Patents by Inventor Qin Hu

Qin Hu has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20220264743
    Abstract: A backplane, a backlight source, an illumination device and a displaying device. The backplane comprises a substrate; a first metal trace layer disposed on one surface of the substrate; an insulating layer disposed on a side, away from the substrate, of the first metal trace layer; a second metal trace layer disposed on a side, away from the substrate, of the insulating layer, an overlapping area existing between an orthographic projection of the second metal trace layer on the substrate and an orthographic projection of the first metal trace layer on the substrate; and a barrier layer disposed between the first metal trace layer and the second metal trace layer, an orthographic projection of the barrier layer on the substrate covering the overlapping area, and the barrier layer being used for preventing metals in the first metal trace layer and the second metal trace layer from growing towards each other.
    Type: Application
    Filed: October 22, 2021
    Publication date: August 18, 2022
    Inventors: Yongfei LI, Liuyue YIN, Haifeng HU, Huan LIU, Mengmeng LI, Yuancheng LI, Yu JIANG, Qin ZENG, Zouming XU, Jian TIAN, Chunjian LIU, Xintao WU, Jie LEI, Jie WANG, Jianying ZHANG
  • Patent number: 11417890
    Abstract: A flexible battery assembly includes a positive plate, a first filling film, a separator, a second filling film, and a negative plate stacked in order. The positive plate includes a first insulating layer, spaced first current collectors, and a positive electrode active layer. The negative plate includes a second insulating layer, spaced second current collectors, and a negative electrode active layer. Each first current collector corresponds to one second current collector. The first filling film comprises first openings each corresponding to one first current collector, and the first current collectors are embedded in the first openings. The second filling film comprises second openings each corresponding to one second current collector, and the second current collectors are embedded in the second openings. An electrolyte is sealed in the first openings and the second openings. A method for manufacturing such flexible battery assembly is also disclosed.
    Type: Grant
    Filed: December 2, 2019
    Date of Patent: August 16, 2022
    Assignees: Avary Holding (Shenzhen) Co., Limited., QING DING PRECISION ELECTRONICS (HUAIAN) CO., LTD
    Inventors: Xian-Qin Hu, Hsiao-Ting Hsu
  • Publication number: 20220225510
    Abstract: A method for manufacturing a circuit board is disclosed. An inner laminated structure with a conductive wiring layer and an outermost cover layer is provided. The conductive wiring layer includes a connection pad. A mask is disposed on a side of the cover layer away from the conductive wiring layer, and the mask defines a plurality of first openings penetrating the mask. A second opening is formed on the cover layer by laser etching through the mask to expose the connection pad. A surface treatment is applied to the connection pad and an electronic component is electrically connected with the connection pad. A circuit board is also disclosed.
    Type: Application
    Filed: March 31, 2022
    Publication date: July 14, 2022
    Inventors: HSIAO-TING HSU, QIAN-NAN ZHOU, XIAN-QIN HU, MING-JAAN HO, FU-YUN SHEN
  • Publication number: 20220180090
    Abstract: The present disclosure provides a neural network-based visual detection and tracking method of an inspection robot, which includes the following steps of: 1) acquiring environmental images of a dynamic background a movement process of the robot; 2) preprocessing the acquired images; 3) detecting human targets and specific behaviors in the images in the robot body, and saving the sizes, position information and features of the human targets with the specific behaviors; 4) controlling the orientation of a robot gimbal by using a target tracking algorithm to make sure that a specific target is always located at the central positions of the images; and 5) controlling the robot to move along with a tracked object. The neural network-based visual detection and tracking method of an inspection robot in the present disclosure has a quite high adaptive ability, achieves better detection and tracking effects on targets in a dynamic background scene.
    Type: Application
    Filed: June 16, 2021
    Publication date: June 9, 2022
    Inventors: Yongduan Song, Li Huang, Shilei Tan, Junfeng Lai, Huan Liu, Ziqiang Jiang, Jie Zhang, Huan Chen, Jiangyu Wu, Hong Long, Fang Hu, Qin Hu
  • Publication number: 20220171395
    Abstract: A method for obstacle detection and recognition for an intelligent snow sweeping robot is disclosed, comprising: 1) disposing ultrasonic sensors at a front end of the snow sweeping robot to detect distance information from an obstacle ahead; and disposing radar sensors at the front and rear of the snow sweeping robot to detect whether a creature suddenly approaches; 2) processing signals detected by each of the ultrasonic sensors and radar sensors, and calculating a forward distance of the snow sweeping robot; and 3) determining a snow cover extent of a working road, detecting a change of the distance from the obstacles, and recognizing the obstacles for conditions of an ultrasonic ranging variation ratio and a variation of the forward distance of the snow sweeping robot, a change of the signal detected by radar sensors, and a descriptive statistic of the snow cover extent within a specific time period.
