Abstract: An automatic fiber stripping system comprises a first stripping module, a second stripping module, and a heating device. The first stripping module and the second stripping module each have a stripping belt, a driven belt wheel, a driving belt wheel, and a stripping tool including a pressing portion. The stripping belts are tightened on the pressing portions and the stripping tools press the stripping belts on each of two opposite sides of an optical cable. A blade portion of one of the stripping tools cuts a notch in at least one of two side edges of an outer coating layer of the optical cable. The heating device heats and softens the outer coating layer of the optical cable. The stripping belts are driven to move relative to the optical cable by the driving belt wheels so as to strip off a segment of the outer coating layer from the notch.

Abstract: A fixing apparatus comprises a first fixing device and a second fixing device. The first fixing device has at least one first positioning groove adapted to position at least one first elongated member and fixes the at least one first elongated member. The second fixing device has at least one second positioning groove adapted to position at least one second elongated member and fixes the at least one second elongated member. Each first positioning groove is aligned with a corresponding second positioning groove so that the first elongated member fixed in the first positioning groove is axially aligned with the second elongated member fixed in the corresponding second positioning groove.

Abstract: Provided is a compound of formula I or a pharmaceutically acceptable salt, enantiomer, diastereomer, tautomer, solvate, isotopic substituent, polymorph, prodrug, or metabolite thereof. Also provided is a method for preparing the compound of formula I. The compound of formula I has higher inhibitory activity against SHP2, and thus can be used to prevent or treat a disease related to SHP2.

Abstract: A welding system for welding a first elongated element and a second elongated element together by a laser beam that is emitted from a laser welding head after the ideal welding center point of the aligned first and second elongated elements has been positioned at a focal point of the laser beam that is emitted from the laser welding head.

Abstract: A terminal bending tool comprises a plate, a plurality of receiving grooves, and a plurality of rollers. The plate extends in a first horizontal direction. The receiving grooves are disposed in the plate in a row along the first horizontal direction. The rollers are pivotally mounted in the receiving grooves. A terminal is received and positioned in a first receiving groove and is in contact with an outer circumferential surface of a first roller. When the terminal bending tool is moved in a vertical direction perpendicular to the first horizontal direction, the first roller rotates and moves along a surface of the terminal while pressing and bending the terminal.

Abstract: A fixation apparatus includes a base, a wire fixing device mounted on the base, and a pressing device mounted on the base. The wire fixing device positions and fixes a wire on a circuit board and includes a fixing frame mounted on the base and a moving unit received in a receiving chamber of the fixing frame. The fixing frame has a first positioning groove. The moving unit is movable between a clamping position and a release position and has a second positioning groove coupled with the first positioning groove. The wire is inserted into a wire insertion hole in the circuit board between the first positioning groove and the second positioning groove when the mobile unit is moved to the release position. The wire is clamped and fixed between the first positioning groove and the second positioning groove when the moving unit is moved to the clamping position.

Abstract: A wire automatic soldering system includes a carrier adapted to load an electrical product to be soldered, a robot adapted to grip and move the carrier on which the electrical product is loaded, a solder paste container containing a solder paste, and a heater configured to heat the solder paste and melt the solder paste into a liquid. The robot moves a plurality of wires of the electrical product into the solder paste container to solder the wires together with the solder paste.

Abstract: An assembly system includes a feeding mechanism configured to feed a heat shrinkable tube, a cutting mechanism adapted to cut off a segment of heat shrinkable tube from the heat shrinkable tube, a robot adapted to grip the segment of heat shrinkable tube, and a vision system adapted to visually guide the robot to assemble the segment of heat shrinkable tube onto a wire of an electrical product.

Abstract: An automatic pick-up equipment adapted to pick up components having different shapes includes a base mounted on a manipulator of a robot, a first pick-up device mounted on the base and including a pair of first gripping mechanisms opposite to each other, and a second pick-up device mounted on the base and including a pair of second gripping mechanisms opposite to each other and a rotation mechanism. The first gripping mechanisms are configured to linearly reciprocate relative to each other to grip a first component. The second gripping mechanisms are configured to pivotally reciprocate relative to each other to grip a second component. The rotation mechanism is configured to drive the second gripping mechanisms to rotate relative to the base to change a posture of the second component.

Abstract: An assembly system includes a feeding mechanism adapted to feed a heat shrinkable tube, a cutting mechanism, a clamping mechanism, a robot, and a vision system. The cutting mechanism is adapted to cut off a section of heat shrinkable tube with a predetermined length from the heat shrinkable tube fed by the feeding mechanism. The clamping mechanism is adapted to clamp the heat shrinkable tube during cutting the heat shrinkable tube with the cutting mechanism. The robot is adapted to grip the section of heat shrinkable tube cut off from the heat shrinkable tube. The vision system is adapted to guide the robot to sleeve the section of heat shrinkable tube onto a wire of an electrical device.

