Patents by Inventor Qin Hu
Qin Hu has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Publication number: 20220053629Abstract: A circuit board with reduced dielectric losses enabling the movement of high frequency signals includes an inner circuit board and two outer circuit boards. The inner circuit board includes a first conductor layer and a first substrate layer. The first conductor layer includes a signal line and two ground lines on both sides of the signal line. The first substrate layer covers a side of the first conductor layer and defines first through holes which expose the signal line. Each outer circuit board includes a second substrate layer and a second conductor layer. The second substrate layer abuts the inner circuit board and defines second through holes which are not aligned with the first through holes, partially surrounding the signal line with air which has a very low dielectric constant. A method for manufacturing the high-frequency circuit board is also disclosed.Type: ApplicationFiled: October 28, 2021Publication date: February 17, 2022Inventors: FU-YUN SHEN, XIAN-QIN HU
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Publication number: 20220046802Abstract: A method for manufacturing a circuit board with narrow conductive traces and narrow spaces between traces includes a base layer and two first wiring layers disposed on opposite surfaces of the base layer. Each first wiring layer includes a first bottom wiring and a first electroplated copper wiring. The first bottom wiring is formed on the base layer. The first bottom wiring includes a first end facing the base layer, a second end opposite to the first end, and a first sidewall connecting the first end and the second end. The first electroplated copper wiring covers the second end and the first sidewall of the first bottom wiring.Type: ApplicationFiled: September 30, 2020Publication date: February 10, 2022Inventors: YING-QIU ZHENG, CHAO PENG, XIAN-QIN HU
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Patent number: 11212922Abstract: The disclosure provides a method for manufacturing a circuit board, which includes: (1) providing a substrate, forming a through hole in the substrate; (2) filling the through hole with a conductor to form a conductive hole; (3) providing a peelable film to cover the substrate; (4) forming a groove by laser, the groove including a concave portion; (5) performing a surface treatment on a wall of the groove; (6) removing the peelable film; (7) forming a seed layer; (8) making a circuit layer to obtain a circuit board unit, the circuit layer including a connection pad, the connection pad shaped as a conductive protrusion which surrounds and is electrically connected to the conductor; (9) repeating step (1) to step (8) at least once; and (10) laminating the circuit board units. The disclosure also provides a circuit board.Type: GrantFiled: April 23, 2019Date of Patent: December 28, 2021Assignees: QING DING PRECISION ELECTRONICS (HUAIAN) CO., LTD, Avary Holding (Shenzhen) Co., Limited.Inventors: Ming-Jaan Ho, Xian-Qin Hu, Fu-Yun Shen, Hsiao-Ting Hsu, Yong-Chao Wei
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Publication number: 20210399397Abstract: A high-frequency signal transmission structure capable of transmitting high frequency signals with reduced attenuation includes a first wiring board and a second wiring board. The first wiring board includes a first conductor layer, a second conductor layer, and a first base film layer sandwiched between the first conductor layer and the second conductor layer. The second wiring board includes a second base film layer and a third conductor layer. the second base film layer covers the surface of the first conductor layer facing away from the first base film layer. The first base film layer and the second base film layer surround the first conductor layer and both include an aerogel film layer having an air to gel ratio by volume of 80-99%. A method for manufacturing the high-frequency signal transmission structure is also disclosed.Type: ApplicationFiled: June 30, 2020Publication date: December 23, 2021Inventors: HSIAO-TING HSU, MING-JAAN HO, XIAN-QIN HU, FU-YUN SHEN
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Publication number: 20210392758Abstract: A thin circuit board (100) and a method of manufacturing the same, the thin circuit board (100) includes: a dielectric layer (40); an inner circuit substrate (30); and a metal layer (50) formed on at least one side of the inner circuit substrate (30). The metal layer (450) is covered by the dielectric layer (40). The dielectric layer (40) includes an outermost insulating layer (11) and a bonding structure (20) sandwiched between the inner circuit substrate (30) and the metal layer (50), the metal layer (50) is wrapped by the insulating layer (11) and the bonding structure (20).Type: ApplicationFiled: October 31, 2019Publication date: December 16, 2021Inventors: HSIAO-TING HSU, MING-JAAN HO, FU-YUN SHEN, XIAN-QIN HU
