Patents by Inventor Qinglong Zeng

Qinglong Zeng has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20240116949
    Abstract: Provided is a compound of formula I or a pharmaceutically acceptable salt, enantiomer, diastereomer, tautomer, solvate, isotopic substituent, polymorph, prodrug, or metabolite thereof. Also provided is a method for preparing the compound of formula I. The compound of formula I has higher inhibitory activity against SHP2, and thus can be used to prevent or treat a disease related to SHP2.
    Type: Application
    Filed: May 11, 2023
    Publication date: April 11, 2024
    Inventors: Qiangang Zheng, Ming Xu, Qinglong Zeng, Jing Li, Hao Zhuge
  • Publication number: 20230388261
    Abstract: Systems and method for determining a topic cohesion measurement between a content item and a hyperlinked landing page are presented. In one embodiment, a plurality of content item signals is generated for the content item and a corresponding plurality of signals are generated for the hyperlinked landing page. An analysis of the corresponding signals is conducted to determine a measurement of topic cohesion, a topic cohesion score, between the content item and the hyperlinked landing page. A cohesion predictor model is trained to generate the predictive topic cohesion score between an input content item and a hyperlinked landing page. Upon a determination that the topic cohesion score is less than a predetermined threshold, remedial actions are taken regarding the hyperlink of the content item. Alternatively, positive actions may be carried out, including promoting the content item to others, associating advertisements with the content item, and the like.
    Type: Application
    Filed: April 18, 2023
    Publication date: November 30, 2023
    Applicant: Pinterest, Inc.
    Inventors: Andrey Dmitriyevich Gusev, Wenke Zhang, Hsiao-Ching Chang, Qinglong Zeng, Peter John Daoud, Jun Liu, Grace Chin, Zhuoyuan Li, Jacob Franklin Hanger, Vincent Bannister
  • Patent number: 11685748
    Abstract: Provided is a compound of formula I or a pharmaceutically acceptable salt, enantiomer, diastereomer, tautomer, solvate, isotopic substituent, polymorph, prodrug, or metabolite thereof. Also provided is a method for preparing the compound of formula I. The compound of formula I has higher inhibitory activity against SHP2, and thus can be used to prevent or treat a disease related to SHP2.
    Type: Grant
    Filed: September 8, 2020
    Date of Patent: June 27, 2023
    Assignee: ETERN BIOPHARMA (SHANGHAI) CO., LTD.
    Inventors: Qiangang Zheng, Ming Xu, Qinglong Zeng, Jing Li, Hao Zhuge
  • Patent number: 11665121
    Abstract: Systems and method for determining a topic cohesion measurement between a content item and a hyperlinked landing page are presented. In one embodiment, a plurality of content item signals is generated for the content item and a corresponding plurality of signals are generated for the hyperlinked landing page. An analysis of the corresponding signals is conducted to determine a measurement of topic cohesion, a topic cohesion score, between the content item and the hyperlinked landing page. A cohesion predictor model is trained to generate the predictive topic cohesion score between an input content item and a hyperlinked landing page. Upon a determination that the topic cohesion score is less than a predetermined threshold, remedial actions are taken regarding the hyperlink of the content item. Alternatively, positive actions may be carried out, including promoting the content item to others, associating advertisements with the content item, and the like.
    Type: Grant
    Filed: January 19, 2022
    Date of Patent: May 30, 2023
    Assignee: Pinterest, Inc.
    Inventors: Andrey Dmitriyevich Gusev, Wenke Zhang, Hsiao-Ching Chang, Qinglong Zeng, Peter John Daoud, Jun Liu, Grace Chin, Zhuoyuan Li, Jacob Franklin Hanger, Vincent Bannister
  • Patent number: 11471967
    Abstract: A fixation apparatus includes a base, a wire fixing device mounted on the base, and a pressing device mounted on the base. The wire fixing device positions and fixes a wire on a circuit board and includes a fixing frame mounted on the base and a moving unit received in a receiving chamber of the fixing frame. The fixing frame has a first positioning groove. The moving unit is movable between a clamping position and a release position and has a second positioning groove coupled with the first positioning groove. The wire is inserted into a wire insertion hole in the circuit board between the first positioning groove and the second positioning groove when the mobile unit is moved to the release position. The wire is clamped and fixed between the first positioning groove and the second positioning groove when the moving unit is moved to the clamping position.
    Type: Grant
    Filed: December 13, 2019
    Date of Patent: October 18, 2022
    Assignees: Tyco Electronics (Shanghai) Co. Ltd., Measurement Sepcialties (China) Ltd., Shenzhen Ami Technology Co. Ltd.
