Patents by Inventor Qinglong Zeng

Qinglong Zeng has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 10933460
    Abstract: A wire processing apparatus comprises a frame, a clamping device mounted on the frame and adapted to clamp a wire to be processed, and a straightening and cutting device mounted on the frame. The straightening and cutting device is adapted to press a conductor of the wire into a straight shape and cut the conductor to a predetermined length after pressing.
    Type: Grant
    Filed: July 3, 2018
    Date of Patent: March 2, 2021
    Assignees: Tyco Electronics (Shanghai) Co. Ltd., TE Connectivity Corporation, Measurement Specialties (Chengdu) Ltd, Shenzhen AMI Technology Co., Ltd.
    Inventors: Yingcong Deng, Lan Gong, Qian Ying, Dandan Zhang, Lvhai Hu, Yun Liu, Qinglong Zeng, Yong Yan, Roberto Francisco-Yi Lu
  • Patent number: 10844079
    Abstract: Provided is a compound of formula I or a pharmaceutically acceptable salt, enantiomer, diastereomer, tautomer, solvate, isotopic substituent, polymorph, prodrug, or metabolite thereof. Also provided is a method for preparing the compound of formula I. The compound of formula I has higher inhibitory activity against SHP2, and thus can be used to prevent or treat a disease related to SHP2.
    Type: Grant
    Filed: June 22, 2020
    Date of Patent: November 24, 2020
    Assignee: Etern Biopharma (Shanghai) Co., Ltd.
    Inventors: Qiangang Zheng, Ming Xu, Qinglong Zeng, Jing Li, Hao Zhuge
  • Patent number: 10816731
    Abstract: An automatic fiber stripping system comprises a first stripping module, a second stripping module, and a heating device. The first stripping module and the second stripping module each have a stripping belt, a driven belt wheel, a driving belt wheel, and a stripping tool including a pressing portion. The stripping belts are tightened on the pressing portions and the stripping tools press the stripping belts on each of two opposite sides of an optical cable. A blade portion of one of the stripping tools cuts a notch in at least one of two side edges of an outer coating layer of the optical cable. The heating device heats and softens the outer coating layer of the optical cable. The stripping belts are driven to move relative to the optical cable by the driving belt wheels so as to strip off a segment of the outer coating layer from the notch.
    Type: Grant
    Filed: February 15, 2018
    Date of Patent: October 27, 2020
    Assignees: Tyco Electronics (Shanghai) Co. Ltd., TE Connectivity Corporation, Shenzhen AMI Technology Co. Ltd.
    Inventors: Fengchun Xie, Qinglong Zeng, Yu Zhang, Dandan Zhang, Lvhai Hu, Roberto Francisco-Yi Lu
  • Patent number: 10807178
    Abstract: A fixing apparatus comprises a first fixing device and a second fixing device. The first fixing device has at least one first positioning groove adapted to position at least one first elongated member and fixes the at least one first elongated member. The second fixing device has at least one second positioning groove adapted to position at least one second elongated member and fixes the at least one second elongated member. Each first positioning groove is aligned with a corresponding second positioning groove so that the first elongated member fixed in the first positioning groove is axially aligned with the second elongated member fixed in the corresponding second positioning groove.
    Type: Grant
    Filed: January 11, 2018
    Date of Patent: October 20, 2020
    Assignees: Tyco Electronics (Shanghai) Co. Ltd., TE Connectivity Corporation, Measurement Specialties (Chengdu) Ltd.
    Inventors: Yingcong Deng, Lan Gong, Qian Ying, Dandan Zhang, Lvhai Hu, Yun Liu, Lin Ye, Yong Yan, Roberto Francisco-Yi Lu, Qinglong Zeng
  • Publication number: 20200317695
    Abstract: Provided is a compound of formula I or a pharmaceutically acceptable salt, enantiomer, diastereomer, tautomer, solvate, isotopic substituent, polymorph, prodrug, or metabolite thereof. Also provided is a method for preparing the compound of formula I. The compound of formula I has higher inhibitory activity against SHP2, and thus can be used to prevent or treat a disease related to SHP2.
    Type: Application
    Filed: June 22, 2020
    Publication date: October 8, 2020
    Inventors: Qiangang Zheng, Ming Xu, Qinglong Zeng, Jing Li, Hao Zhuge
  • Patent number: 10773341
    Abstract: A welding system for welding a first elongated element and a second elongated element together by a laser beam that is emitted from a laser welding head after the ideal welding center point of the aligned first and second elongated elements has been positioned at a focal point of the laser beam that is emitted from the laser welding head.
