Abstract: An apparatus comprises a substrate and transducers disposed over the substrate, each of the transducers comprising a different resonance frequency. A transducer device comprises circuitry configured to transmit signals, or to receive signals, or both. The transducer device also comprises a transducer block comprising a plurality of piezoelectric ultrasonic transducers (PMUT), wherein each of the PMUTs; and an interconnect configured to provide signals from the transducer block to the circuitry and to provide signals from the circuitry to the transducer block.

Abstract: A method includes forming a gas-sensitive substrate during a production process by dispensing one or more gas-sensitive materials onto the substrate and drying the one or more gas-sensitive materials on the substrate. The method also includes adjusting the production process based on one or more sensor measurements associated with the substrate and/or the production process. Adjusting the production process could include conditioning air around the substrate so that the conditioned air has one or more specified characteristics and adjusting the one or more specified characteristics based on the one or more sensor measurements. The one or more sensor measurements could include one or more measurements of a moisture content of the substrate. Adjusting the production process could also include adjusting a tension of the substrate. The one or more gas-sensitive materials could be deposited in multiple regions of the substrate, such as along multiple tracks extending lengthwise down the substrate.

Abstract: Electronic devices and microphone devices are described.

Abstract: A method of fabricating an apparatus including a sealed cavity and an apparatus embodying the method are disclosed. To fabricate the apparatus, a device chip including a substrate and at least one circuit element on the substrate is fabricated. Also, a cap is fabricated. Next, the device chip and the cap are bonded such that a sealed cavity is formed by the device chip and the cap. The bond is accomplished using thermo compression technique. Gold or other suitable metal can be used as a bonding agent. Then or at the same time, caulking agent is reflowed over the bonding agent, over portions of the cap, or both to further seal the cavity. In the resultant device, the sealed cavity is sealed by the bonding agent, the caulking agent, or both. The caulking agent increases hermeticity of the cavity and provides for even higher level of protection of the cavity against adverse environmental conditions.

Abstract: An electronic device. The electronic device includes a first electrode and a coating layer. The electronic device is fabricated on a substrate; the substrate has a cavity created in a top surface of the substrate; and the first electrode is electrically coupled to the substrate. The coating layer coats at least part of a substrate surface in the cavity, and the presence of the coating layer results in a mitigation of at least one parasitic leakage path between the first electrode and an additional electrode fabricated on the substrate.

Abstract: A microfluidic case and an electronic device including a microfluidic case are described.

Abstract: A method includes forming a gas-sensitive substrate during a production process by dispensing one or more gas-sensitive materials onto the substrate and drying the one or more gas-sensitive materials on the substrate. The method also includes adjusting the production process based on one or more sensor measurements associated with the substrate and/or the production process. Adjusting the production process could include conditioning air around the substrate so that the conditioned air has one or more specified characteristics and adjusting the one or more specified characteristics based on the one or more sensor measurements. The one or more sensor measurements could include one or more measurements of a moisture content of the substrate. Adjusting the production process could also include adjusting a tension of the substrate. The one or more gas-sensitive materials could be deposited in multiple regions of the substrate, such as along multiple tracks extending lengthwise down the substrate.

Abstract: A method of fabricating an apparatus including a sealed cavity and an apparatus embodying the method are disclosed. To fabricate the apparatus, a device chip including a substrate and at least one circuit element on the substrate is fabricated. Also, a cap is fabricated. Next, the device chip and the cap are bonded such that a sealed cavity is formed by the device chip and the cap. The bond is accomplished using thermo compression technique. Gold or other suitable metal can be used as a bonding agent. Then or at the same time, caulking agent is reflowed over the bonding agent, over portions of the cap, or both to further seal the cavity. In the resultant device, the sealed cavity is sealed by the bonding agent, the caulking agent, or both. The caulking agent increases hermeticity of the cavity and provides for even higher level of protection of the cavity against adverse environmental conditions.

Abstract: A method of fabricating an apparatus including a sealed cavity and an apparatus embodying the method are disclosed. To fabricate the apparatus, a device chip including a substrate and at least one circuit element on the substrate is fabricated. Also, a cap is fabricated. Next, the device chip and the cap are bonded such that a sealed cavity is formed by the device chip and the cap. The bond is accomplished using thermo compression technique. Gold or other suitable metal can be used as a bonding agent. Then or at the same time, caulking agent is reflowed over the bonding agent, over portions of the cap, or both to further seal the cavity. In the resultant device, the sealed cavity is sealed by the bonding agent, the caulking agent, or both. The caulking agent increases hermeticity of the cavity and provides for even higher level of protection of the cavity against adverse environmental conditions.

Abstract: An electronic device and transducer structures are described.

Abstract: Transducer structures having multiple piezoelectric layer and annular contacts are described.

Abstract: An electronic device. The electronic device includes a first electrode and a coating layer. The electronic device is fabricated on a substrate; the substrate has a cavity created in a top surface of the substrate; and the first electrode is electrically coupled to the substrate. The coating layer coats at least part of a substrate surface in the cavity, and the presence of the coating layer results in a mitigation of at least one parasitic leakage path between the first electrode and an additional electrode fabricated on the substrate.

Abstract: An electronic device. The electronic device includes a first electrode and a coating layer. The electronic device is fabricated on a substrate; the substrate has a cavity created in a top surface of the substrate; and the first electrode is electrically coupled to the substrate. The coating layer coats at least part of a substrate surface in the cavity, and the presence of the coating layer results in a mitigation of at least one parasitic leakage path between the first electrode and an additional electrode fabricated on the substrate.

Abstract: Piezoelectric accelerometers and gyroscopes having cantilevered transducers are described.

Abstract: Transducer structures and methods of manufacture are described.

Abstract: An electronic device and transducer structures are described.

Abstract: Transducer structures having multiple piezoelectric layer and annular contacts are described.

Abstract: Electronic devices and microphone devices are described.

Abstract: A microfluidic case and an electronic device including a microfluidic case are described.

Abstract: An etch-stop layer and method of use is disclosed.