    Type: Application
    Filed: July 22, 2021
    Publication date: June 2, 2022
    Applicant: Chongqing University
    Inventors: Yongduan Song, Ziqiang Jiang, Shilei Tan, Junfeng Lai, Huan Liu, Li Huang, Jie Zhang, Huan Chen, Hong Long, Fang Hu, Jiangyu Wu, Qin Hu, Wenqi Li
  • Patent number: 11294285
    Abstract: A method for manufacturing the circuit board comprises following steps of forming a silver layer on each of two opposite surfaces of an insulating substrate, and forming a copper layer on each silver layer, thereby obtaining a middle structure; defining at least one through-hole on the middle structure, and each through-hole extending through each copper layer; forming a copper wiring layer on the copper layers to cover each through-hole and a portion region of the copper layers, the copper wiring layer comprising a copper conductive structure passing through each through-hole, the copper conductive structure connecting the copper layers; removing the copper layers not covered by the copper wiring layer; and etching the silver layers to form a silver wiring layer corresponding to the copper wiring layer, wherein a first etching liquid, which does not etch the copper wiring layer, is used for etching the silver layers.
    Type: Grant
    Filed: April 8, 2020
    Date of Patent: April 5, 2022
    Assignees: HongQiSheng Precision Electronics (QinHuangDao) Co., Ltd., Avary Holding (Shenzhen) Co., Limited.
    Inventors: Xian-Qin Hu, Mei Yang, Jun Dai
  • Publication number: 20220078922
    Abstract: A circuit board includes at least two circuit board units stacked together. Each circuit board unit includes a substrate and a circuit layer. The substrate defines a conductive hole penetrating therethrough. The conductive hole provided with a conductor therein. One side of the substrate further defines a groove, the groove including a concave portion aligned with the conductive hole. The circuit layer includes a connection pad located in the concave portion. The connection pad is shaped as a conductive protrusion, which surrounds and is electrically connected to the conductor. The circuit layer is located in the groove, and the conductive hole is electrically connecting the circuit layers of the circuit board units.
    Type: Application
    Filed: November 16, 2021
    Publication date: March 10, 2022
    Inventors: MING-JAAN HO, XIAN-QIN HU, FU-YUN SHEN, HSIAO-TING HSU, YONG-CHAO WEI
  • Publication number: 20220069438
    Abstract: A method for manufacturing an antenna printed circuit board includes the following steps: providing a flexible-rigid printed circuit board comprising a flexible region and a rigid region. The flexible region comprises at least one first connecting pad and at least one second connecting pad arranged opposite sides of the rigid region. At least one antenna module is attached to the first connecting pad through a conductive paste. The antenna module is fixed on the rigid region by a first reflow soldering process. At least one radio frequency integrated circuit structure is attached to the second connecting pad through a conductive paste. The radio frequency integrated circuit is fixed on the rigid region by a second reflow soldering process. A gap between the antenna module and the rigid region and a gap between the radio frequency integrated circuit structure and the rigid region are filled with dielectric materials and cured.
    Type: Application
    Filed: September 22, 2020
    Publication date: March 3, 2022
    Inventors: ZI-QIANG GAO, CHIH-WEN CHENG, KE HE, XIAN-QIN HU
  • Patent number: 11264701
    Abstract: A method for manufacturing an antenna printed circuit board includes the following steps: providing a flexible-rigid printed circuit board comprising a flexible region and a rigid region. The flexible region comprises at least one first connecting pad and at least one second connecting pad arranged opposite sides of the rigid region. At least one antenna module is attached to the first connecting pad through a conductive paste. The antenna module is fixed on the rigid region by a first reflow soldering process. At least one radio frequency integrated circuit structure is attached to the second connecting pad through a conductive paste. The radio frequency integrated circuit is fixed on the rigid region by a second reflow soldering process. A gap between the antenna module and the rigid region and a gap between the radio frequency integrated circuit structure and the rigid region are filled with dielectric materials and cured.
    Type: Grant
    Filed: September 22, 2020
    Date of Patent: March 1, 2022
    Assignees: Avary Holding (Shenzhen) Co., Limited., QING DING PRECISION ELECTRONICS (HUAIAN) CO., LTD
    Inventors: Zi-Qiang Gao, Chih-Wen Cheng, Ke He, Xian-Qin Hu
  • Publication number: 20220053629
    Abstract: A circuit board with reduced dielectric losses enabling the movement of high frequency signals includes an inner circuit board and two outer circuit boards. The inner circuit board includes a first conductor layer and a first substrate layer. The first conductor layer includes a signal line and two ground lines on both sides of the signal line. The first substrate layer covers a side of the first conductor layer and defines first through holes which expose the signal line. Each outer circuit board includes a second substrate layer and a second conductor layer. The second substrate layer abuts the inner circuit board and defines second through holes which are not aligned with the first through holes, partially surrounding the signal line with air which has a very low dielectric constant. A method for manufacturing the high-frequency circuit board is also disclosed.
