Abstract: The present disclosure provides a preparation method of resveratrol nervonic acid ester, comprising the following steps of: step 1: weighing resveratrol, a nervonic acid and thiocarbonyldiimidazole according to a molar ratio of 1:1:0.8 to 1:7:11.2 in a reactor; step 2: adding a certain amount of solvent into the reactor to completely dissolve the reactants; and step 3: stirring for reaction at room temperature for 30 min to 180 min. The preparation method is safe, efficient and clean, and enables synthesis of the resveratrol nervonic acid ester with high conversion rate, high purity and high yield.

Abstract: A method for manufacturing a circuit board including: providing at least one wiring base board, the wiring base board comprising a first conductor layer, an insulation layer, and an alloy layer which are stacked in order, wherein a solder paste layer is formed on a side of the alloy layer, a part of the alloy layer is exposed out of the solder paste layer to form a thermal conductive surface; providing a core layer; and pressing two wiring base boards on two opposite sides of the core layer to form a sealed heat dissipating chamber between the thermal conductive surfaces of the two wiring base boards. The present disclosure further provides a circuit board having a heat dissipation structure.

Abstract: A Pickering particle dry powder and a preparation method are used in food processing. The preparation method includes stirring peanut protein isolate and water as raw materials to obtain peanut protein isolate dispersion, subjecting the peanut protein isolate dispersion to ultrasonic treatment, subjecting the resultant to cross-linking reaction with transglutaminase to obtain a monolithic geld, shearing and homogenizing the monolithic gel to obtain a microgel particle dispersion, spray drying the microgel particle dispersion to obtain the Pickering particle dry powder. The Pickering particle dry powder prepared by the ultrasonic-assisted enzyme method is still in nanometer level after rehydration, which is beneficial to preparing Pickering emulsion with strong stability. The preparation method has the advantages of simple operation and low cost, which is beneficial to actual production in the food industry.

Abstract: Provided in the present application are an electronic device and a control method for the electronic device. A shell in the electronic device is provided with a first face and a second face that are arranged opposite each other and a first side portion and a second side portion that are arranged opposite each other; a guide apparatus is received in the shell, and the guide apparatus can drive the second side portion to extend or retract; and a flexible display screen is arranged at an outer surface of the shell, and the side, located at the second face, of the flexible display screen is provided with an opening, and when the guide apparatus drives the second side portion to extent, the flexible display screen is split from the opening, and the flexible display screen moves from the second face to the first face along the guide apparatus.

Abstract: Systems and methods for accurate representation of camera field of view in two-dimensional mapping applications. One example system includes a transceiver, a display for displaying a graphical user interface, and an electronic processor. The electronic processor is configured to provide, on the graphical user interface, a two-dimensional map representing the real-world area and determine a plurality of characteristics for the camera. The electronic processor is configured to generate a three-dimensional model for the field of view based on the plurality of characteristics. The electronic processor is configured to determine an intersection plane for the three-dimensional model and generate, based on the intersection plane, a two-dimensional slice of the three-dimensional model, the two-dimensional slice being representative of the field of view within the area.

Abstract: A method for obstacle detection and recognition for an intelligent snow sweeping robot is disclosed, comprising: 1) disposing ultrasonic sensors at a front end of the snow sweeping robot to detect distance information from an obstacle ahead; and disposing radar sensors at the front and rear of the snow sweeping robot to detect whether a creature suddenly approaches; 2) processing signals detected by each of the ultrasonic sensors and radar sensors, and calculating a forward distance of the snow sweeping robot; and 3) determining a snow cover extent of a working road, detecting a change of the distance from the obstacles, and recognizing the obstacles for conditions of an ultrasonic ranging variation ratio and a variation of the forward distance of the snow sweeping robot, a change of the signal detected by radar sensors, and a descriptive statistic of the snow cover extent within a specific time period.

