Patents by Inventor Qiuling Zhu

Qiuling Zhu has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 9286216
    Abstract: This disclosure relates to a three-dimensional (3D) integrated circuit (3DIC) memory chip including computational logic-in-memory (LiM) for performing accelerated data processing. Related memory systems and methods are also disclosed. In one embodiment, the 3DIC memory chip includes at least one memory layer that provides a primary memory configured to store data. The 3DIC memory chip also includes a computational LiM layer. The computational LiM layer is a type of memory layer having application-specific computational logic integrated into local memory while externally appearing as regular memory. The computational LiM layer and the primary memory are interconnected through through-silica vias (TSVs). In this manner, the computational LiM layer may load data from the primary memory with the 3DIC memory chip without having to access an external bus coupling the 3DIC memory chip to a central processing unit (CPU) or other processors to computationally process the data and generate a computational result.
    Type: Grant
    Filed: January 16, 2014
    Date of Patent: March 15, 2016
    Assignee: Carnegie Mellon University
    Inventors: Franz Franchetti, Qiuling Zhu, Lawrence T. Pileggi
  • Publication number: 20150199266
    Abstract: This disclosure relates to a three-dimensional (3D) integrated circuit (3DIC) memory chip including computational logic-in-memory (LiM) for performing accelerated data processing. Related memory systems and methods are also disclosed. In one embodiment, the 3DIC memory chip includes at least one memory layer that provides a primary memory configured to store data. The 3DIC memory chip also includes a computational LiM layer. The computational LiM layer is a type of memory layer having application-specific computational logic integrated into local memory while externally appearing as regular memory. The computational LiM layer and the primary memory are interconnected through through-silica vias (TSVs). In this manner, the computational LiM layer may load data from the primary memory with the 3DIC memory chip without having to access an external bus coupling the 3DIC memory chip to a central processing unit (CPU) or other processors to computationally process the data and generate a computational result.
    Type: Application
    Filed: January 16, 2014
    Publication date: July 16, 2015
    Applicant: Carnegie Mellon University
    Inventors: Franz Franchetti, Qiuling Zhu, Lawrence T. Pileggi
  • Publication number: 20140225902
    Abstract: An image pyramid processor and a method of multi-resolution image processing. One embodiment of the image pyramid processor includes: (1) a level multiplexer configured to employ a single processing element to process multiple levels of an image pyramid in a single work unit, and (2) a buffer pyramid having memory allocable to store respective intermediate results of the single work unit.
    Type: Application
    Filed: February 11, 2013
    Publication date: August 14, 2014
    Applicant: NVIDIA CORPORATION
    Inventors: Qiuling Zhu, Navjot Garg, Yun-Ta Tsai, Kair Pulli, Albert Meixner