Patents by Inventor Rajeev Bajaj

Rajeev Bajaj has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 11851570
    Abstract: Polishing articles and methods of manufacturing polishing articles used in polishing processes and cleaning processes are provided. More particularly, implementations disclosed herein relate to composite polishing articles having tunable properties such as hydrophilicity and zeta potential. 3D printed chemical-mechanical planarization (CMP) pads composed of UV curable acrylic chemistry are generally hydrophobic in nature. Such hydrophobic behavior affects the wetting properties with abrasive-based polishing slurries such as ceria-base slurries. However, in order to increase the planarization and removal rate while decreasing defects, hydrophilic pads are preferred. In addition, it is desirable that the zeta potential (Zp) of the pads be tunable over a wide range of conditions at different pH values. Implementations of the present disclosure include methods for increasing the hydrophilicity and tuning the Zp of the pads with anionic additives and pads produced using these methods.
    Type: Grant
    Filed: October 30, 2019
    Date of Patent: December 26, 2023
    Assignee: Applied Materials, Inc.
    Inventors: Uma Sridhar, Sivapackia Ganapathiappan, Ashwin Chockalingam, Yingdong Luo, Daniel Redfield, Rajeev Bajaj, Nag B. Patibandla, Hou T. Ng, Sudhakar Madhusoodhanan
  • Patent number: 11826876
    Abstract: In one implementation, a method of forming a porous polishing pad is provided. The method comprises depositing a plurality of composite layers with a 3D printer to reach a target thickness. Depositing the plurality of composite layers comprises dispensing one or more droplets of a curable resin precursor composition onto a support. Depositing the plurality of composite layers further comprises dispensing one or more droplets of a porosity-forming composition onto the support, wherein at least one component of the porosity-forming composition is removable to form the pores in the porous polishing pad.
    Type: Grant
    Filed: April 4, 2019
    Date of Patent: November 28, 2023
    Assignee: Applied Materials, Inc.
    Inventors: Sivapackia Ganapathiappan, Boyi Fu, Ashwin Chockalingam, Ankit Vora, Daniel Redfield, Rajeev Bajaj, Nag B. Patibandla, Hou T. Ng, Sudhakar Madhusoodhanan
  • Patent number: 11813712
    Abstract: Polishing pads having discrete and selectively arranged regions of varying porosity within a continuous phase of polymer material are provided herein. In one embodiment a polishing pad features a plurality of polishing elements each comprising a polishing surface and sidewalls extending downwardly from the polishing surface to define a plurality of channels disposed between the polishing elements, wherein one or more of the polishing elements is formed of a continuous phase of polymer material having one or more first regions comprising a first porosity and a second region comprising a second porosity, wherein the second porosity is less than the first porosity.
    Type: Grant
    Filed: September 29, 2020
    Date of Patent: November 14, 2023
    Assignee: Applied Materials, Inc.
    Inventors: Aniruddh Jagdish Khanna, Jason G. Fung, Puneet Narendra Jawali, Rajeev Bajaj, Adam Wade Manzonie, Nandan Baradanahalli Kenchappa, Veera Raghava Reddy Kakireddy, Joonho An, Jaeseok Kim, Mayu Yamamura
  • Patent number: 11806829
    Abstract: Embodiments herein generally relate to polishing pads and method of forming polishing pads. In one embodiment, a polishing pad having a polishing surface that is configured to polish a surface of a substrate is provided. The polishing pad includes a polishing layer. At least a portion of the polishing layer comprises a continuous phase of polishing material featuring a plurality of first regions having a first pore-feature density and a plurality of second regions having a second pore-feature density that is different from the first pore-feature density. The plurality of first regions are distributed in a pattern in an X-Y plane of the polishing pad in a side-by-side arrangement with the plurality of second regions and individual portions or ones of the plurality of first regions are interposed between individual portions or ones of the plurality of second regions.
    Type: Grant
    Filed: June 19, 2020
    Date of Patent: November 7, 2023
    Assignee: Applied Materials, Inc.
    Inventors: Puneet Narendra Jawali, Nandan Baradanahalli Kenchappa, Jason G. Fung, Shiyan Akalanka Jayanath Wewala Gonnagahadeniyage, Rajeev Bajaj, Adam Wade Manzonie, Andrew Scott Lawing
  • Publication number: 20230330805
    Abstract: Implementations disclosed herein generally relate to polishing articles and methods for manufacturing polishing articles used in polishing processes. More specifically, implementations disclosed herein relate to porous polishing pads produced by processes that yield improved polishing pad properties and performance, including tunable performance. Additive manufacturing processes, such as three-dimensional printing processes provides the ability to make porous polishing pads with unique properties and attributes.
