Abstract: The present invention relates to a light emitting device (1) comprising a light emitter (10) and a support (13) to which a plurality of protruding fibers (11) are attached. The light emitter (10) and the protruding fibers (11) are arranged to interact with light emitted from the light emitter (10) so that the light may be diffused. The plurality of protruding fibers comprises fibers (11) which are inclined or perpendicular in relation to the support (13).

Abstract: The present invention relates to a flexible modular assembly (100) comprising at least two flexible electronic modules (110 and 111) supported by a textile support (130). The two flexible electronic modules and the textile support each comprise a set of electrical conductors. The flexible modular assembly further comprises flexible connectors (140) for interconnecting two sets of electrical conductors. The flexible modular assembly of the invention is a modular textile assembly for use in large-area applications of electronic textiles.

Abstract: The invention relates to a method for determining a functional area of an electronic textile (100;200). The electronic textile comprises a textile substrate having a first plurality of conductors (108a-b;202a-d), a second plurality of conductors (104a-c;204a-d), and a plurality of capacitors (112;212a-p), each capacitor comprising a conductor from the first plurality of conductors (108a-b;202a-d) and a conductor from the second plurality of conductors (104a-c;204a-d), separated by a dielectric (103a), the capacitors (112;212a-p) being distributed across substantially an entire surface of the electronic textile, wherein each capacitor (112;212a-p) has a capacitance of at least 10 pF.

Abstract: The invention relates to an electronic textile comprising a textile substrate having a substrate electrode, and an electronic component having a component electrode. The component electrode is in electrically conductive contact with the substrate electrode via a coupling layer having a directionally dependent conductance so as to preferentially allow an electrical current to flow between the substrate electrode and the component electrode. As the coupling layer does not have to be patterned to prevent the occurrence of parasitic electrical currents, the electrically conductive contact between the substrate electrode and the component electrode has an improved reliability.

Abstract: The invention relates to a textile (1) for mounting a first electronic component at a first designated position (121) on the textile, and for mounting a second electronic component at a second designated position (122) on the textile, the textile comprising a first marker pattern (111, 112) associated with the first designated position, and a second marker pattern (113, 114) associated with the second designated position. With the textile according to the invention, an electronic textile can be reliably manufactured using conventional equipment known from the electronics assembly industry, such as a pick-and-place apparatus, whereby the electronic components are properly provided at their respective designated positions on the textile.

Abstract: A submount for arranging electronic components on a substrate is provided. The submount comprises a head member and at least one substrate-engaging member protruding from the head member. The head member comprises at least two, from each other isolated, electrically conductive portions, where each electrically conductive portion comprises a component contact, adapted for connection of electronic components thereto, and a substrate contact on arranged on said substrate side, adapted for bringing said electrically conductive portions in contact with a circuitry comprised in said substrate. The submount of the present invention may be used to attach electronic components, such as light-emitting diodes, to a textile substrate, without the need for soldering the electronic component directly on the substrate.

Abstract: An electronic assembly (20; 30; 40; 50) for attachment to a fabric substrate (60; 82, 102) having a conductor pattern (62a-b; 85a-b; 107a-c) on a first side (63; 86; 108) thereof. The electronic assembly comprises an electronic device (23; 42; 64), and at least a first clamping member (21; 41; 65). The electronic assembly is, furthermore, adapted to clamp the electronic device (23; 42; 64) to the first side (63; 86; 108) of the fabric substrate (60; 82, 102) in such a way that the electronic device (23; 23 42; 64) is electrically connected to the conductor pattern (62a-b; 85a-b; 107a-c).

Abstract: A cut-to-measure display device (100) comprising a plurality of pixel groups (200-223), each including a plurality of individually controllable pixels, and a pixel group controller (230) adapted to control each of the pixels in the pixel group (200-223). The cut-to-measure display device (100) further comprises a display controller (235) configured to control the pixels, via the pixel group controllers (230), to display an image corresponding to pre-determined image data, and a communication bus (236) comprising a plurality of bus lines (301, 304) interconnecting the display controller (235) with each of the pixel group controllers (230). Each of the pixel group controllers (230) is configured to determine locations of functional pixels in its associated pixel group (200-223), and communicate information indicative of the locations of functional pixels to the display controller (235) to enable adjustment of the image data for display of the image by means of the functional pixels.