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Publication number: 20210385939Abstract: A circuit board with reduced dielectric losses enabling the movement of high frequency signals includes an inner circuit board and two outer circuit boards. The inner circuit board includes a first conductor layer and a first substrate layer. The first conductor layer includes a signal line and two ground lines on both sides of the signal line. The first substrate layer covers a side of the first conductor layer and defines first through holes which expose the signal line. Each outer circuit board includes a second substrate layer and a second conductor layer. The second substrate layer abuts the inner circuit board and defines second through holes which are not aligned with the first through holes, partially surrounding the signal line with air which has a very low dielectric constant. A method for manufacturing the high-frequency circuit board is also disclosed.Type: ApplicationFiled: September 23, 2020Publication date: December 9, 2021Inventors: FU-YUN SHEN, XIAN-QIN HU
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Patent number: 11197368Abstract: A circuit board with reduced dielectric losses enabling the movement of high frequency signals includes an inner circuit board and two outer circuit boards. The inner circuit board includes a first conductor layer and a first substrate layer. The first conductor layer includes a signal line and two ground lines on both sides of the signal line. The first substrate layer covers a side of the first conductor layer and defines first through holes which expose the signal line. Each outer circuit board includes a second substrate layer and a second conductor layer. The second substrate layer abuts the inner circuit board and defines second through holes which are not aligned with the first through holes, partially surrounding the signal line with air which has a very low dielectric constant. A method for manufacturing the high-frequency circuit board is also disclosed.Type: GrantFiled: September 23, 2020Date of Patent: December 7, 2021Assignees: Avary Holding (Shenzhen) Co., Limited, QING DING PRECISION ELECTRONICS (HUAIAN) CO., LTDInventors: Fu-Yun Shen, Xian-Qin Hu
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Patent number: 11140785Abstract: A flexible printed circuit board includes a base layer and a pattern line. At least one communication hole penetrating opposite surfaces of the base layer. The pattern line includes two conductive circuit layers formed on the opposite surfaces of the base layer. At least one conductive pole are formed in the at least one communication hole and electrically connects the two conductive circuit layers. A gap being is formed between the conductive pole and the base layer.Type: GrantFiled: December 11, 2019Date of Patent: October 5, 2021Assignees: HongQiSheng Precision Electronics (QinHuangDao) Co., Ltd., Avary Holding (Shenzhen) Co., Limited.Inventors: Xian-Qin Hu, Cheng-Jia Li
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Publication number: 20210256566Abstract: The present disclosure discloses a media information presentation method performed at a computer server communicatively connected to a plurality of terminals associated with a social networking platform. The method includes: receiving a plurality of media information operation messages, each message indicating an operation performed on a piece of advertisement by one of a first group of users; deriving a second group of users that are direct connections of the first group of users; collecting, from the media information operation messages, statistics on operation statistical data of the second group of users; and receiving a media information obtaining request from a respective user of the second group of users at a terminal; in response to the request, identifying a plurality of pieces of advertisement corresponding to the respective user; sorting them according to their corresponding operation weights; and returning, to the terminal, top L pieces of advertisement in the descending order.Type: ApplicationFiled: May 6, 2021Publication date: August 19, 2021Inventors: Mengting JIANG, Zhendong Tang, Qin Hu
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Publication number: 20210235590Abstract: The disclosure provides a method for manufacturing a circuit board, which includes: (1) providing a substrate, forming a through hole in the substrate; (2) filling the through hole with a conductor to form a conductive hole; (3) providing a peelable film to cover the substrate; (4) forming a groove by laser, the groove including a concave portion; (5) performing a surface treatment on a wall of the groove; (6) removing the peelable film; (7) forming a seed layer; (8) making a circuit layer to obtain a circuit board unit, the circuit layer including a connection pad, the connection pad shaped as a conductive protrusion which surrounds and is electrically connected to the conductor; (9) repeating step (1) to step (8) at least once; and (10) laminating the circuit board units. The disclosure also provides a circuit board.Type: ApplicationFiled: April 23, 2019Publication date: July 29, 2021Inventors: MING-JAAN HO, XIAN-QIN HU, FU-YUN SHEN, HSIAO-TING HSU, YONG-CHAO WEI