    Type: Grant
    Filed: June 1, 2017
    Date of Patent: September 15, 2020
    Assignees: Tyco Electronics (Shanghai) Co., Ltd., Measurement Specialities (Chengdai) Ltd, TE Connectivity Corporation, Shenzhen AMI Technology Co., Ltd.
    Inventors: Yingcong Deng, Lan Gong, Qian Ying, Dandan Zhang, Lvhai Hu, Yun Liu, Qinglong Zeng, Yong Yan, Roberto Francisco-Yi Lu
  • Patent number: 10658807
    Abstract: A terminal bending tool comprises a plate, a plurality of receiving grooves, and a plurality of rollers. The plate extends in a first horizontal direction. The receiving grooves are disposed in the plate in a row along the first horizontal direction. The rollers are pivotally mounted in the receiving grooves. A terminal is received and positioned in a first receiving groove and is in contact with an outer circumferential surface of a first roller. When the terminal bending tool is moved in a vertical direction perpendicular to the first horizontal direction, the first roller rotates and moves along a surface of the terminal while pressing and bending the terminal.
    Type: Grant
    Filed: May 26, 2017
    Date of Patent: May 19, 2020
    Assignees: Tyco Electronics (Shanghai) Co. Ltd., Shenzhen AMI Technology Co., Ltd.
    Inventors: Zhiyong Dai, Lvhai Hu, Yingcong Deng, Lei Zhou, Yun Liu, Qinglong Zeng, Wei Kang
  • Publication number: 20200114447
    Abstract: A fixation apparatus includes a base, a wire fixing device mounted on the base, and a pressing device mounted on the base. The wire fixing device positions and fixes a wire on a circuit board and includes a fixing frame mounted on the base and a moving unit received in a receiving chamber of the fixing frame. The fixing frame has a first positioning groove. The moving unit is movable between a clamping position and a release position and has a second positioning groove coupled with the first positioning groove. The wire is inserted into a wire insertion hole in the circuit board between the first positioning groove and the second positioning groove when the mobile unit is moved to the release position. The wire is clamped and fixed between the first positioning groove and the second positioning groove when the moving unit is moved to the clamping position.
    Type: Application
    Filed: December 13, 2019
    Publication date: April 16, 2020
    Applicants: Tyco Electronics (Shanghai) Co. Ltd., Measurement Specialties (China) Ltd., Shenzhen AMI Technology Co., Ltd.
    Inventors: Yingcong Deng, Jeffrey Rochette, Qiyu Cai, Yang Zhou, Wenzhao Liao, Yumin Lan, Yanbing Fu, Yun Liu, Dandan Zhang, Qinglong Zeng
  • Publication number: 20200094339
    Abstract: A wire automatic soldering system includes a carrier adapted to load an electrical product to be soldered, a robot adapted to grip and move the carrier on which the electrical product is loaded, a solder paste container containing a solder paste, and a heater configured to heat the solder paste and melt the solder paste into a liquid. The robot moves a plurality of wires of the electrical product into the solder paste container to solder the wires together with the solder paste.
    Type: Application
    Filed: November 15, 2019
    Publication date: March 26, 2020
    Applicants: Tyco Electronics (Shanghai) Co. Ltd., TE Connectivity Services GmbH, Measurement Specialties (Chengdu) Ltd., Shenzhen AMI Technology Co., Ltd.
    Inventors: Fengchun Xie, Dandan Zhang, Roberto-Francisco Yi Lu, Lvhai Hu, Qinglong Zeng, Lan Gong, Qian Ying, Yingcong Deng, Yun Liu
  • Publication number: 20200091692
    Abstract: An assembly system includes a feeding mechanism configured to feed a heat shrinkable tube, a cutting mechanism adapted to cut off a segment of heat shrinkable tube from the heat shrinkable tube, a robot adapted to grip the segment of heat shrinkable tube, and a vision system adapted to visually guide the robot to assemble the segment of heat shrinkable tube onto a wire of an electrical product.
    Type: Application
    Filed: November 18, 2019
    Publication date: March 19, 2020
    Applicants: Tyco Electronics (Shanghai) Co. Ltd., TE Connectivity Services GmbH, Measurement Specialties (Chengdu) Ltd., Shenzhen AMI Technology Co., Ltd.
