Patents by Inventor Qun Liu

Qun Liu has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20220147715
    Abstract: This application relates to the field of artificial intelligence, and provides a text processing method, a model training method, and an apparatus. The method includes: obtaining target knowledge data; processing the target knowledge data to obtain a target knowledge vector; processing to-be-processed text to obtain a target text vector; fusing the target text vector and the target knowledge vector based on a target fusion model, to obtain a fused target text vector and a fused target knowledge vector; and processing the fused target text vector and/or the fused target knowledge vector based on a target processing model, to obtain a processing result corresponding to a target task. The foregoing technical solution can improve accuracy of a result of processing a target task by the target processing model.
    Type: Application
    Filed: November 15, 2021
    Publication date: May 12, 2022
    Inventors: Yasheng WANG, Xin JIANG, Xiao CHEN, Qun LIU, Zhengyan ZHANG, Fanchao QI, Zhiyuan LIU
  • Publication number: 20220062162
    Abstract: The present application relates to the technical field of medicine processing, in particular to a toner, a lysozyme buccal tablet and a preparation method of the lysozyme buccal tablet. The toner is obtained by formulating a pigment suspension through adding purified water into the pigment, then atomizing and spraying the pigment suspension onto dextrin, mixing thoroughly, drying and pulverizing. The application further discloses a lysozyme buccal tablet and a preparation method thereof.
    Type: Application
    Filed: May 13, 2021
    Publication date: March 3, 2022
    Inventors: Gongmin Shen, Qun Liu, Yan Jin, Fengjun Mo
  • Publication number: 20220004721
    Abstract: A translation quality detection method includes obtaining a source text and a machine translation of the source text. The machine translation is obtained after a machine translation system translates the source text. The method also includes determining a translation quality of the machine translation based on the source text, the machine translation, and an application scenario of the machine translation.
    Type: Application
    Filed: September 20, 2021
    Publication date: January 6, 2022
    Inventors: Meng Zhang, Qun Liu, Xin Jiang
  • Patent number: 11131893
    Abstract: Disclosed is a display substrate including a base substrate, and gate lines, data lines, common electrode lines and common electrodes on the base substrate; the gate lines and the data lines intersect to define pixel areas; the common electrodes are located in the pixel areas; the gate lines and the common electrode lines are alternately arranged one by one; each common electrode lines includes target wire segments and non-target wire segments, the target wire segments are wire segments where the common electrode lines and the data lines intersect, and the non-target wire segments are wire segments on the common electrode line except the target wire segments; and for each common electrode line, a distance between any position point on the target wire segment and a target gate line is less than a distance between the non-target wire segment and the target gate line.
    Type: Grant
    Filed: November 12, 2019
    Date of Patent: September 28, 2021
    Assignees: BEIJING BOE DISPLAY TECHNOLOGY CO., LTD., BOE TECHNOLOGY GROUP CO., LTD.
    Inventors: Yi Ouyang, Bingyang Yu, Jinwei Zhu, Namin Kwon, Guibing Wang, Tongju Bai, Zhirui He, Bin Yang, Qun Liu, Guobin Xue
  • Patent number: 11072706
    Abstract: A thermal interface material that is useful in transferring heat from heat generating electronic devices, such as computer chips, to heat dissipating structures, such as heat spreaders and heat sinks. The thermal interface material comprises at least one silicone oil, at least one catalyst, at least one thermally conductive filler having a larger surface area, a solvent, at least one inhibitor, and at least one crosslinker. The at least one thermally conductive filler reduces the oil leakage of the TIM, and the solvent increases the flow rate of the TIM without negating the reduction of oil leakage realized by the thermally conductive fillers.
    Type: Grant
    Filed: February 4, 2019
    Date of Patent: July 27, 2021
    Assignee: Honeywell International Inc.
    Inventors: Ling Shen, Kai Zhang, Liqiang Zhang, Ya Qun Liu, Xin Zhang
  • Publication number: 20210223649
    Abstract: Disclosed is a display substrate including a base substrate, and gate lines, data lines, common electrode lines and common electrodes on the base substrate; the gate lines and the data lines intersect to define pixel areas; the common electrodes are located in the pixel areas; the gate lines and the common electrode lines are alternately arranged one by one; each common electrode lines includes target wire segments and non-target wire segments, the target wire segments are wire segments where the common electrode lines and the data lines intersect, and the non-target wire segments are wire segments on the common electrode line except the target wire segments; and for each common electrode line, a distance between any position point on the target wire segment and a target gate line is less than a distance between the non-target wire segment and the target gate line.
