Patents by Inventor Quanbo Zou

Quanbo Zou has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 11128957
    Abstract: A micro-speaker, the manufacturing method thereof, a speaker device and an electronic apparatus are described herein. The micro-speaker comprises a case, wherein the case has an opening; and a piezoelectric layer, wherein one or more electrodes are provided on the piezoelectric layer, and wherein the piezoelectric layer is pre-buckled in its rest position, wherein the piezoelectric layer covers the opening and is bonded onto the case, to form a speaker rear cavity together with the case. The micro-speaker of the present invention has a relatively low speaker profile.
    Type: Grant
    Filed: October 21, 2015
    Date of Patent: September 21, 2021
    Assignee: GOERTEK INC.
    Inventors: Quanbo Zou, Zhe Wang, Jun Li
  • Patent number: 11117797
    Abstract: The present invention discloses a MEMS device and an electronics apparatus. The MEMS device comprises: a substrate; a MEMS element placed on the substrate; a cover encapsulating the MEMS element together with the substrate; and a port for the MEMS element to access outside, wherein the port is provided with a filter which has mesh holes and includes electrets to prevent particles from entering into the MEMS element.
    Type: Grant
    Filed: October 8, 2016
    Date of Patent: September 14, 2021
    Assignee: GOERTEK. INC
    Inventors: Quanbo Zou, Zhe Wang, You Wang, Xianbin Wang
  • Patent number: 11111131
    Abstract: A MEMS microphone, a manufacturing method thereof and an electronic apparatus are disclosed. The MEMS microphone comprises: a MEMS microphone device including a MEMS microphone chip and a mesh membrane monolithically integrated with the MEMS microphone chip; and a housing including an acoustic port, wherein the MEMS microphone device is mounted in the housing, and the mesh membrane is arranged between the MEMS microphone chip and the acoustic port as a particle filter for the MEMS microphone chip.
    Type: Grant
    Filed: June 9, 2017
    Date of Patent: September 7, 2021
    Assignee: GOERTEK INC
    Inventor: Quanbo Zou
  • Patent number: 11109000
    Abstract: The present disclosure provides a laser projection device and a laser projection system. The laser projection device includes a light source scanner and a MEMS scanning mirror, the light source scanner including micro laser diodes; and the micro laser diodes are used to provide laser beams needed for image projection, and the laser beams are projected to the MEMS scanning mirror, and then reflected by the MEMS scanning mirror to a predetermined area to form a projection image. By providing the micro laser diodes in the laser projection device and initiatively emitting laser by exciting the micro laser diodes, the present disclosure does not need an external laser source and facilitates the reduction of the size of the laser projection device, as compared with the prior art.
    Type: Grant
    Filed: March 7, 2017
    Date of Patent: August 31, 2021
    Assignee: GOERTEK INC.
    Inventors: Zhe Wang, Xiaoyang Zhang, Quanbo Zou
  • Patent number: 11107946
    Abstract: The present disclosure discloses a micro-LED transfer method, a manufacturing method, device and an electronic apparatus. The transfer method comprises: in accordance with a sequence of micro-LEDs of blue, green and red, epitaxially growing micro-LEDs of two or all of the three colors on a single GaAs original substrate; epitaxially growing bumping electrodes corresponding to the micro-LEDs on a receiving substrate; bonding the micro-LEDs of the two or all of the three colors with the bumping electrodes on the receiving substrate; and removing the GaAs original substrate. The method can be used to transfer micro-LEDs of a variety of colors, in order to improve the production efficiency.
    Type: Grant
    Filed: December 19, 2017
    Date of Patent: August 31, 2021
    Assignee: Goertek Inc.
    Inventors: Xiangxu Feng, Peixuan Chen, Quanbo Zou
  • Patent number: 11109162
    Abstract: A MEMS microphone, comprising a packaging structure that is enveloped by a PCB substrate (1) and a housing (2), wherein the packaging structure is provided with a MEMS acoustoelectric chip (3) therein, and the PCB substrate (1) is provided with a sound port (11) at a position that is corresponding to the MEMS acoustoelectric chip (3), wherein, the MEMS microphone further comprises a filter (5), wherein the filter (5) is embedded into a back cavity of the MEMS acoustoelectric chip (3), the filter (5) and the PCB substrate (1) have a lateral hole therebetween, and the lateral hole serves as a sound channel that is used by the MEMS acoustoelectric chip (3) to gather sound. The MEMS microphone can prevent gas shock, block the interfering to the MEMS microphone by kinetic particles, keep the acoustic performance of the MEMS microphone, and reduce the packaging size of the MEMS microphone.
    Type: Grant
    Filed: May 5, 2017
    Date of Patent: August 31, 2021
    Assignee: GOERTEK INC.