    Inventors: Fengchun Xie, Dandan Zhang, Roberto Francisco-Yi Lu, Lvhai Hu, Qinglong Zeng, Lan Gong, Qian Ying, Yingcong Deng, Yun Liu
  • Publication number: 20200023526
    Abstract: An automatic pick-up equipment adapted to pick up components having different shapes includes a base mounted on a manipulator of a robot, a first pick-up device mounted on the base and including a pair of first gripping mechanisms opposite to each other, and a second pick-up device mounted on the base and including a pair of second gripping mechanisms opposite to each other and a rotation mechanism. The first gripping mechanisms are configured to linearly reciprocate relative to each other to grip a first component. The second gripping mechanisms are configured to pivotally reciprocate relative to each other to grip a second component. The rotation mechanism is configured to drive the second gripping mechanisms to rotate relative to the base to change a posture of the second component.
    Type: Application
    Filed: September 30, 2019
    Publication date: January 23, 2020
    Applicants: Tyco Electronics (Shanghai) Co. Ltd., Shenzhen AMI Technology Co., Ltd.
    Inventors: Zhiyong Dai, Lvhai Hu, Yingcong Deng, Qinglong Zeng, Wei Kang
  • Publication number: 20200009783
    Abstract: An assembly system includes a feeding mechanism adapted to feed a heat shrinkable tube, a cutting mechanism, a clamping mechanism, a robot, and a vision system. The cutting mechanism is adapted to cut off a section of heat shrinkable tube with a predetermined length from the heat shrinkable tube fed by the feeding mechanism. The clamping mechanism is adapted to clamp the heat shrinkable tube during cutting the heat shrinkable tube with the cutting mechanism. The robot is adapted to grip the section of heat shrinkable tube cut off from the heat shrinkable tube. The vision system is adapted to guide the robot to sleeve the section of heat shrinkable tube onto a wire of an electrical device.
    Type: Application
    Filed: September 23, 2019
    Publication date: January 9, 2020
    Applicants: Tyco Electronics (Shanghai) Co. Ltd., TE Connectivity Corporation, Shenzhen AMI Technology Co., Ltd., Measurement Specialities (Chengdu) Ltd.
    Inventors: Fengchun Xie, Dandan Zhang, Roberto Francisco-Yi Lu, Lvhai Hu, Qinglong Zeng, Lan Gong, Qian Ying
  • Publication number: 20200015359
    Abstract: A carrier includes a base on which a circuit board is mounted, a loading device mounted on the base, a first pressing device mounted on the base, and a second pressing device mounted on the base. The loading device is configured to load an electronic device on the base. The first pressing device is configured to press a first lead end protruding from the electronic device on the circuit board to electrically contact the circuit board. The second pressing device is configured to press a second lead end of the electronic device on the base.
    Type: Application
    Filed: September 16, 2019
    Publication date: January 9, 2020
    Applicants: Tyco Electronics (Shanghai) Co. Ltd., TE Connectivity Corporation, Measurement Specialties (Chengdu) Ltd.
    Inventors: Fengchun Xie, Dandan Zhang, Roberto Francisco-Yi Lu, Lvhai Hu, Qinglong Zeng, Lan Gong, Qian Ying, Yingcong Deng, Yun Liu
  • Publication number: 20190381675
    Abstract: A gripping system includes a gripping device and a pitch adjustment device. The gripping device has a row of grippers arranged in a first direction and adapted to grip a row of contacts and a support frame on which at least two adjacent grippers of the row of grippers are slidably attached. The pitch adjustment device is adapted to drive the at least two adjacent grippers to slide in the first direction to adjust a pitch between the two adjacent grippers.
    Type: Application
    Filed: August 28, 2019
    Publication date: December 19, 2019
    Applicants: Tyco Electronics (Shanghai) Co. Ltd., Shenzhen AMI Technology Co. Ltd.
    Inventors: Zhiyong Dai, Lvhai Hu, Yun Liu, Qinglong Zeng, Wei Kang
  • Patent number: 10512172
    Abstract: A pre-tin shaping system is disclosed. The pre-tin shaping system comprises a base securely holding a circuit board having a pre-tin layer, a heat-press unit having a contact tip, and a movable unit moving the heat-press unit relative to the base. The contact tip is movable to shape the pre-tin layer.
    Type: Grant
    Filed: October 27, 2016
    Date of Patent: December 17, 2019
    Assignees: Tyco Electronics (Dongguan) Co., Ltd., Tyco Electronics (Shanghai) Co., Ltd., Shenzhen AMI Technology Co. Ltd., TE Connectivity Germany GmbH
    Inventors: Hongzhou Shen, Dandan Zhang, Qinglong Zeng, Roberto Francisco-Yi Lu, George Dubniczki
  • Publication number: 20190358722
    Abstract: An automatic solder paste feeding system, comprising: a base, a container mounted on the base and configured to contain a solder paste therein, a syringe mounted on the base and configured to inject the solder paste into the container, and a heater mounted on the base and configured to heat the solder paste contained in the container, so that the solder paste is melted into liquid state.
