Abstract: The production of solvents for applications such as heat transfer, cleaning, and degreasing, for example. In particular, the production of solvents derived from 1-chloro-3,3,3-trifluoro-propene, such as chloro and/or fluoro substituted alkanes and chloro and/or fluoro substituted trifluoropropenyl ethers.

Abstract: A thermal interface material that is useful in transferring heat from heat generating electronic devices, such as computer chips, to heat dissipating structures, such as heat spreaders and heat sinks. The thermal interface material comprises at least one silicone oil, at least one catalyst, at least one thermally conductive filler having a larger surface area, a solvent, at least one inhibitor, and at least one crosslinker.

Abstract: The production of solvents for applications such as heat transfer, cleaning, and degreasing, for example. In particular, the production of solvents derived from 1-chloro-3,3,3-trifluoro-propene, such as chloro and/or fluoro substituted alkanes and chloro and/or fluoro substituted trifluoropropenyl ethers.

Abstract: A thermal interface structure for electronic devices, such as telecommunications or data networking hardware, that utilize optical transceiver modules which are inserted within cage receptacles of the electronic devices. In order to provide for efficient heat transfer, the thermal interface structure is disposed between, and in abutment with, the optical transceiver module and a heat sink associated with the cage receptacle. The thermal interface structure includes a thermal interface layer including a phase change material, and a polymer layer connected to the thermal interface layer.

Abstract: The present disclosure provides thermal interface materials that are useful in transferring heat from heat generating electronic devices, such as computer chips, to heat dissipating structures, such as heat spreaders and heat sinks. The thermal interface material also includes a coloring agent selected from the group consisting of: an iron based inorganic pigment; and an organic pigment.

Abstract: The present invention relates to the use of a plurality of dependency trees in tree-based statistical machine translation and proposes a dependency forest to effectively process the plurality of dependency trees. The present invention can improve a translation capability by generating a translation rule and a dependency language model by using the dependency forest and applying the generated translation rule and dependency language model when a source language text is converted to a target language text.

Abstract: Semiconductor device and fabrication method are provided. The method includes: providing a base substrate having a gate structure formed thereon; forming initial trenches in the base substrate on sides of each gate structure; smoothing inner wall surfaces of the initial trenches to form trenches from the initial trenches, wherein a corner between a bottom surface and a sidewall of each trench is rounded; forming a seed layer on inner walls of each trench, wherein the seed layer covers all inner walls of each trench; and forming source/drain layers on surfaces of the seed layers in the trenches.

Abstract: A thermal interface material includes, in one exemplary embodiment, a polymer, a phase change material, a first thermally conductive filler having a first particle size, and a second thermally conductive filler having a second particle size. The first particle size is larger than the second particle size. A formulation for forming a thermal interface material and an electronic component including a thermal interface material are also provided.

Abstract: A processing platform for display panel, comprising a bracket; a platform base having two end portions to which a rotation shaft is fixed, wherein the rotation shaft is rotatably connected with the bracket, and the rotation shaft and the platform base rotate about the rotation shaft as an axis; a platform being connected to the platform base by a telescopic mechanism which can make the platform move in a direction of approaching the platform base or deviating from the platform base, and having a surface which is away from the platform base and on which an suction structure for sucking the display panel is disposed.

Abstract: A polyimide polymer includes one or more aromatic dianhydride monomers and one or more aromatic diamine monomers as recited herein. A method for making a flexible display device includes preparing a polyimide solution including a polyimide polymer dissolved in a solvent, coating a substrate with the polyimide solution, heating the coating to evaporate the solvent and form a polyimide layer, forming a display device layer on the polyimide layer, dicing through the display device layer and through the polyimide polymer layer, and delaminating the layer from the substrate to form the flexible display device. A flexible display device can include a polyimide polymer backing layer and a display device disposed on the polyimide polymer backing layer, the polyimide polymer including one or more aromatic dianhydride monomers and one or more aromatic diamine monomers as recited herein.

