at least one conductive hole which is internally-plated with copper extends from the at least one outer circuit board to the inner circuit unit. A method of manufacturing the multilayer circuit board is also disclosed.
    Type: Grant
    Filed: January 23, 2019
    Date of Patent: May 12, 2020
    Assignees: HongQiSheng Precision Electronics (QinHuangDao) Co., Ltd., Avary Holding (Shenzhen) Co., Limited.
    Inventors: Xian-Qin Hu, Li-Kun Liu, Yan-Lu Li, Ming-Jaan Ho
  • Patent number: 10653011
    Abstract: A method for manufacturing the circuit board comprises following steps of providing an insulating substrate, and defining at least one through-hole on the insulating substrate to extending through two opposite surfaces of the insulating substrate; forming a silver layer on each of the two opposite surfaces, and forming a silver conductive structure in each through-hole connecting the silver layers; forming a copper wiring layer on the silver layers to cover each silver conductive structure and a portion region of the silver layers; and etching the silver layers to form a silver wiring layer corresponding to the copper wiring layer, wherein a first etching liquid, which does not etch the copper wiring layer, is used for etching the silver layers.
    Type: Grant
    Filed: November 17, 2017
    Date of Patent: May 12, 2020
    Assignees: HongQiSheng Precision Electronics (QinHuangDao) Co., Ltd., Avary Holding (Shenzhen) Co., Limited.
    Inventors: Xian-Qin Hu, Mei Yang, Jun Dai
  • Patent number: 10638606
    Abstract: A composite circuit board includes an insulation layer, an inner circuit layer, a first conductive layer and a second conductive layer embedded in the insulation layer, a third conductive layer and a fourth conductive layer formed on opposite surfaces of the insulation layer. The third conductive layer electrically connects with the first conductive layer. The fourth conductive layer electrically connects with the second conductive layer. The inner circuit layer is in a middle portion of the insulation layer. The first conductive layer and the second conductive layer respectively forms on opposite sides of the inner circuit layer. The insulation layer forms a plurality of first through holes between the first conductive layer and the inner circuit layer, a plurality of second through holes between the second conductive layer and the inner circuit layer.
    Type: Grant
    Filed: October 25, 2018
    Date of Patent: April 28, 2020
    Assignees: HongQiSheng Precision Electronics (QinHuangDao) Co., Ltd., Avary Holding (Shenzhen) Co., Limited.
    Inventors: Xian-Qin Hu, Mei Yang, Cheng-Jia Li
  • Publication number: 20200113064
    Abstract: A flexible printed circuit board includes a base layer and a pattern line. At least one communication hole penetrating opposite surfaces of the base layer. The pattern line includes two conductive circuit layers formed on the opposite surfaces of the base layer. At least one conductive pole are formed in the at least one communication hole and electrically connects the two conductive circuit layers. A gap being is formed between the conductive pole and the base layer.
    Type: Application
    Filed: December 11, 2019
    Publication date: April 9, 2020
    Inventors: XIAN-QIN HU, CHENG-JIA LI
  • Patent number: 10612188
    Abstract: The invention relates to an alkoxylated polyethyleneimine hydrophilically-modified fiber, wherein the alkoxylated polyethyleneimine has a weight average molecular weight of 600 to 25,000 and contains 1 to 40 alkylene oxide units per nitrogen atom. The invention also relates to a method of improving hydrophilicity of fiber comprising impregnating the fiber with an aqueous solution containing an alkoxylated polyethyleneimine, wherein the alkoxylated polyethyleneimine has a weight average molecular weight of 600 to 25,000 and contains 1 to 40 alkylene oxide units per nitrogen atom. The invention also relates to use of the alkoxylated polyethyleneimine in improving hydrophilicity of fiber.
    Type: Grant
    Filed: February 5, 2016
    Date of Patent: April 7, 2020
    Assignee: BASF SE
    Inventors: Qin Qin Hu, Laszlo Szarvas, Si Jun Zhu
  • Patent number: 10542627
    Abstract: A method for manufacturing a flexible printed circuit board includes having a base layer, and creating a pattern line and at least one conductive pole. The base layer defines at least one communication hole penetrating through the base layer. The pattern line includes two conductive circuit layers formed on opposite surfaces of the base layer. The at least one conductive pole is formed in the at least one communication hole and electrically connects the two conductive circuit layers. A diameter of each conductive pole is less than a diameter of a communication hole.
    Type: Grant
    Filed: July 31, 2018
    Date of Patent: January 21, 2020
    Assignees: HongQiSheng Precision Electronics (QinHuangDao) Co., Ltd., Avary Holding (Shenzhen) Co., Limited.
    Inventors: Xian-Qin Hu, Cheng-Jia Li
  • Patent number: 10533811
    Abstract: A heat dissipation device includes etched or other grooves for adhesive surrounding etched or other recesses for heat-dissipating fluid, these being created in a first copper sheet and a second copper sheet brought together. The first copper sheet includes first recesses and the second copper sheet includes corresponding second recesses. The second copper sheet is adhesively fixed on the first copper sheet and an airtight receiving cavity is formed by the first and second recesses being brought together. The heat-dissipating fluid in the airtight receiving cavity carries away heat generated by a heat-producing device to which the heat-dissipating device is fixed.
    Type: Grant
    Filed: May 28, 2018
    Date of Patent: January 14, 2020
    Assignees: Avary Holding (Shenzhen) Co., Limited., HongQiSheng Precision Electronis (QinHuangDao) Co., Ltd.