Abstract: A circuit board with reduced dielectric losses enabling the movement of high frequency signals includes an inner circuit board and two outer circuit boards. The inner circuit board includes a first conductor layer and a first substrate layer. The first conductor layer includes a signal line and two ground lines on both sides of the signal line. The first substrate layer covers a side of the first conductor layer and defines first through holes which expose the signal line. Each outer circuit board includes a second substrate layer and a second conductor layer. The second substrate layer abuts the inner circuit board and defines second through holes which are not aligned with the first through holes, partially surrounding the signal line with air which has a very low dielectric constant. A method for manufacturing the high-frequency circuit board is also disclosed.

Abstract: A circuit board with embedded components and a method of fabricating the same are provided. The method includes coating an adhesive layer over a substrate, and disposing electronic components on the adhesive layer. Subsequently, after disposing a dielectric layer over the electronic components and the adhesive layer, the substrate and the adhesive layer are removed to form an embedded layer. Then, a wiring layer is formed on the electronic components, and conductive connecting components are formed within the dielectric layer. A cover layer is laminated over the dielectric layer and the wiring layer. Therefore, the electronic components are embedded within the dielectric layer, and the wiring layer electrically connecting to the electronic components are precisely located on a surface of the embedded layer.

Abstract: A circuit board includes at least two circuit board units stacked together. Each circuit board unit includes a substrate and a circuit layer. The substrate defines a conductive hole penetrating therethrough. The conductive hole provided with a conductor therein. One side of the substrate further defines a groove, the groove including a concave portion aligned with the conductive hole. The circuit layer includes a connection pad located in the concave portion. The connection pad is shaped as a conductive protrusion, which surrounds and is electrically connected to the conductor. The circuit layer is located in the groove, and the conductive hole is electrically connecting the circuit layers of the circuit board units.

Abstract: Systems and methods for accurate representation of camera field of view in two-dimensional mapping applications. One example system includes a transceiver, a display for displaying a graphical user interface, and an electronic processor. The electronic processor is configured to provide, on the graphical user interface, a two-dimensional map representing the real-world area and determine a plurality of characteristics for the camera. The electronic processor is configured to generate a three-dimensional model for the field of view based on the plurality of characteristics. The electronic processor is configured to determine an intersection plane for the three-dimensional model and generate, based on the intersection plane, a two-dimensional slice of the three-dimensional model, the two-dimensional slice being representative of the field of view within the area.

Abstract: A method for manufacturing a circuit board with a heat dissipation structure comprises: providing at least one wiring base board, the wiring base board comprising a first conductor layer, an insulation layer, and an alloy layer which are stacked in order, wherein a solder paste layer is formed on a side of the alloy layer, a part of the alloy layer is exposed out of the solder paste layer to form a thermal conductive surface; providing a core layer; and pressing two wiring base boards on two opposite sides of the core layer to form a sealed heat dissipating chamber between the thermal conductive surfaces of the two wiring base boards. The present disclosure further provides a circuit board with a heat dissipation structure.

Abstract: A method for manufacturing a circuit board with narrow conductive traces and narrow spaces between traces includes a base layer and two first wiring layers disposed on opposite surfaces of the base layer. Each first wiring layer includes a first bottom wiring and a first electroplated copper wiring. The first bottom wiring is formed on the base layer. The first bottom wiring includes a first end facing the base layer, a second end opposite to the first end, and a first sidewall connecting the first end and the second end. The first electroplated copper wiring covers the second end and the first sidewall of the first bottom wiring.

Abstract: A method for manufacturing a circuit board with narrow conductive traces and narrow spaces between traces includes a base layer and two first wiring layers disposed on opposite surfaces of the base layer. Each first wiring layer includes a first bottom wiring and a first electroplated copper wiring. The first bottom wiring is formed on the base layer. The first bottom wiring includes a first end facing the base layer, a second end opposite to the first end, and a first sidewall connecting the first end and the second end. The first electroplated copper wiring covers the second end and the first sidewall of the first bottom wiring.

Abstract: The present disclosure provides a neural network-based visual detection and tracking method of an inspection robot, which includes the following steps of: 1) acquiring environmental images of a dynamic background a movement process of the robot; 2) preprocessing the acquired images; 3) detecting human targets and specific behaviors in the images in the robot body, and saving the sizes, position information and features of the human targets with the specific behaviors; 4) controlling the orientation of a robot gimbal by using a target tracking algorithm to make sure that a specific target is always located at the central positions of the images; and 5) controlling the robot to move along with a tracked object. The neural network-based visual detection and tracking method of an inspection robot in the present disclosure has a quite high adaptive ability, achieves better detection and tracking effects on targets in a dynamic background scene.