    Inventors: Yingcong Deng, Jeffrey Rochette, Qiyu Cai, Yang Zhou, Wenzhao Liao, Yumin Lan, Yanbing Fu, Yun Liu, Dandan Zhang, Qinglong Zeng
  • Patent number: 11382250
    Abstract: A positioning device that has a support table, two pairs of sliding blocks slidably mounted in the support table, a positioning plate extending vertically at the top of each sliding block, a base on which the support table is supported, a cylinder in the base, a ball in the cylinder, a piston rod slidably mounted in the cylinder and pushing the ball to move upward in a vertical direction, so that the ball drives the two pairs of sliding blocks to move away from each other in the first horizontal direction and the second horizontal direction, respectively, until the positioning plates of the two pairs of sliding blocks abut against four inner walls of the opening of the circuit board, respectively, to allow the electronic device to be received in a positioning slot defined by the positioning plates, and a release mechanism that drives the piston rod to move downward in the vertical direction to allow the two pairs of sliding blocks to be moved toward each other in the first horizontal direction and the second
    Type: Grant
    Filed: October 24, 2018
    Date of Patent: July 5, 2022
    Assignees: Tyco Electronics (Shanghai) Co., Ltd., TE Connectivity Corporation, Shenzhen AMI Technology Co., Ltd, Measurement Specialities (China) Ltd.
    Inventors: Zhiyong Dai, Dandan Zhang, Roberto Francisco-Yi Lu, Songping Chen, Xiangyou Hou, Qinglong Zeng, Lvhai Hu, Yun Liu, Changjun Wang
  • Patent number: 11351622
    Abstract: A laser soldering system is disclosed. The laser soldering system has a moving system, a gripper mounted on the moving system, a presser mounted on the moving system and having a transparent member, and a laser. The gripper grips an object and places the object at a target location on a product to be soldered. The transparent member presses the object against the product. The laser emits a laser beam through the transparent member to solder the object to the target location while the object is pressed against the product.
    Type: Grant
    Filed: August 11, 2016
    Date of Patent: June 7, 2022
    Assignees: TE Connectivity Corporation, Tyco Electronics (Shanghai) Co. Ltd., Tyco Electronics (Dongguan) Co. Ltd
    Inventors: Hongzhou Shen, Dandan Zhang, Roberto Francisco-Yi Lu, George J. Dubniczki, Qinglong Zeng
  • Publication number: 20220150203
    Abstract: Systems and method for determining a topic cohesion measurement between a content item and a hyperlinked landing page are presented. In one embodiment, a plurality of content item signals is generated for the content item and a corresponding plurality of signals are generated for the hyperlinked landing page. An analysis of the corresponding signals is conducted to determine a measurement of topic cohesion, a topic cohesion score, between the content item and the hyperlinked landing page. A cohesion predictor model is trained to generate the predictive topic cohesion score between an input content item and a hyperlinked landing page. Upon a determination that the topic cohesion score is less than a predetermined threshold, remedial actions are taken regarding the hyperlink of the content item. Alternatively, positive actions may be carried out, including promoting the content item to others, associating advertisements with the content item, and the like.
    Type: Application
    Filed: January 19, 2022
    Publication date: May 12, 2022
    Inventors: Andrey Dmitriyevich Gusev, Wenke Zhang, Hsiao-Ching Chang, Qinglong Zeng, Peter John Daoud, Jun Liu, Grace Chin, Zhuoyuan Li, Jacob Franklin Hanger, Vincent Bannister
  • Patent number: 11260540
    Abstract: An automatic pick-up equipment adapted to pick up components having different shapes includes a base mounted on a manipulator of a robot, a first pick-up device mounted on the base and including a pair of first gripping mechanisms opposite to each other, and a second pick-up device mounted on the base and including a pair of second gripping mechanisms opposite to each other and a rotation mechanism. The first gripping mechanisms are configured to linearly reciprocate relative to each other to grip a first component. The second gripping mechanisms are configured to pivotally reciprocate relative to each other to grip a second component. The rotation mechanism is configured to drive the second gripping mechanisms to rotate relative to the base to change a posture of the second component.
    Type: Grant
    Filed: September 30, 2019
    Date of Patent: March 1, 2022
    Assignees: Tyco Electronics (Shanghai) Co. Ltd., Shenzhen AMI Technology Co. Ltd.
    Inventors: Zhiyong Dai, Lvhai Hu, Yingcong Deng, Qinglong Zeng, Wei Kang
  • Patent number: 11233761
    Abstract: Systems and method for determining a topic cohesion measurement between a content item and a hyperlinked landing page are presented. In one embodiment, a plurality of content item signals is generated for the content item and a corresponding plurality of signals are generated for the hyperlinked landing page. An analysis of the corresponding signals is conducted to determine a measurement of topic cohesion, a topic cohesion score, between the content item and the hyperlinked landing page. A cohesion predictor model is trained to generate the predictive topic cohesion score between an input content item and a hyperlinked landing page. Upon a determination that the topic cohesion score is less than a predetermined threshold, remedial actions are taken regarding the hyperlink of the content item. Alternatively, positive actions may be carried out, including promoting the content item to others, associating advertisements with the content item, and the like.