    Type: Application
    Filed: October 28, 2021
    Publication date: February 17, 2022
    Inventors: FU-YUN SHEN, XIAN-QIN HU
  • Publication number: 20220046802
    Abstract: A method for manufacturing a circuit board with narrow conductive traces and narrow spaces between traces includes a base layer and two first wiring layers disposed on opposite surfaces of the base layer. Each first wiring layer includes a first bottom wiring and a first electroplated copper wiring. The first bottom wiring is formed on the base layer. The first bottom wiring includes a first end facing the base layer, a second end opposite to the first end, and a first sidewall connecting the first end and the second end. The first electroplated copper wiring covers the second end and the first sidewall of the first bottom wiring.
    Type: Application
    Filed: September 30, 2020
    Publication date: February 10, 2022
    Inventors: YING-QIU ZHENG, CHAO PENG, XIAN-QIN HU
  • Patent number: 11212922
    Abstract: The disclosure provides a method for manufacturing a circuit board, which includes: (1) providing a substrate, forming a through hole in the substrate; (2) filling the through hole with a conductor to form a conductive hole; (3) providing a peelable film to cover the substrate; (4) forming a groove by laser, the groove including a concave portion; (5) performing a surface treatment on a wall of the groove; (6) removing the peelable film; (7) forming a seed layer; (8) making a circuit layer to obtain a circuit board unit, the circuit layer including a connection pad, the connection pad shaped as a conductive protrusion which surrounds and is electrically connected to the conductor; (9) repeating step (1) to step (8) at least once; and (10) laminating the circuit board units. The disclosure also provides a circuit board.
    Type: Grant
    Filed: April 23, 2019
    Date of Patent: December 28, 2021
    Assignees: QING DING PRECISION ELECTRONICS (HUAIAN) CO., LTD, Avary Holding (Shenzhen) Co., Limited.
    Inventors: Ming-Jaan Ho, Xian-Qin Hu, Fu-Yun Shen, Hsiao-Ting Hsu, Yong-Chao Wei
  • Publication number: 20210399397
    Abstract: A high-frequency signal transmission structure capable of transmitting high frequency signals with reduced attenuation includes a first wiring board and a second wiring board. The first wiring board includes a first conductor layer, a second conductor layer, and a first base film layer sandwiched between the first conductor layer and the second conductor layer. The second wiring board includes a second base film layer and a third conductor layer. the second base film layer covers the surface of the first conductor layer facing away from the first base film layer. The first base film layer and the second base film layer surround the first conductor layer and both include an aerogel film layer having an air to gel ratio by volume of 80-99%. A method for manufacturing the high-frequency signal transmission structure is also disclosed.
    Type: Application
    Filed: June 30, 2020
    Publication date: December 23, 2021
    Inventors: HSIAO-TING HSU, MING-JAAN HO, XIAN-QIN HU, FU-YUN SHEN
  • Publication number: 20210392758
    Abstract: A thin circuit board (100) and a method of manufacturing the same, the thin circuit board (100) includes: a dielectric layer (40); an inner circuit substrate (30); and a metal layer (50) formed on at least one side of the inner circuit substrate (30). The metal layer (450) is covered by the dielectric layer (40). The dielectric layer (40) includes an outermost insulating layer (11) and a bonding structure (20) sandwiched between the inner circuit substrate (30) and the metal layer (50), the metal layer (50) is wrapped by the insulating layer (11) and the bonding structure (20).
    Type: Application
    Filed: October 31, 2019
    Publication date: December 16, 2021
    Inventors: HSIAO-TING HSU, MING-JAAN HO, FU-YUN SHEN, XIAN-QIN HU
  • Publication number: 20210385939
    Abstract: A circuit board with reduced dielectric losses enabling the movement of high frequency signals includes an inner circuit board and two outer circuit boards. The inner circuit board includes a first conductor layer and a first substrate layer. The first conductor layer includes a signal line and two ground lines on both sides of the signal line. The first substrate layer covers a side of the first conductor layer and defines first through holes which expose the signal line. Each outer circuit board includes a second substrate layer and a second conductor layer. The second substrate layer abuts the inner circuit board and defines second through holes which are not aligned with the first through holes, partially surrounding the signal line with air which has a very low dielectric constant. A method for manufacturing the high-frequency circuit board is also disclosed.