Abstract: A flexible battery assembly includes a positive plate, a first filling film, a separator, a second filling film, and a negative plate stacked in order. The positive plate includes a first insulating layer, spaced first current collectors, and a positive electrode active layer. The negative plate includes a second insulating layer, spaced second current collectors, and a negative electrode active layer. Each first current collector corresponds to one second current collector. The first filling film comprises first openings each corresponding to one first current collector, and the first current collectors are embedded in the first openings. The second filling film comprises second openings each corresponding to one second current collector, and the second current collectors are embedded in the second openings. An electrolyte is sealed in the first openings and the second openings. A method for manufacturing such flexible battery assembly is also disclosed.

Abstract: A method for manufacturing a circuit board is disclosed. An inner laminated structure with a conductive wiring layer and an outermost cover layer is provided. The conductive wiring layer includes a connection pad. A mask is disposed on a side of the cover layer away from the conductive wiring layer, and the mask defines a plurality of first openings penetrating the mask. A second opening is formed on the cover layer by laser etching through the mask to expose the connection pad. A surface treatment is applied to the connection pad and an electronic component is electrically connected with the connection pad. A circuit board is also disclosed.

Abstract: The present disclosure provides a neural network-based visual detection and tracking method of an inspection robot, which includes the following steps of: 1) acquiring environmental images of a dynamic background a movement process of the robot; 2) preprocessing the acquired images; 3) detecting human targets and specific behaviors in the images in the robot body, and saving the sizes, position information and features of the human targets with the specific behaviors; 4) controlling the orientation of a robot gimbal by using a target tracking algorithm to make sure that a specific target is always located at the central positions of the images; and 5) controlling the robot to move along with a tracked object. The neural network-based visual detection and tracking method of an inspection robot in the present disclosure has a quite high adaptive ability, achieves better detection and tracking effects on targets in a dynamic background scene.

Abstract: A method for obstacle detection and recognition for an intelligent snow sweeping robot is disclosed, comprising: 1) disposing ultrasonic sensors at a front end of the snow sweeping robot to detect distance information from an obstacle ahead; and disposing radar sensors at the front and rear of the snow sweeping robot to detect whether a creature suddenly approaches; 2) processing signals detected by each of the ultrasonic sensors and radar sensors, and calculating a forward distance of the snow sweeping robot; and 3) determining a snow cover extent of a working road, detecting a change of the distance from the obstacles, and recognizing the obstacles for conditions of an ultrasonic ranging variation ratio and a variation of the forward distance of the snow sweeping robot, a change of the signal detected by radar sensors, and a descriptive statistic of the snow cover extent within a specific time period.

Abstract: A method for manufacturing the circuit board comprises following steps of forming a silver layer on each of two opposite surfaces of an insulating substrate, and forming a copper layer on each silver layer, thereby obtaining a middle structure; defining at least one through-hole on the middle structure, and each through-hole extending through each copper layer; forming a copper wiring layer on the copper layers to cover each through-hole and a portion region of the copper layers, the copper wiring layer comprising a copper conductive structure passing through each through-hole, the copper conductive structure connecting the copper layers; removing the copper layers not covered by the copper wiring layer; and etching the silver layers to form a silver wiring layer corresponding to the copper wiring layer, wherein a first etching liquid, which does not etch the copper wiring layer, is used for etching the silver layers.

Abstract: A circuit board includes at least two circuit board units stacked together. Each circuit board unit includes a substrate and a circuit layer. The substrate defines a conductive hole penetrating therethrough. The conductive hole provided with a conductor therein. One side of the substrate further defines a groove, the groove including a concave portion aligned with the conductive hole. The circuit layer includes a connection pad located in the concave portion. The connection pad is shaped as a conductive protrusion, which surrounds and is electrically connected to the conductor. The circuit layer is located in the groove, and the conductive hole is electrically connecting the circuit layers of the circuit board units.