Patents by Inventor Qing Lei

Qing Lei has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 7564689
    Abstract: A clip (100) includes a body (10), a handle (30) and a movable fastener (20). The body has a first end terminating in a supporting portion (16) and a second end terminating in a latching leg (14). The handle has a cam portion (32) supported on the supporting portion and a pivot axis (36) provided on the cam portion. The movable fastener extends through the supporting portion and pivotally couples to the cam portion. The movable fastener defines a slot (22) therein, and the slot starts from an entrance defined in an outer edge at a side of the movable fastener and extends in the movable fastener. The cam portion is pivotally connected to the movable fastener via the pivot axis sliding into the slot from the entrance. The handle is turnable relative to the movable fastener between a locked position and a relaxed position.
    Type: Grant
    Filed: May 5, 2008
    Date of Patent: July 21, 2009
    Assignees: Fu Zhun Precision Industry (Shen Zhen) Co., Ltd., Foxconn Technology Co., Ltd.
    Inventors: Qing-Lei Guo, Shou-Li Zhu, Ming Yang, Jun Tong
  • Publication number: 20090166006
    Abstract: A heat dissipation device (100) includes a base (300), a heat sink (200) and a heat pipe (400). The base (300) includes a bottom surface (320) for thermally contacting with a heat-generating component, a top surface (340) and two sloped side surfaces (360) spanning between the top surface (340) and the bottom surface (320). The heat sink (200) includes a plurality of fins perpendicularly attached on the sloped side surfaces (360) of the base (300) with a channel defined between the top surface (340) of the base (300) and the heat sink (200). The heat pipe (400) includes an evaporator (420) received in the channel defined by the top surface (340) of the base (300) and the heat sink (200) and a condenser (440) being inserted into the heat sink (200) above the evaporator (420).
    Type: Application
    Filed: December 27, 2007
    Publication date: July 2, 2009
    Applicants: FU ZHUN PRECISION INDUSTRY (SHEN ZHEN) CO., LTD., FOXCONN TECHNOLOGY CO., LTD.
    Inventors: QING-LEI GUO, SHOU-LI ZHU
  • Publication number: 20090161315
    Abstract: A heat dissipating apparatus includes a heat spreader (20) for thermally connecting with a heat generating electronic component, a heat sink (10) thermally connected with the heat spreader, and a heat pipe (30) thermally connecting the heat sink with the heat spreader for transferring heat from the heat spreader to the heat sink. The heat pipe includes an evaporation section (31) attached to the heat spreader, two semicircular condensation sections (33, 34) thermally engaging with the heat sink, and two connecting sections (35, 36) each interconnecting a corresponding condensation section and the evaporation section.
    Type: Application
    Filed: December 19, 2007
    Publication date: June 25, 2009
    Applicants: FU ZHUN PRECISION INDUSTRY (SHEN ZHEN) CO., LTD., FOXCONN TECHNOLOGY CO., LTD.
    Inventors: QING-LEI GUO, SHOU-LI ZHU, MING YANG
  • Publication number: 20090154108
    Abstract: A clip (50) for securing a heat dissipating device to a heat source comprises a spring arm (510) and an ear (530). The spring arm comprises two wires (512) substantially parallel to each other, a hook (514) formed at one end of the spring arm to connect ends of the wires and two barbs (516) each formed at another end of each of the wires. A central portion of each of the wires projects downwardly. The ear comprises a main body (530a), two notches (532) in an upside of the main body and a clamping unit (537) at a downside of the main body. Each of the notches comprises from above to below an insertion slot (5321), an elongated sliding slot (5323) and a retaining slot (5325). The spring arm engages with the ear with the barbs extending into the insertion slots, and the wires are slideable downwardly along the sliding slots to be fixed in the retaining slots.
    Type: Application
    Filed: December 18, 2007
    Publication date: June 18, 2009
    Applicants: HONG FU JIN PRECISION INDUSTRY (ShenZhen) CO., LTD., HON HAI PRECISION INDUSTRY CO., LTD.
    Inventors: QING-LEI GUO, SHOU-LI ZHU, MING YANG
  • Patent number: 5385651
    Abstract: A method for the digital electrochemical etching of compound semiconductors in an electrochemical flow cell system in which alternating electrochemical potentials are applied between a reference electrode and the compound semiconductor sufficient to strip portions, preferably atomic layers, of the elements of compound semiconductors from the compound semiconductors.
    Type: Grant
    Filed: May 28, 1993
    Date of Patent: January 31, 1995
    Assignee: University of Georgia Research Foundation
    Inventors: John L. Stickney, Qing Lei, Choong K. Rhee