    Inventors: Quanbo Zou, Zhe Wang, Jialiang Yan
  • Patent number: 11102586
    Abstract: An MEMS microphone is provided, comprising a first substrate and a vibration diaphragm supported above the first substrate by a spacing portion, the first substrate, the spacing portion, and the vibration diaphragm enclosing a vacuum chamber, and a static deflection distance of the vibration diaphragm under an atmospheric pressure being less than a distance between the vibration diaphragm and the first substrate, wherein: one of the vibration diaphragm and the first substrate is provided with a magnetic film, and the other one of the vibration diaphragm and the first substrate is provided with a magnetoresistive sensor cooperating with the magnetic film, the magnetoresistive sensor being configured to sense a change in a magnetic field of the magnetic film during a vibration of the vibration diaphragm and output a varying electrical signal.
    Type: Grant
    Filed: September 6, 2018
    Date of Patent: August 24, 2021
    Assignee: Weifang Goertek Microelectronics Co., Ltd.
    Inventors: Quanbo Zou, Qunwen Leng, Zhe Wang
  • Patent number: 11099466
    Abstract: A projection module and an electronics apparatus are provided. The projection module comprises: a projection chip, having micro semiconductor light emitting devices thereon; and a projection lens unit, wherein the micro semiconductor light emitting devices produce projection light to create a projection image, and the projection lens unit receives the projection image and projects it to a projection surface.
    Type: Grant
    Filed: January 9, 2017
    Date of Patent: August 24, 2021
    Assignee: GOERTEK, INC
    Inventors: Peixuan Chen, Quanbo Zou, Xiangxu Feng
  • Patent number: 11099467
    Abstract: A micro laser diode projector comprises: an MEMS scanning device, which rotates around a first axis and a second axis that are orthogonal to each other; and a micro laser diode light source including at least one micro laser diode, wherein the micro laser diode light source is mounted on the MEMS scanning device and rotates around the first and second axes with the MEMS scanning device to project light to a projection screen. An electronics apparatus including the micro laser diode projector is also discussed.
    Type: Grant
    Filed: February 6, 2017
    Date of Patent: August 24, 2021
    Assignee: GOERTEK INC.
    Inventors: Zhe Wang, Quanbo Zou, Qinglin Song, Jialiang Yan, Yujing Lin, Xiaoyang Zhang
  • Publication number: 20210227335
    Abstract: An MEMS capacitor microphone is provided, comprising a first substrate and a vibration diaphragm supported above the first substrate by a spacing portion, the first substrate, the spacing portion, and the vibration diaphragm enclosing a vacuum chamber, and a static deflection distance of the vibration diaphragm under an atmospheric pressure being less than a distance between the vibration diaphragm and the first substrate, wherein a lower electrode forming a capacitor structure with the vibration diaphragm is provided on a side of the first substrate that is adjacent to the vacuum chamber, and an electric field between the vibration diaphragm and the lower electrode is 100-300 V/?m.
    Type: Application
    Filed: September 6, 2018
    Publication date: July 22, 2021
    Applicant: Goertek, Inc.
    Inventors: QUANBO ZOU, Yongwei Dong
  • Patent number: 11024611
    Abstract: A micro-LED transfer method, manufacturing method and display device are provided. The micro-LED transfer method comprises: bonding the micro-LED array on a first substrate onto a receiving substrate through micro-bumps, wherein the first substrate is laser transparent; applying underfill into a gap between the first substrate and the receiving substrate; irradiating laser onto the micro-LED array from a side of the first substrate to lift-off the micro-LED array from the first substrate; and removing the underfill.
    Type: Grant
    Filed: June 9, 2017
    Date of Patent: June 1, 2021
    Assignee: Goertek, Inc.
    Inventors: Quanbo Zou, Peixuan Chen, Xiangxu Feng, Tao Gan, Xiaoyang Zhang, Zhe Wang
  • Patent number: 11024773
    Abstract: The present invention discloses a micro-LED with vertical structure, display device, electronics apparatus and manufacturing method. The micro-LED with vertical structure comprises: a bottom electrode bonded on a display substrate; a first type doped region provided above the bottom electrode; a second type doped region provided above the first type doped region; and a side-contact electrode covering at least one part of a peripheral of the second type doped region.
    Type: Grant
    Filed: November 6, 2016
    Date of Patent: June 1, 2021
    Assignee: GOERTEK. INC
    Inventors: Quanbo Zou, Peixuan Chen, Xiangxu Feng
  • Publication number: 20210151418
    Abstract: A micro-LED transfer method, manufacturing method and display device are provided. The micro-LED transfer method comprises: bonding the micro-LED array on a first substrate onto a receiving substrate through micro-bumps, wherein the first substrate is laser transparent; applying underfill into a gap between the first substrate and the receiving substrate; irradiating laser onto the micro-LED array from a side of the first substrate to lift-off the micro-LED array from the first substrate; and removing the underfill.
    Type: Application
    Filed: June 9, 2017
    Publication date: May 20, 2021
    Applicant: Goeriek, Inc.