Abstract: A light emitting device (100) is provided, which comprises a substrate (101) accomodating at least one light emitting diode (104) and an elastomeric layer (105) arranged to receive light from the light emitting diode(s) (104). The elastomeric layer (105) comprises phosphors (106), which enhance the output of light from the device (100). The light emitting device (100) is flexible and may be incorporated into a fabric, such as a textile or a plastics. Consequently, a textile product (300) comprising such a device (100) is provided.

Abstract: The invention relates to a light emitting device comprising a light emitting element (100) and a light guide (101) arranged on a textile substrate (102). The light guide has a back surface (103) facing the textile substrate, a front surface (104) facing away from the substrate, and a light receiving surface (105). The light emitting element (100) is arranged such that at least part of the light emitted by the light emitting element (100) is coupled into the light guide (101) through the light receiving surface (105), and is subject to total internal reflection in the light guide (101). Furthermore, the light guide (101) is arranged such that at least part of the light coupled into the light guide (101) exits the light guide (101) through the front surface (104) and/or the back surface (103).

Abstract: A textile (100; 300; 400) having a multi-layer warp which includes an upper warp layer (101) comprising an upper array of conductive warp yarns (104a-b; 303a-e; 406a-b), a lower warp layer (102) comprising a lower array of conductive warp yarns (106a-b; 306a-e; 421a-d), and an intermediate warp layer (103) arranged between the upper (101) and lower (102) warp layers. The textile further includes a weft in which a first set of conductive weft yarns (108; 302a-f; 407a-b) cross the upper array of conductive warp yarns (104a-b, 303a-e; 406a-b), such that electrical contact is achieved there between, and a second set of conductive weft yarns (109a-b; 305a-f; 424, 430, 440) cross the lower array of conductive warp yarns (106a-b; 306a-e; 421a-d), such that electrical contact is achieved there between.

Abstract: A device is provided. The device includes a substrate, an inorganic layer disposed over the substrate, and an organic layer disposed on the inorganic conductive or semiconductive layer, such that the organic layer is in direct physical contact with the inorganic conductive or semiconductive layer. The substrate is deformed such that there is a nominal radial or biaxial strain of at least 0.05% relative to a flat substrate at an interface between the inorganic layer and the organic layer. The nominal radial or biaxial strain may be higher, for example 1.5%. A method of making the device is also provided, such that the substrate is deformed after the inorganic layer and the organic layer are deposited onto the substrate.

Abstract: A device is provided. The device includes a substrate, an inorganic layer disposed over the substrate, and an organic layer disposed on the inorganic conductive or semiconductive layer, such that the organic layer is in direct physical contact with the inorganic conductive or semiconductive layer. The substrate is deformed such that there is a nominal radial or biaxial strain of at least 0.05% relative to a flat substrate at an interface between the inorganic layer and the organic layer. The nominal radial or biaxial strain may be higher, for example 1.5%. A method of making the device is also provided, such that the substrate is deformed after the inorganic layer and the organic layer are deposited onto the substrate.

Abstract: A device is provided. The device includes a substrate, an inorganic layer disposed over the substrate, and an organic layer disposed on the inorganic conductive or semiconductive layer, such that the organic layer is in direct physical contact with the inorganic conductive or semiconductive layer. The substrate is deformed such that there is a nominal radial or biaxial strain of at least 0.05% relative to a flat substrate at an interface between the inorganic layer and the organic layer. The nominal radial or biaxial strain may be higher, for example 1.5%. A method of making the device is also provided, such that the substrate is deformed after the inorganic layer and the organic layer are deposited onto the substrate.