    Type: Grant
    Filed: September 19, 2019
    Date of Patent: January 25, 2022
    Assignee: Pinterest, Inc.
    Inventors: Andrey Dmitriyevich Gusev, Wenke Zhang, Hsiao-Ching Chang, Qinglong Zeng, Peter John Daoud, Jun Liu, Grace Chin, Zhuoyuan Li, Jacob Franklin Hanger, Vincent Bannister
  • Patent number: 11160173
    Abstract: A fixing apparatus comprises a first fixing device and a second fixing device. The first fixing device is adapted to position and fix a circuit board having at least one pad. The first fixing device has a first positioning groove adapted to position the circuit board. The second fixing device is adapted to position and fix at least one wire. The second fixing device has at least one second positioning groove adapted to position the at least one wire. Each second positioning groove is aligned with a corresponding pad on the circuit board so that the wire in the second positioning groove is aligned with the corresponding pad on the circuit board.
    Type: Grant
    Filed: January 11, 2018
    Date of Patent: October 26, 2021
    Assignees: Tyco Electronics (Shanghai) Co. Ltd., Measurement Specialties (Chengdu) Ltd., TE Connectivity Services GmbH
    Inventors: Yingcong Deng, Lan Gong, Qian Ying, Dandan Zhang, Lvhai Hu, Yun Liu, Lin Ye, Yong Yan, Roberto Francisco-Yi Lu, Qinglong Zeng
  • Patent number: 11141807
    Abstract: A wire automatic soldering system includes a carrier adapted to load an electrical product to be soldered, a robot adapted to grip and move the carrier on which the electrical product is loaded, a solder paste container containing a solder paste, and a heater configured to heat the solder paste and melt the solder paste into a liquid. The robot moves a plurality of wires of the electrical product into the solder paste container to solder the wires together with the solder paste.
    Type: Grant
    Filed: November 15, 2019
    Date of Patent: October 12, 2021
    Assignees: Tyco Electronics (Shanghai) Co. Ltd., TE Connectivity Servies GmbH, Measurement Specialties (Chengdu) Ltd., Shenzhen AMI Technology Co, Ltd.
    Inventors: Fengchun Xie, Dandan Zhang, Roberto-Francisco Yi Lu, Lvhai Hu, Qinglong Zeng, Lan Gong, Qian Ying, Yingcong Deng, Yun Liu
  • Publication number: 20210238196
    Abstract: Provided are compounds having SHP2 inhibitory activity, preparation methods and use thereof. Specifically, provided are compounds of Formula I, or pharmaceutically acceptable salts thereof, or enantiomers, diastereoisomers, tautomers, solvates, isotope-substituted derivative, polymorphs, prodrugs or metabolites thereof, wherein the groups are as defined in the description. The compounds have high inhibitory acitivity against SHP2, and thus can be used for preventing or treating SHP2-related diseases.
    Type: Application
    Filed: September 8, 2020
    Publication date: August 5, 2021
    Inventors: Qiangang Zheng, Ming Xu, Qinglong Zeng, Jing Li, Hao Zhuge
  • Patent number: 11064614
    Abstract: A carrier includes a base on which a circuit board is mounted, a loading device mounted on the base, a first pressing device mounted on the base, and a second pressing device mounted on the base. The loading device is configured to load an electronic device on the base. The first pressing device is configured to press a first lead end protruding from the electronic device on the circuit board to electrically contact the circuit board. The second pressing device is configured to press a second lead end of the electronic device on the base.
    Type: Grant
    Filed: September 16, 2019
    Date of Patent: July 13, 2021
    Assignees: Tyco Electronics (Shanghai) Co. Ltd., TE Connectivity Corporation, Measurement Specialties (Chengdu) Ltd.
    Inventors: Fengchun Xie, Dandan Zhang, Roberto Francisco-Yi Lu, Lvhai Hu, Qinglong Zeng, Lan Gong, Qian Ying, Yingcong Deng, Yun Liu
  • Patent number: 11051408
    Abstract: A fixing device adapted to fix at least one needle-shaped member comprises a fixing base and a fixing mechanism. The fixing base has at least one positioning groove disposed at a front end of the fixing base. The needle-shaped member is adapted to be positioned in the positioning groove. The fixing mechanism has at least one pressing protrusion at a front end of the fixing mechanism. The pressing protrusion is adapted to press and hold the needle-shaped member in the positioning groove.