    Inventors: Quanbo Zou, Peixuan CHEN, Xiangxu FENG, Tao GAN, Xiaoyang ZHANG, Zhe WANG
  • Publication number: 20210141298
    Abstract: A projection module and an electronics apparatus are provided. The projection module comprises: a projection chip, having micro semiconductor light emitting devices thereon; and a projection lens unit, wherein the micro semiconductor light emitting devices produce projection light to create a projection image, and the projection lens unit receives the projection image and projects it to a projection surface.
    Type: Application
    Filed: January 9, 2017
    Publication date: May 13, 2021
    Inventors: Peixuan CHEN, Quanbo ZOU, Xiangxu FENG
  • Patent number: 11004602
    Abstract: A flat coil, a manufacturing method thereof and an electronic apparatus are disclosed. The manufacturing method comprises: rolling a metal foil lamination onto a carrier roller to form a foil rod, wherein the metal foil lamination includes at least one layer of metal foil; sliding the foil rod from the carrier roller; slicing the foil rod into thin disks; and processing the thin disks to form at least one flat coil, wherein a pressing roller is pressed against the carrier roller via the metal foil lamination with a controlled pressing force as the metal foil lamination is rolled.
    Type: Grant
    Filed: October 18, 2017
    Date of Patent: May 11, 2021
    Assignee: Goertek Inc.
    Inventor: Quanbo Zou
  • Publication number: 20210136334
    Abstract: The present disclosure provides a laser projection device and a laser projection system. The laser projection device includes a light source scanner and a MEMS scanning mirror, the light source scanner including micro laser diodes; and the micro laser diodes are used to provide laser beams needed for image projection, and the laser beams are projected to the MEMS scanning mirror, and then reflected by the MEMS scanning mirror to a predetermined area to form a projection image. By providing the micro laser diodes in the laser projection device and initiatively emitting laser by exciting the micro laser diodes, the present disclosure does not need an external laser source and facilitates the reduction of the size of the laser projection device, as compared with the prior art.
    Type: Application
    Filed: March 7, 2017
    Publication date: May 6, 2021
    Applicant: GOERTEK INC.
    Inventors: Zhe WANG, Xiaoyang ZHANG, Quanbo ZOU
  • Publication number: 20210135044
    Abstract: It is disclosed a micro-LED transfer method, manufacturing method and display device. The method for transferring a micro-LED array comprises: patterning conductive resist on a receiving substrate to cover electrodes for the micro-LED array to be transferred; bonding the micro-LED array on a first substrate with the receiving substrate through the conductive resist, wherein the first substrate is laser transparent; irradiating laser onto the micro-LED array from a side of the first substrate to lift-off the micro-LED array from the first substrate. According to an embodiment, the performance of a micro-LED device may be improved.
    Type: Application
    Filed: April 19, 2017
    Publication date: May 6, 2021
    Inventors: Quanbo ZOU, Xiaoyang ZHANG, Peixuan CHEN, Xiangxu FENG, Tao GAN, Zhe WANG
  • Patent number: 10971890
    Abstract: A micro laser diode transfer method and a manufacturing method comprise: forming a bonding layer (515) on a receiving substrate (513), wherein first type electrodes (514) are connected to the bonding layer (515); bringing a first side of the micro laser diodes (500r) on a carrier substrate (520) into contact with the bonding layer (515), wherein the carrier substrate (520) is laser-transparent; and irradiating selected micro laser diodes (500r) with laser from the side of the carrier substrate (520) to lift-off the selected micro laser diodes (500r) from the carrier substrate (520). This method may improve yield.
    Type: Grant
    Filed: December 5, 2016
    Date of Patent: April 6, 2021
    Assignee: Goertek, Inc.
    Inventors: Quanbo Zou, Zhe Wang
  • Publication number: 20210078856
    Abstract: A MEMS microphone, a manufacturing method thereof and an electronic apparatus are disclosed. The MEMS microphone comprises: a MEMS microphone device including a MEMS microphone chip and a mesh membrane monolithically integrated with the MEMS microphone chip; and a housing including an acoustic port, wherein the MEMS microphone device is mounted in the housing, and the mesh membrane is arranged between the MEMS microphone chip and the acoustic port as a particle filter for the MEMS microphone chip.
    Type: Application
    Filed: June 9, 2017
    Publication date: March 18, 2021
    Inventor: QUANBO ZOU
  • Patent number: 10944023
    Abstract: A micro-LED transfer method and manufacturing method. The micro-LED (303) transfer method comprises: bringing pickup units (305) of a transfer head in contact with micro-LEDs (303) on a carrier substrate (301), wherein the pickup units (305) are able to apply current to the micro-LEDs (303); applying current to the micro-LEDs (303) via the pickup units (305) to heat up bonding layers (302) between the micro-LEDs (303) and the carrier substrate (301) to be melted; picking up the micro-LEDs (303) from the carrier substrate (301) with the transfer head; bonding the micro-LEDs (303) onto a receiving substrate (307); and removing the transfer head from the micro-LEDs.
    Type: Grant
    Filed: November 7, 2016
    Date of Patent: March 9, 2021
    Assignee: GOERTEK. INC
    Inventor: Quanbo Zou