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Patent number: 11030656Abstract: The present disclosure discloses a media information presentation method performed at a computer server that is communicatively connected to a plurality of terminals. The server receives at least one media information operation message; determines a first user and media information corresponding to each media information operation message, and an operation performed by the first user on the media information, to generate log data; obtains a social relationship chain of each first user included in the log data; collects statistics on operation statistical data of the second user according to the log data; and receives a media information obtaining request of a third user. The server then selects, when operation statistical data of the third user is found from the operation statistical data of the second user, at least one piece of media information from the operation statistical data of the third user, and returns it to the second user.Type: GrantFiled: July 9, 2018Date of Patent: June 8, 2021Assignee: TENCENT TECHNOLOGY (SHENZHEN) COMPANY LIMITEDInventors: Mengting Jiang, Zhendong Tang, Qin Hu
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Publication number: 20210119222Abstract: A flexible battery assembly includes a positive plate, a first filling film, a separator, a second filling film, and a negative plate stacked in order. The positive plate includes a first insulating layer, spaced first current collectors, and a positive electrode active layer. The negative plate includes a second insulating layer, spaced second current collectors, and a negative electrode active layer. Each first current collector corresponds to one second current collector. The first filling film comprises first openings each corresponding to one first current collector, and the first current collectors are embedded in the first openings. The second filling film comprises second openings each corresponding to one second current collector, and the second current collectors are embedded in the second openings. An electrolyte is sealed in the first openings and the second openings. A method for manufacturing such flexible battery assembly is also disclosed.Type: ApplicationFiled: December 2, 2019Publication date: April 22, 2021Inventors: XIAN-QIN HU, HSIAO-TING HSU
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Publication number: 20210059058Abstract: A multilayer circuit board includes a first connecting wiring board comprising a first bonding layer and a liquid crystal polymer formed on the first bonding layer. The first bonding layer comprises a first insulating filler. A fusion temperature of the first bonding layer is less than a fusion temperature of the liquid crystal polymer. The multilayer circuit board further includes a first wiring board and a second wiring board disposed on opposite sides of the first connecting wiring board. The first wiring board is combined with the first bonding layer. A method for manufacturing such multilayer circuit board is also provided.Type: ApplicationFiled: September 26, 2019Publication date: February 25, 2021Inventors: HSIAO-TING HSU, MING-JAAN HO, XIAN-QIN HU, FU-YUN SHEN, WEN-ZHU WEI
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Publication number: 20210041333Abstract: A manufacturing method for mass production for a tissue or cell microarray, which is characterized in comprising: using a molding device to mold tissue particles, cultivated cells or collected exfoliated cells (such as exfoliated cells from pleural effusion and ascites), forming the tissue particles from blended fresh tissue, tissue fixed by formalin or another solvent (such as alcohol and so on) or a tissue block embedded in paraffin (blended by a tissue blender), implanting the molded tissue or cells cores in a receptor wax or adhering the molded tissue or cells cores onto a metal plate, and then slicing to obtain a tissue or cell microarray.Type: ApplicationFiled: October 23, 2020Publication date: February 11, 2021Inventors: Yingyong HOU, Chen XU, Dongxian JIANG, Qi SONG, Haixing WANG, Yalan LIU, Jie HUANG, Lingli CHEN, Rongkui LUO, Qin HU, Yuan JI, Shaohua LU, Jun HOU, Lijuan LUAN, Jieakesu SU
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Patent number: 10791625Abstract: A method for manufacturing a flexible printed circuit board, comprising: providing a flexible printed circuit substrate; defining first through holes and second through holes through the flexible printed circuit substrate; and forming first conductive pillars and second conductive pillars; and defining first grooves by removing a portion of each first conductive pillar and defining second grooves by removing a portion of each second conductive pillar; the first grooves and the second grooves are defined from an outer surface of the flexible printed circuit board on the second conductive pattern layer side to a surface of the second conductive pattern layer away from the first conductive pattern layer; each of the first grooves is aligned with and corresponds to one first conductive pillar, and each of the second grooves is aligned with and corresponds to one second conductive pillar.Type: GrantFiled: April 23, 2019Date of Patent: September 29, 2020Assignees: Avary Holding (Shenzhen) Co., Limited, HongQiSheng Precision Electronics (QinHuangDao) Co.,Ltd.Inventors: Xian-Qin Hu, Ming-Jaan Ho