    Inventors: Xian-Qin Hu, Fu-Yun Shen, Ming-Jaan Ho
  • Publication number: 20190289724
    Abstract: A multilayer circuit board comprises an inner circuit unit having at least one solder portion, and at least one outer circuit board coupled with the inner circuit unit. The inner circuit unit connects with the outer circuit board by an insulation colloid. At least one side of the inner circuit unit does not extend to edges of the multilayer circuit board. The at least one outer circuit board forms at least one through-hole and at least one conductive hole. The at least one conductive hole which is internally-plated with copper extends from the at least one outer circuit board to the inner circuit unit. A method of manufacturing the multilayer circuit board is also disclosed.
    Type: Application
    Filed: April 19, 2018
    Publication date: September 19, 2019
    Inventors: XIAN-QIN HU, LI-KUN LIU, YAN-LU LI, MING-JAAN HO
  • Publication number: 20190289725
    Abstract: A multilayer circuit board comprises an inner circuit unit having at least one solder portion, and at least one outer circuit board coupled with the inner circuit unit. The inner circuit unit connects with the outer circuit board by an insulation colloid. At least one side of the inner circuit unit does not extend to edges of the multilayer circuit board. The at least one outer circuit board forms at least one through-hole and at least one conductive hole. The at least one conductive hole which is internally-plated with copper extends from the at least one outer circuit board to the inner circuit unit. A method of manufacturing the multilayer circuit board is also disclosed.
    Type: Application
    Filed: January 23, 2019
    Publication date: September 19, 2019
    Inventors: XIAN-QIN HU, LI-KUN LIU, YAN-LU LI, MING-JAAN HO
  • Publication number: 20190254161
    Abstract: A method for manufacturing a flexible printed circuit board, comprising: providing a flexible printed circuit substrate; defining first through holes and second through holes through the flexible printed circuit substrate; and forming first conductive pillars and second conductive pillars; and defining first grooves by removing a portion of each first conductive pillar and defining second grooves by removing a portion of each second conductive pillar; the first grooves and the second grooves are defined from an outer surface of the flexible printed circuit board on the second conductive pattern layer side to a surface of the second conductive pattern layer away from the first conductive pattern layer; each of the first grooves is aligned with and corresponds to one first conductive pillar, and each of the second grooves is aligned with and corresponds to one second conductive pillar.
    Type: Application
    Filed: April 23, 2019
    Publication date: August 15, 2019
    Inventors: XIAN-QIN HU, MING-JAAN HO
  • Patent number: 10365430
    Abstract: A method for manufacturing high frequency signal transmission structure comprises: providing two dielectric layers, each of the two dielectric layers defining a top surface and a bottom surface and comprising a channel with a bottom open end opened at the top surface and a top open end opened at the bottom surface, an inner diameter of the each of the two channels gradually reducing further from the top open end to the bottom open end; providing a circuit layer with a transmission portion; providing two copper plates; combining the circuit layer, the two dielectric layers and the two copper plates to form a combination; providing a shielding layer around the two air chambers; and providing at least one solder mask covering the shielding layer. The present disclosure also provides a high frequency signal transmission structure obtained by the method.
    Type: Grant
    Filed: July 19, 2017
    Date of Patent: July 30, 2019
    Assignees: Avary Holding (Shenzhen) Co., Limited., HongQiSheng Precision Electronics (QinHuangDao) Co., Ltd.
    Inventors: Xian-Qin Hu, Fu-Yun Shen, Ming-Jaan Ho, Feng-Yuan Hu
  • Patent number: 10321561
    Abstract: A flexible printed circuit board (PCB), a method for manufacturing the flexible PCB, and a PCB structure having the flexible PCB are disclosed. A flexible printed circuit board includes a first conductive pattern layer, a second conductive pattern layer, a plurality of first conductive pillars, and a plurality of second conductive pillars. Each of the plurality of first conductive pillars electrically connects to the first conductive pattern layer and is spaced from the second conductive pattern layer, and a plurality of second conductive pillars electrically connects to the second conductive pattern layer and is spaced from the first conductive pattern layer. The plurality of first conductive pillars and the plurality of second conductive pillars are exposed from one surface of the flexible printed circuit board to form a plurality of electrical contact pads.
    Type: Grant
    Filed: July 6, 2017
    Date of Patent: June 11, 2019
    Assignees: Avary Holding (Shenzhen) Co., Limited., HongQiSheng Precision Electronics (QinHuangDao) Co., Ltd.
    Inventors: Xian-Qin Hu, Ming-Jaan Ho
  • Patent number: 10285260
    Abstract: The flexible printed circuit board includes a base layer, a first circuit layer and a second circuit layer, the first circuit and the second circuit layer formed on both sides of the base layer; conducting holes extending through the base layer and the first copper layer, the conducting holes include annular copper ring embedded in the first circuit layer. A height difference between a surface of the annular copper ring and a surface of the first circuit layer is in a range from 0 to 3 micrometers. A method for manufacturing the flexible printed circuit board is also provided.
    Type: Grant
    Filed: October 30, 2015
    Date of Patent: May 7, 2019
    Assignees: Avary Holding (Shenzhen) Co., Limited., HongQiSheng Precision Electronics (QinHuangDao) Co., Ltd., GARUDA TECHNOLOGY CO., LTD.
    Inventors: Xian-Qin Hu, Yan-Lu Li, Li-Bo Zhang