    Type: Application
    Filed: September 23, 2020
    Publication date: December 9, 2021
    Inventors: FU-YUN SHEN, XIAN-QIN HU
  • Patent number: 11197368
    Abstract: A circuit board with reduced dielectric losses enabling the movement of high frequency signals includes an inner circuit board and two outer circuit boards. The inner circuit board includes a first conductor layer and a first substrate layer. The first conductor layer includes a signal line and two ground lines on both sides of the signal line. The first substrate layer covers a side of the first conductor layer and defines first through holes which expose the signal line. Each outer circuit board includes a second substrate layer and a second conductor layer. The second substrate layer abuts the inner circuit board and defines second through holes which are not aligned with the first through holes, partially surrounding the signal line with air which has a very low dielectric constant. A method for manufacturing the high-frequency circuit board is also disclosed.
    Type: Grant
    Filed: September 23, 2020
    Date of Patent: December 7, 2021
    Assignees: Avary Holding (Shenzhen) Co., Limited, QING DING PRECISION ELECTRONICS (HUAIAN) CO., LTD
    Inventors: Fu-Yun Shen, Xian-Qin Hu
  • Patent number: 11140785
    Abstract: A flexible printed circuit board includes a base layer and a pattern line. At least one communication hole penetrating opposite surfaces of the base layer. The pattern line includes two conductive circuit layers formed on the opposite surfaces of the base layer. At least one conductive pole are formed in the at least one communication hole and electrically connects the two conductive circuit layers. A gap being is formed between the conductive pole and the base layer.
    Type: Grant
    Filed: December 11, 2019
    Date of Patent: October 5, 2021
    Assignees: HongQiSheng Precision Electronics (QinHuangDao) Co., Ltd., Avary Holding (Shenzhen) Co., Limited.
    Inventors: Xian-Qin Hu, Cheng-Jia Li
  • Publication number: 20210256566
    Abstract: The present disclosure discloses a media information presentation method performed at a computer server communicatively connected to a plurality of terminals associated with a social networking platform. The method includes: receiving a plurality of media information operation messages, each message indicating an operation performed on a piece of advertisement by one of a first group of users; deriving a second group of users that are direct connections of the first group of users; collecting, from the media information operation messages, statistics on operation statistical data of the second group of users; and receiving a media information obtaining request from a respective user of the second group of users at a terminal; in response to the request, identifying a plurality of pieces of advertisement corresponding to the respective user; sorting them according to their corresponding operation weights; and returning, to the terminal, top L pieces of advertisement in the descending order.
    Type: Application
    Filed: May 6, 2021
    Publication date: August 19, 2021
    Inventors: Mengting JIANG, Zhendong Tang, Qin Hu
  • Publication number: 20210235590
    Abstract: The disclosure provides a method for manufacturing a circuit board, which includes: (1) providing a substrate, forming a through hole in the substrate; (2) filling the through hole with a conductor to form a conductive hole; (3) providing a peelable film to cover the substrate; (4) forming a groove by laser, the groove including a concave portion; (5) performing a surface treatment on a wall of the groove; (6) removing the peelable film; (7) forming a seed layer; (8) making a circuit layer to obtain a circuit board unit, the circuit layer including a connection pad, the connection pad shaped as a conductive protrusion which surrounds and is electrically connected to the conductor; (9) repeating step (1) to step (8) at least once; and (10) laminating the circuit board units. The disclosure also provides a circuit board.
    Type: Application
    Filed: April 23, 2019
    Publication date: July 29, 2021
    Inventors: MING-JAAN HO, XIAN-QIN HU, FU-YUN SHEN, HSIAO-TING HSU, YONG-CHAO WEI
  • Patent number: 11030656
    Abstract: The present disclosure discloses a media information presentation method performed at a computer server that is communicatively connected to a plurality of terminals. The server receives at least one media information operation message; determines a first user and media information corresponding to each media information operation message, and an operation performed by the first user on the media information, to generate log data; obtains a social relationship chain of each first user included in the log data; collects statistics on operation statistical data of the second user according to the log data; and receives a media information obtaining request of a third user. The server then selects, when operation statistical data of the third user is found from the operation statistical data of the second user, at least one piece of media information from the operation statistical data of the third user, and returns it to the second user.
    Type: Grant
    Filed: July 9, 2018
    Date of Patent: June 8, 2021
    Assignee: TENCENT TECHNOLOGY (SHENZHEN) COMPANY LIMITED
    Inventors: Mengting Jiang, Zhendong Tang, Qin Hu