Abstract: A carrier includes a base on which a circuit board is mounted, a loading device mounted on the base, a first pressing device mounted on the base, and a second pressing device mounted on the base. The loading device is configured to load an electronic device on the base. The first pressing device is configured to press a first lead end protruding from the electronic device on the circuit board to electrically contact the circuit board. The second pressing device is configured to press a second lead end of the electronic device on the base.

Abstract: A gripping system includes a gripping device and a pitch adjustment device. The gripping device has a row of grippers arranged in a first direction and adapted to grip a row of contacts and a support frame on which at least two adjacent grippers of the row of grippers are slidably attached. The pitch adjustment device is adapted to drive the at least two adjacent grippers to slide in the first direction to adjust a pitch between the two adjacent grippers.

Abstract: A pre-tin shaping system is disclosed. The pre-tin shaping system comprises a base securely holding a circuit board having a pre-tin layer, a heat-press unit having a contact tip, and a movable unit moving the heat-press unit relative to the base. The contact tip is movable to shape the pre-tin layer.

Abstract: An automatic solder paste feeding system, comprising: a base, a container mounted on the base and configured to contain a solder paste therein, a syringe mounted on the base and configured to inject the solder paste into the container, and a heater mounted on the base and configured to heat the solder paste contained in the container, so that the solder paste is melted into liquid state.

Abstract: A thickness detection experiment platform, including: a motion simulation module adapted to drive a product to be detected to perform a predetermined simulation motion simulating various motions of the product on an actual production line and a thickness detection module adapted to detect a thickness of the product driven by the motion simulation module. The motion simulation module may drive the product to be detected to simulate various motions of the product on the actual production line. Thus, conditions of the product on the actual production line may be simulated and reproduced in the laboratory. As a result, the thickness detection experiment platform may be debugged offline in the laboratory without debugging online, normal production of the actual production line is not affected, and debugging of the thickness detection experiment platform becomes easier.

Abstract: An online thickness detection platform having a first laser sensor and a second laser sensor that detect a thickness of a product passing between the first arm and the second arm of a C-type frame on which the first laser sensor and a second laser sensor, respectively are adjustably mounted. The first laser sensor and the second laser sensor do not contact the product during detecting the thickness of the product. Because the thickness of the product is detected online, the thickness of the product is monitored in real-time. When the thickness of the product exceeds or falls below an allowed value range, production of the product is stopped, thereby avoiding producing a large number of unqualified products with a thickness out of the allowed value range and waste is prevented.

Abstract: A chip sorting and packaging platform comprises a supply module, a sorting module, and a packaging module. The supply module is adapted to feed a plurality of chips. The sorting module is configured to pick up the chips fed by the supply module and to determine whether each of the chips is qualified. The packaging module is configured to package qualified chips of the chips sorted by the sorting module.

Abstract: A positioning device including a support tab, two pairs of sliding blocks slidably mounted in the support table, a positioning plate extending vertically from on a top of each sliding block, a base on which the support table is supported, a cylinder installed in a chamber of the base, a ball received in the cylinder, a piston rod slidably mounted in the cylinder that pushes the ball to move upward in a vertical direction, so that the ball drives the two pairs of sliding blocks to move away from each other in the first horizontal direction and the second horizontal direction, respectively, until the positioning plates of the two pairs of sliding blocks abut against four inner walls of the opening of the circuit board, respectively, to allow the electronic device to be received in a positioning slot defined by the positioning plates, and a release mechanism that drives the ball to move downward to allow the two pairs of sliding blocks to be moved toward each other in the first horizontal direction and the secon

Abstract: A positioning device that has a support table, two pairs of sliding blocks slidably mounted in the support table, a positioning plate extending vertically at the top of each sliding block, a base on which the support table is supported, a cylinder in the base, a ball in the cylinder, a piston rod slidably mounted in the cylinder and pushing the ball to move upward in a vertical direction, so that the ball drives the two pairs of sliding blocks to move away from each other in the first horizontal direction and the second horizontal direction, respectively, until the positioning plates of the two pairs of sliding blocks abut against four inner walls of the opening of the circuit board, respectively, to allow the electronic device to be received in a positioning slot defined by the positioning plates, and a release mechanism that drives the piston rod to move downward in the vertical direction to allow the two pairs of sliding blocks to be moved toward each other in the first horizontal direction and the second

Abstract: An automatic component loading system is disclosed. The automatic component loading system has a loading device, a conveying device having a plurality of first pin receiving slots and a plurality of first component receiving trays positioned around a circumference of the conveying device, and a position correcting device having at least one pin that corresponds with the plurality of first pin receiving slots.