Patents by Inventor Raimund Oberschmid

Raimund Oberschmid has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Method for surface treating a semiconductor
    Publication number: 20050020095
    Abstract: The invention relates to a method for the thermal treatment of a surface layer (4) on a semiconductor substrate (5). Laser pulses (2) generated by a laser (1) are emitted onto the surface layer (4). This method can be used to produce, in particular, ohmic contacts to III-V compound semiconductors.
    Type: Application
    Filed: August 14, 2002
    Publication date: January 27, 2005
    Inventors: Johannes Baur, Georg Bruderl, Alfred Lell, Walter Neu, Raimund Oberschmid
  • Radiation-emitting chip
    Publication number: 20040048429
    Abstract: A light-emitting chip (3) has a lens-type coupling-out window (4), whose base area (5) is provided with a mirror area (6). Arranged on a coupling-out area (7) of the coupling-out window (4) is a layer sequence (9), with a photon-emitting pn junction (10). The photons emitted by the pn junction are reflected at the mirror area (6) and can leave the coupling-out window (4) through the coupling-out area (7).
    Type: Application
    Filed: October 2, 2003
    Publication date: March 11, 2004
    Inventors: Johannes Baur, Dominik Eisert, Michael Fehrer, Berthold Hahn, Volker Harle, Ulrich Jacob, Raimund Oberschmid, Werner Plass, Uwe Strauss, Johannes Volkl, Ulrich Zehnder
  • High radiance led chip and a method for producing same
    Publication number: 20040036080
    Abstract: The invention concerns a light-emitting diode chip (1) comprising a radiation-emitting active region (32) and a window layer (2). To increase the luminous efficiency, the cross-sectional area of the radiation-emitting active region (32) is smaller than the cross-sectional area of the window layer (2) available for the decoupling of light.
    Type: Application
    Filed: August 11, 2003
    Publication date: February 26, 2004
    Inventors: Georg Bogner, Siegmar Kugler, Ernst Nirschl, Raimund Oberschmid, Karl-Heinz Schlereth, Olaf Schoenfeld, Norbert Stath, Gerald Neumann
  • Method for measuring product parameters of components formed on a wafer and device for performing the method
    Publication number: 20020166777
    Abstract: A measuring arrangement for measuring product parameters of a component in the epitaxial layer (28) of a wafer comprises measuring probe (3) on whose contact side (23) a recess (24) is installed, into which an electrolyte can be poured. The electrolyte produces an electrical connection between a contact body (11), which is charged with a signal from a pulsed-current source, and the surface (22) of the wafer (2). A detector (16) serves for detecting the light which is emitted by the component.
    Type: Application
    Filed: February 19, 2002
    Publication date: November 14, 2002
    Inventors: Wolfgang Gramann, Raimund Oberschmid, Werner Spath, Wolfgang Teich
  • Recording and readout apparatus for X-rays
    Patent number: 4508966
    Abstract: A recording and readout apparatus for X-rays has a storage layer whose charge distribution which is generated and stored by means of x-radiation during the recording is read out light-optically in point-by-point fashion. An image data storage of the readout may be provided along with a display apparatus for image observation.
    Type: Grant
    Filed: August 18, 1983
    Date of Patent: April 2, 1985
    Assignee: Siemens Aktiengesellschaft
    Inventors: Raimund Oberschmid, Ingmar Feigt