    Type: Application
    Filed: August 6, 2019
    Publication date: November 28, 2019
    Applicants: Tyco Electronics (Shanghai) Co. Ltd., TE Connectivity Corporation, Measurement Specialties (Chengdu) Ltd.
    Inventors: Fengchun Xie, Dandan Zhang, Roberto Francisco-Yi Lu, Lvhai Hu, Qinglong Zeng, Lan Gong, Qian Ying, Yingcong Deng, Yun Liu
  • Patent number: 10378879
    Abstract: A thickness detection experiment platform, including: a motion simulation module adapted to drive a product to be detected to perform a predetermined simulation motion simulating various motions of the product on an actual production line and a thickness detection module adapted to detect a thickness of the product driven by the motion simulation module. The motion simulation module may drive the product to be detected to simulate various motions of the product on the actual production line. Thus, conditions of the product on the actual production line may be simulated and reproduced in the laboratory. As a result, the thickness detection experiment platform may be debugged offline in the laboratory without debugging online, normal production of the actual production line is not affected, and debugging of the thickness detection experiment platform becomes easier.
    Type: Grant
    Filed: October 31, 2017
    Date of Patent: August 13, 2019
    Assignees: Tyco Electronics (Shanghai) Co. Ltd., TE Connectivity Corporation, Shenzhen AMI Technology Co., Ltd.
    Inventors: Lei Zhou, Dandan Zhang, Roberto Francisco-Yi Lu, Qinglong Zeng
  • Patent number: 10352687
    Abstract: An online thickness detection platform having a first laser sensor and a second laser sensor that detect a thickness of a product passing between the first arm and the second arm of a C-type frame on which the first laser sensor and a second laser sensor, respectively are adjustably mounted. The first laser sensor and the second laser sensor do not contact the product during detecting the thickness of the product. Because the thickness of the product is detected online, the thickness of the product is monitored in real-time. When the thickness of the product exceeds or falls below an allowed value range, production of the product is stopped, thereby avoiding producing a large number of unqualified products with a thickness out of the allowed value range and waste is prevented.
    Type: Grant
    Filed: October 31, 2017
    Date of Patent: July 16, 2019
    Assignees: Tyco Electronics (Shanghai) Co. Ltd., TE Connectivity Corporation, Shenzhen AMI Technology Co., Ltd.
    Inventors: Lei Zhou, Dandan Zhang, Roberto Francisco-Yi Lu, Qinglong Zeng
  • Publication number: 20190143374
    Abstract: A chip sorting and packaging platform comprises a supply module, a sorting module, and a packaging module. The supply module is adapted to feed a plurality of chips. The sorting module is configured to pick up the chips fed by the supply module and to determine whether each of the chips is qualified. The packaging module is configured to package qualified chips of the chips sorted by the sorting module.
    Type: Application
    Filed: January 9, 2019
    Publication date: May 16, 2019
    Applicants: Tyco Electronics (Shanghai) Co. Ltd., TE Connectivity Corporation, Shenzhen AMI Technology Co., Ltd.
    Inventors: Lei Zhou, Dandan Zhang, Roberto Francisco-Yi Lu, Qinglong Zeng
  • Publication number: 20190124804
    Abstract: A positioning device that has a support table, two pairs of sliding blocks slidably mounted in the support table, a positioning plate extending vertically at the top of each sliding block, a base on which the support table is supported, a cylinder in the base, a ball in the cylinder, a piston rod slidably mounted in the cylinder and pushing the ball to move upward in a vertical direction, so that the ball drives the two pairs of sliding blocks to move away from each other in the first horizontal direction and the second horizontal direction, respectively, until the positioning plates of the two pairs of sliding blocks abut against four inner walls of the opening of the circuit board, respectively, to allow the electronic device to be received in a positioning slot defined by the positioning plates, and a release mechanism that drives the piston rod to move downward in the vertical direction to allow the two pairs of sliding blocks to be moved toward each other in the first horizontal direction and the second
    Type: Application
    Filed: October 24, 2018
    Publication date: April 25, 2019
    Applicants: Tyco Electronics (Shanghai) Co. Ltd., Shenzhen AMI Technology Co., Ltd., TE Connectivity Corporation, Measurement Specialties (China) Ltd.
    Inventors: Zhiyong Dai, Dandan Zhang, Roberto Francisco-Yi Lu, Songping Chen, Xiangyou Hou, Qinglong Zeng, Lvhai Hu, Yun Liu, Changjun Wang