    Type: Grant
    Filed: January 11, 2018
    Date of Patent: June 29, 2021
    Assignees: Tyco Electronics (Shanghai) Co. Ltd. TE, Connectivity Corporation, Measurement Specialties (Chengdu) Ltd.
    Inventors: Yingcong Deng, Lan Gong, Qian Ying, Dandan Zhang, Lvhai Hu, Yun Liu, Qinglong Zeng, Yong Yan, Roberto Francisco-Yi Lu
  • Patent number: 11000956
    Abstract: A gripping system includes a gripping device and a pitch adjustment device. The gripping device has a row of grippers arranged in a first direction and adapted to grip a row of contacts and a support frame on which at least two adjacent grippers of the row of grippers are slidably attached. The pitch adjustment device is adapted to drive the at least two adjacent grippers to slide in the first direction to adjust a pitch between the two adjacent grippers.
    Type: Grant
    Filed: August 28, 2019
    Date of Patent: May 11, 2021
    Assignees: Tyco Electronics (Shanghai) Co. Ltd., Shenzhen AMI Technology Co. Ltd.
    Inventors: Zhiyong Dai, Lvhai Hu, Yun Liu, Qinglong Zeng, Wei Kang
  • Patent number: 11000912
    Abstract: An automatic solder paste feeding system, comprising: a base, a container mounted on the base and configured to contain a solder paste therein, a syringe mounted on the base and configured to inject the solder paste into the container, and a heater mounted on the base and configured to heat the solder paste contained in the container, so that the solder paste is melted into liquid state.
    Type: Grant
    Filed: August 6, 2019
    Date of Patent: May 11, 2021
    Assignees: Tyco Electronics (Shanghai) Co. Ltd., TE Connectivity Corporation, Measurement Specialties (Chengdu) Ltd., Shenzhen AMI Technology Co. Ltd.
    Inventors: Fengchun Xie, Dandan Zhang, Roberto Francisco-Yi Lu, Lvhai Hu, Qinglong Zeng, Lan Gong, Qian Ying, Yingcong Deng, Yun Liu
  • Patent number: 10999961
    Abstract: A positioning device including a support tab, two pairs of sliding blocks slidably mounted in the support table, a positioning plate extending vertically from on a top of each sliding block, a base on which the support table is supported, a cylinder installed in a chamber of the base, a ball received in the cylinder, a piston rod slidably mounted in the cylinder that pushes the ball to move upward in a vertical direction, so that the ball drives the two pairs of sliding blocks to move away from each other in the first horizontal direction and the second horizontal direction, respectively, until the positioning plates of the two pairs of sliding blocks abut against four inner walls of the opening of the circuit board, respectively, to allow the electronic device to be received in a positioning slot defined by the positioning plates, and a release mechanism.
    Type: Grant
    Filed: October 24, 2018
    Date of Patent: May 4, 2021
    Assignees: Tyco Electronics (Shanghai) Co. Ltd., TE Connectivity Corporation, Measurement Specialties (China) Ltd., Shenzhen AMI Technology Co., Ltd.
    Inventors: Zhiyong Dai, Dandan Zhang, Roberto Francisco-Yi Lu, Songping Chen, Xiangyou Hou, Qinglong Zeng, Lvhai Hu, Yun Liu
  • Patent number: 10933460
    Abstract: A wire processing apparatus comprises a frame, a clamping device mounted on the frame and adapted to clamp a wire to be processed, and a straightening and cutting device mounted on the frame. The straightening and cutting device is adapted to press a conductor of the wire into a straight shape and cut the conductor to a predetermined length after pressing.
    Type: Grant
    Filed: July 3, 2018
    Date of Patent: March 2, 2021
    Assignees: Tyco Electronics (Shanghai) Co. Ltd., TE Connectivity Corporation, Measurement Specialties (Chengdu) Ltd, Shenzhen AMI Technology Co., Ltd.
    Inventors: Yingcong Deng, Lan Gong, Qian Ying, Dandan Zhang, Lvhai Hu, Yun Liu, Qinglong Zeng, Yong Yan, Roberto Francisco-Yi Lu
  • Patent number: 10844079
    Abstract: Provided is a compound of formula I or a pharmaceutically acceptable salt, enantiomer, diastereomer, tautomer, solvate, isotopic substituent, polymorph, prodrug, or metabolite thereof. Also provided is a method for preparing the compound of formula I. The compound of formula I has higher inhibitory activity against SHP2, and thus can be used to prevent or treat a disease related to SHP2.
    Type: Grant
    Filed: June 22, 2020
    Date of Patent: November 24, 2020
    Assignee: Etern Biopharma (Shanghai) Co., Ltd.
    Inventors: Qiangang Zheng, Ming Xu, Qinglong Zeng, Jing Li, Hao Zhuge