    Type: Application
    Filed: November 12, 2019
    Publication date: July 22, 2021
    Inventors: Yi Ouyang, Bingyang Yu, Jinwei Zhu, Namin Kwon, Guibing Wang, Tongju Bai, Zhirui He, Bin Yang, Qun Liu, Guobin Xue
  • Patent number: 11041103
    Abstract: The present disclosure provides a silicone free gel that is useful in transferring heat from heat generating electronic devices, such as computer chips, to heat dissipating structures, such as heat spreaders and heat sinks. The thermal interface material includes a polyether polyol, a cross-linker, a coupling agent, an antioxidant, a catalyst, and at least one thermally conductive filler.
    Type: Grant
    Filed: August 20, 2018
    Date of Patent: June 22, 2021
    Assignee: Honeywell International Inc.
    Inventors: Liqiang Zhang, Huifeng Duan, Rongwei Pan, Qi Zhang, Ya Qun Liu, Haigang Kang
  • Publication number: 20210142069
    Abstract: The present disclosure relates to a video retrieval method, system and device for generating a video retrieval mapping relationship, and a storage medium. The video retrieval method comprises: acquiring a retrieval instruction, wherein the retrieval instruction carries retrieval information for retrieving a target frame picture; and obtaining the target frame picture according to the retrieval information and a preset mapping relationship.
    Type: Application
    Filed: May 17, 2019
    Publication date: May 13, 2021
    Inventors: Tianshi CHEN, Zhou FANG, Shengyuan ZHOU, Qun LIU, Zidong DU
  • Publication number: 20210117189
    Abstract: A reduced instruction set processor based on a memristor is provided. The memristor is a non-volatile device using a resistor to store “0” and “1” logic while implementing “implication logic” through applying a pair of voltages VCOND/VSET. Various data operations, logic operations, and arithmetic operations may be implemented based on the implication logic. The memristor is a computation and memory fusion device having great potential. A computer processor based on the memristor also becomes the research direction of the next-generation computer processor. The computer processor based on a memristor is designed according to the memory and computation fusion characteristic of the memristor. The processor is different from a traditional computer that must use a special memory and a calculator, and fuses computation and memory. Compared with a traditional computer, the speed, parallelism degree, and power consumption of the computer processor based on the memristor are greatly improved.
    Type: Application
    Filed: November 29, 2018
    Publication date: April 22, 2021
    Applicant: HUAZHONG UNIVERSITY OF SCIENCE AND TECHNOLOGY
    Inventors: Qun LIU, Yewang WANG, Xiangshui MIAO, Jian LI
  • Publication number: 20210013545
    Abstract: An electrolyte solution for a lithium-ion cell includes at least one organic carbonate solvent, at least one lithium salt including a non-coordinating anion and at least one polyfluorinated alkoxy olefin according to the general formula I, the general formula II, or the general formula III: I: RaRbC?CH—O—R, II: RaRbC?CH—O—CHRa?Rb?, III: RaRbC?CH—O—Rc—O—CH?CRa?Rb?, wherein Ra and Ra? are each independently a fluorinated alkyl group having 1 or 2 carbon atoms, Rb and Rb? are each independently F, Cl, Br or H, and R is CnHxFy, wherein n is an integer from 1 to 6, x and y are each independently integers from 0 to 13, and x+y=2n+1 or x+y=2n?1, and Rc is CkH(2k+1), wherein k is an integer from 2 to 4.
    Type: Application
    Filed: July 6, 2020
    Publication date: January 14, 2021
    Inventors: Hui Wang, Ya Qun Liu, Ying Han, Gang Xu, Jian Hou, Shuwen Peng, Rajiv Ratna Singh
  • Publication number: 20200343154
    Abstract: The present disclosure provides thermal interface materials that are useful in transferring heat from heat generating electronic devices, such as computer chips, to heat dissipating structures, such as heat spreaders and heat sinks. The thermal interface material is soft and has elastic properties post-curing along with high thermally conductive filler loading. The thermal interface material includes at least one long chain alkyl silicone oil; at least one long chain, vinyl terminated alkyl silicone oil; at least one long chain, single end hydroxyl terminated silicone oil; at least one thermally conductive filler, at least one coupling agent, at least one catalyst, at least one crosslinker, and at least one addition inhibitor.
    Type: Application
    Filed: April 9, 2020
    Publication date: October 29, 2020
    Inventors: Kai Zhang, Liqiang Zhang, Ling Shen, Ya Qun Liu
  • Patent number: 10816589
    Abstract: A structure for testing a semiconductor device.
    Type: Grant
    Filed: December 26, 2017
    Date of Patent: October 27, 2020
    Assignee: CSMC TECHNOLOGIES FAB2 CO., LTD.
    Inventors: Xiaobing Ren, Qun Liu
  • Patent number: 10781349
    Abstract: A thermal interface material includes, in one exemplary embodiment, at least one polymer, at least one phase change material, at least one crosslinker, and at least one thermally conductive filler. The at least one thermally conductive includes a first plurality of particles having a particle diameter of about 1 micron or less. The at least one thermally conductive filler comprises at least 80 wt. % of the total weight of the thermal interface material. A formulation for forming a thermal interface material and an electronic component including a thermal interface material are also provided.