Abstract: The present disclosure provides a two component releasable thermal gel that is useful in transferring heat from heat generating electronic devices, such as computer chips, to heat dissipating structures, such as heat spreaders and heat sinks. The two component releasable thermal gel is mixed before the point of application and facilitates catalytic cross-linking. The thermal gel includes a first component including a primary silicone oil, an inhibitor, a catalyst, and at least one thermally conductive filler, and a second component including a primary silicone oil, a cross linking silicone oil, and at least one thermally conductive filler, wherein the ratio of total content of Si—H groups to total content of vinyl groups in the thermal gel is between 0.03 to 10. The thermal gel is releasable from a substrate upon which the thermal gel is applied.

Abstract: A thermal interface material includes, in one exemplary embodiment, at least one polymer, at least one phase change material, at least one crosslinker, and at least one thermally conductive filler. The at least one thermally conductive includes a first plurality of particles having a particle diameter of about 1 micron or less. The at least one thermally conductive filler comprises at least 80 wt. % of the total weight of the thermal interface material. A formulation for forming a thermal interface material and an electronic component including a thermal interface material are also provided.

Abstract: The present disclosure provides a silicone free gel that is useful in transferring heat from heat generating electronic devices, such as computer chips, to heat dissipating structures, such as heat spreaders and heat sinks. The thermal interface material includes a polyether polyol, a cross-linker, a coupling agent, an antioxidant, a catalyst, and at least one thermally conductive filler.

Abstract: A thermal interface material includes at least one polymer, at least one thermally conductive filler; and at least one ion scavenger. In some embodiments, the ion scavenger is a complexing agent selected from the group consisting of: nitrogen containing complexing agents, phosphorus containing complexing agents, and hydroxyl carboxylic acid based complexing agents.

Abstract: A thermal interface material includes at least one polymer, at least one thermally conductive filler; and at least one ion scavenger. In some embodiments, the ion scavenger is a complexing agent selected from the group consisting of: nitrogen containing complexing agents, phosphorus containing complexing agents, and hydroxyl carboxylic acid based complexing agents.

Abstract: The present disclosure provides thermal interface materials that are useful in transferring heat from heat generating electronic devices, such as computer chips, to heat dissipating structures, such as heat spreaders and heat sinks. The thermal interface material also includes a coloring agent selected from the group consisting of: an iron based inorganic pigment; and an organic pigment.

Abstract: Poly fluorine-containing siloxane coatings having improved hydrophobic and oleophobic properties and solutions for creating such coatings are provided. In some embodiments, the coating includes a polymer having a plurality of Si—O—Si linkages; and at least two fluorine-containing moieties, each attached to at least one of the Si—O—Si linkages. Each fluorine-containing moiety independently includes a linking portion attached to a silicon of one of the Si—O—Si linkages, wherein the linking portion is of a formula selected from the group consisting of: —[CH2]a— where a is an integer from 1 to 10 and —[CH2]bCONH[CH2]c— where b and c are independently an integer from 0 to 10. Each fluorine-containing moiety also independently includes a fluorinated portion attached to the linking portion, wherein the fluorinated portion is selected from a fluorinated-alkyl group having 1-10 carbon atoms and a perfluoro-ether containing organic group.

Abstract: The present invention relates to the use of a plurality of dependency trees in tree-based statistical machine translation and proposes a dependency forest to effectively process the plurality of dependency trees. The present invention can improve a translation capability by generating a translation rule and a dependency language model by using the dependency forest and applying the generated translation rule and dependency language model when a source language text is converted to a target language text.

Abstract: A coated substrate includes a sapphire substrate and an anti-reflective coating comprising a silicon-based material, wherein the anti-reflective coating has refractive index of 1.23 to 1.45 and a Mohs hardness of at least 4. A method of coating a sapphire substrate with an anti-reflective coating includes applying a liquid formulation to a sapphire substrate to form a coated substrate, and curing the coated substrate at a temperature of at least 500° C. to form an anti-reflective layer on the sapphire substrate.

Abstract: Provided is a compressible thermal interface material including a polymer, a thermally conductive filler, and a phase change material. A formulation for forming a compressible thermal interface material and an electronic component including a compressible thermal interface material are also provided.