Abstract: Methods of forming a p-channel MOS device in silicon carbide include forming an n-type well in a silicon carbide layer, and implanting p-type dopant ions to form a p-type region in the n-type well at a surface of the silicon carbide layer and at least partially defining a channel region in the n-type well adjacent the p-type region. A threshold adjustment region is formed in the channel region. The implanted ions are annealed in an inert atmosphere at a temperature greater than 1650° C. A gate oxide layer is formed on the channel region, and a gate is formed on the gate oxide layer. A silicon carbide-based transistor includes a silicon carbide layer, an n-type well in the silicon carbide layer, and a p-type region in the n-type well at a surface of the silicon carbide layer and at least partially defining a channel region in the n-type well adjacent the p-type region.

Abstract: A silicon carbide-based device contact and contact fabrication method employ a layer of poly-silicon on a SiC substrate, with the contact's metal layer deposited on top of the poly-silicon. Both Schottky and ohmic contacts can be formed. The poly-silicon layer can be continuous or patterned, and can be undoped or doped to be n-type or p-type. The present contact and method provide excellent contact adhesion, and can be employed with a number of different device types, to provide electrical contacts for Schottky diodes, pn diodes, and transistors, for example.

Abstract: A semiconductor device includes a drift layer of a first conductivity type having a doping concentration and a conduction layer also of the first conductivity type on the drift layer that has a doping concentration greater than the doping concentration of the drift layer. The device also includes a pair of trench structures, each including a trench contact at one end and a region of a second conductivity type opposite the first conductivity type, at another end. Each trench structure extends into and terminates within the conduction layer such that the second-conductivity-type region is within the conduction layer. A first contact structure is on the drift layer opposite the conduction layer while a second contact structure is on the conduction layer.

Abstract: A silicon carbide-based device contact and contact fabrication method employ a layer of poly-silicon on a SiC substrate, with the contact's metal layer deposited on top of the poly-silicon. Both Schottky and ohmic contacts can be formed. The poly-silicon layer can be continuous or patterned, and can be undoped or doped to be n-type or p-type. The present contact and method provide excellent contact adhesion, and can be employed with a number of different device types, to provide electrical contacts for Schottky diodes, pn diodes, and transistors, for example.

Abstract: The present invention relates to a pharmaceutical composition with low toxicity for anti-inflammatory and anti-exudative which contains as active ingredients escin with general formula I and escin with general formula II as well as pharmaceutically acceptable carrier or excipient. In comparison with ESCIN, this pharmaceutical composition possesses the same anti-inflammatory and anti-exudative activity, but both toxicity and irritation lower remarkably.