    Type: Grant
    Filed: March 8, 2016
    Date of Patent: September 22, 2020
    Assignee: Honeywell International Inc.
    Inventors: Liqiang Zhang, Wei Jun Wang, Ya Qun Liu, Hong Min Huang
  • Patent number: 10670514
    Abstract: A sensor is provided for detecting and characterizing particles in a fluid. The sensor has a microfluidic channel for receiving the fluid sample, an acoustic transducer module configured to generate a standing wave for concentrating the particles in a region of the microfluidic channel; an optical detection module configured to detect optical signals scattered by the particles upon illuminating the region of the fluid sample with a light source; and a data processing module configured to characterize the particles of the fluid sample based on the optical signals using a classifier.
    Type: Grant
    Filed: October 1, 2014
    Date of Patent: June 2, 2020
    Assignee: Water Optics Technology Pte. Ltd.
    Inventors: Ai Qun Liu, Lei Lei, Wei Huang, Shahnawaz Pukkeyil Shamsuddin
  • Patent number: 10597346
    Abstract: The production of solvents for applications such as heat transfer, cleaning, and degreasing, for example. In particular, the production of solvents derived from 1-chloro-3,3,3-trifluoro-propene, such as chloro and/or fluoro substituted alkanes and chloro and/or fluoro substituted trifluoropropenyl ethers.
    Type: Grant
    Filed: June 10, 2019
    Date of Patent: March 24, 2020
    Assignee: HONEYWELL INTERNATIONAL INC.
    Inventors: Ya Qun Liu, Hong Min Huang, Jun Liu, Rajiv R. Singh
  • Patent number: 10567084
    Abstract: A thermal interface structure for electronic devices, such as telecommunications or data networking hardware, that utilize optical transceiver modules which are inserted within cage receptacles of the electronic devices. In order to provide for efficient heat transfer, the thermal interface structure is disposed between, and in abutment with, the optical transceiver module and a heat sink associated with the cage receptacle. The thermal interface structure includes a thermal interface layer including a phase change material, and a polymer layer connected to the thermal interface layer.
    Type: Grant
    Filed: September 18, 2018
    Date of Patent: February 18, 2020
    Assignee: Honeywell International Inc.
    Inventors: Kai Zhang, Ling Shen, Liqiang Zhang, Ya Qun Liu, Limei Cui
  • Patent number: 10501671
    Abstract: A thermal interface material that is useful in transferring heat from heat generating electronic devices, such as computer chips, to heat dissipating structures, such as heat spreaders and heat sinks. The thermal interface material includes at least one silicone oil, and at least one thermally conductive filler.
    Type: Grant
    Filed: July 5, 2017
    Date of Patent: December 10, 2019
    Assignee: Honeywell International Inc.
    Inventors: Liqiang Zhang, Huifeng Duan, Kai Zhang, Ya Qun Liu, Ling Shen, Wei Jun Wang, Haigang Kang
  • Publication number: 20190346500
    Abstract: A structure for testing a semiconductor device.
    Type: Application
    Filed: December 26, 2017
    Publication date: November 14, 2019
    Inventors: Xiaobing REN, Qun LIU
  • Patent number: 10428256
    Abstract: The present disclosure provides a two component releasable thermal gel that is useful in transferring heat from heat generating electronic devices, such as computer chips, to heat dissipating structures, such as heat spreaders and heat sinks. The two component releasable thermal gel is mixed before the point of application and facilitates catalytic cross-linking. The thermal gel includes a first component including a primary silicone oil, an inhibitor, a catalyst, and at least one thermally conductive filler, and a second component including a primary silicone oil, a cross linking silicone oil, and at least one thermally conductive filler, wherein the ratio of total content of Si—H groups to total content of vinyl groups in the thermal gel is between 0.03 to 10. The thermal gel is releasable from a substrate upon which the thermal gel is applied.
    Type: Grant
    Filed: October 15, 2018
    Date of Patent: October 1, 2019
    Assignee: Honeywell International Inc.
    Inventors: Ling Shen, Kai Zhang, Liqiang Zhang, Ya Qun Liu, Huifeng Duan, Haigang Kang
  • Patent number: 10428257
    Abstract: A thermal interface material includes at least one polymer, at least one thermally conductive filler; and at least one ion scavenger. In some embodiments, the ion scavenger is a complexing agent selected from the group consisting of: nitrogen containing complexing agents, phosphorus containing complexing agents, and hydroxyl carboxylic acid based complexing agents.
    Type: Grant
    Filed: October 17, 2018
    Date of Patent: October 1, 2019
    Assignee: Honeywell International Inc.
    Inventors: Ya Qun Liu, Liang Zeng, Hui Wang, Bright Zhang, Hong Min Huang