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Publication number: 20200236783Abstract: A method for manufacturing the circuit board comprises following steps of forming a silver layer on each of two opposite surfaces of an insulating substrate, and forming a copper layer on each silver layer, thereby obtaining a middle structure; defining at least one through-hole on the middle structure, and each through-hole extending through each copper layer; forming a copper wiring layer on the copper layers to cover each through-hole and a portion region of the copper layers, the copper wiring layer comprising a copper conductive structure passing through each through-hole, the copper conductive structure connecting the copper layers; removing the copper layers not covered by the copper wiring layer; and etching the silver layers to form a silver wiring layer corresponding to the copper wiring layer, wherein a first etching liquid, which does not etch the copper wiring layer, is used for etching the silver layers.Type: ApplicationFiled: April 8, 2020Publication date: July 23, 2020Inventors: XIAN-QIN HU, MEI YANG, JUN DAI
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Patent number: 10681824Abstract: A method for manufacturing a waterproof circuit board comprises steps of providing a first wiring substrate suitable for high-frequency transmissions. The first wiring substrate includes a first copper layer and a first conductive wiring layer. A waterproof layer is formed on exposed surfaces of the first wiring substrate. A second wiring substrate suitable for low-frequency transmissions defines a receiving groove. The second wiring substrate includes a second copper layer and defines a first blind hole. The first wiring substrate is pressed in the receiving groove. A first conductive portion is formed in the first blind hole to electrically connect the first conductive wiring layer and the second copper layer.Type: GrantFiled: December 6, 2019Date of Patent: June 9, 2020Assignees: HongQiSheng Precision Electronics (QinHuangDao) Co., Ltd., Avary Holding (Shenzhen) Co., Limited.Inventors: Jian-Yi Hao, Yan-Lu Li, Xian-Qin Hu, Ming-Hua Du
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Patent number: 10660218Abstract: A multilayer circuit board comprises an inner circuit unit having at least one solder portion, and at least one outer circuit board coupled with the inner circuit unit. The inner circuit unit connects with the outer circuit board by an insulation colloid. At least one side of the inner circuit unit does not extend to edges of the multilayer circuit board. The at least one outer circuit board forms at least one through-hole and at least one conductive hole. The at least one conductive hole which is internally-plated with copper extends from the at least one outer circuit board to the inner circuit unit. A method of manufacturing the multilayer circuit board is also disclosed.Type: GrantFiled: April 19, 2018Date of Patent: May 19, 2020Assignees: HongQiSheng Precision Electronics (QinHuangDao) Co., Ltd., Avary Holding (Shenzhen) Co., Limited.Inventors: Xian-Qin Hu, Li-Kun Liu, Yan-Lu Li, Ming-Jaan Ho
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Patent number: 10653011Abstract: A method for manufacturing the circuit board comprises following steps of providing an insulating substrate, and defining at least one through-hole on the insulating substrate to extending through two opposite surfaces of the insulating substrate; forming a silver layer on each of the two opposite surfaces, and forming a silver conductive structure in each through-hole connecting the silver layers; forming a copper wiring layer on the silver layers to cover each silver conductive structure and a portion region of the silver layers; and etching the silver layers to form a silver wiring layer corresponding to the copper wiring layer, wherein a first etching liquid, which does not etch the copper wiring layer, is used for etching the silver layers.Type: GrantFiled: November 17, 2017Date of Patent: May 12, 2020Assignees: HongQiSheng Precision Electronics (QinHuangDao) Co., Ltd., Avary Holding (Shenzhen) Co., Limited.Inventors: Xian-Qin Hu, Mei Yang, Jun Dai
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Patent number: 10653015Abstract: A multilayer circuit board comprises an inner circuit unit having at least one solder portion, and at least one outer circuit board coupled with the inner circuit unit. The inner circuit unit connects with the outer circuit board by an insulation colloid. At least one side of the inner circuit unit does not extend to edges of the multilayer circuit board. The at least one outer circuit board forms at least one through-hole and at least one conductive hole. The at least one conductive hole which is internally-plated with copper extends from the at least one outer circuit board to the inner circuit unit. A method of manufacturing the multilayer circuit board is also disclosed.Type: GrantFiled: January 23, 2019Date of Patent: May 12, 2020Assignees: HongQiSheng Precision Electronics (QinHuangDao) Co., Ltd., Avary Holding (Shenzhen) Co., Limited.Inventors: Xian-Qin Hu, Li-Kun Liu, Yan-Lu Li, Ming-Jaan Ho