    Type: Application
    Filed: April 24, 2023
    Publication date: October 19, 2023
    Applicant: Applied Materials, Inc.
    Inventors: Sivapackia GANAPATHIAPPAN, Nag B. PATIBANDLA, Rajeev BAJAJ, Daniel REDFIELD, Fred C. REDEKER, Mahendra C. ORILALL, Boyi FU, Mayu YAMAMURA, Ashwin CHOCKALINGAM
  • Patent number: 11772229
    Abstract: Embodiments of the present disclosure relate to advanced polishing pads with tunable chemical, material and structural properties, and new methods of manufacturing the same. According to one or more embodiments of the disclosure, it has been discovered that a polishing pad with improved properties may be produced by an additive manufacturing process, such as a three-dimensional (3D) printing process. Embodiments of the present disclosure thus may provide an advanced polishing pad that has discrete features and geometries, formed from at least two different materials that include functional polymers, functional oligomers, reactive diluents, addition polymer precursor compounds, catalysts, and curing agents.
    Type: Grant
    Filed: March 11, 2019
    Date of Patent: October 3, 2023
    Assignee: Applied Materials, Inc.
    Inventors: Sivapackia Ganapathiappan, Boyi Fu, Ashwin Chockalingam, Daniel Redfield, Rajeev Bajaj, Mahendra C. Orilall, Hou T. Ng, Jason G. Fung, Mayu Yamamura
  • Publication number: 20230294239
    Abstract: Methods and formulations for manufacturing polishing articles used in polishing processes are provided. In one implementation, a UV curable resin precursor composition is provided. The UV curable resin precursor comprises a precursor formulation. The precursor formulation comprises a first resin precursor component that comprises a semi-crystalline radiation curable oligomeric material, wherein the semi-crystalline radiation curable oligomeric material is selected from a semi-crystalline aliphatic polyester urethane acrylate, a semi-crystalline aliphatic polycarbonate urethane acrylate, a semi-crystalline aliphatic polyether urethane acrylate, or combinations thereof. The precursor formulation further comprises a second resin precursor component that comprises a monofunctional or multifunctional acrylate monomer.
    Type: Application
    Filed: May 25, 2023
    Publication date: September 21, 2023
    Inventors: Sivapackia GANAPATHIAPPAN, Ankit VORA, Boyi FU, Venkat HARIHARAN, Mayu YAMAMURA, Mario CORNEJO, Igor ABRAMSON, Mo YANG, Daniel REDFIELD, Rajeev BAJAJ, Nag B. PATIBANDLA
  • Publication number: 20230278159
    Abstract: A method of fabricating a polishing layer of a polishing pad includes successively depositing a plurality of layers with a 3D printer, each layer of the plurality of polishing layers deposited by ejecting a pad material precursor from a nozzle and solidifying the pad material precursor to form a solidified pad material.
    Type: Application
    Filed: May 11, 2023
    Publication date: September 7, 2023
    Inventors: Rajeev Bajaj, Barry Lee Chin, Terrance Y. Lee
  • Patent number: 11745302
    Abstract: Embodiments of the present disclosure relate to advanced polishing pads with tunable chemical, material and structural properties, and new methods of manufacturing the same. According to one or more embodiments of the disclosure, it has been discovered that a polishing pad with improved properties may be produced by an additive manufacturing process, such as a three-dimensional (3D) printing process. Embodiments of the present disclosure thus may provide an advanced polishing pad that has discrete features and geometries, formed from at least two different materials that include functional polymers, functional oligomers, reactive diluents, addition polymer precursor compounds, catalysts, and curing agents.
    Type: Grant
    Filed: March 22, 2021
    Date of Patent: September 5, 2023
    Assignee: APPLIED MATERIALS, INC.
    Inventors: Sivapackia Ganapathiappan, Boyi Fu, Ashwin Chockalingam, Daniel Redfield, Rajeev Bajaj, Mahendra C. Orilall, Hou T. Ng, Jason G. Fung, Mayu Yamamura
  • Publication number: 20230256560
    Abstract: A method of forming a polishing pad that has a polishing region and a window region, wherein both regions are made of an interpenetrating polymer network formed from a free-radically polymerized material and a cationically polymerized material.
    Type: Application
    Filed: April 21, 2023
    Publication date: August 17, 2023
    Inventors: Uma Sridhar, Sivapackia Ganapathiappan, Ashwin Murugappan Chockalingam, Rajeev Bajaj, Daniel Redfield, Mayu Felicia Yamamura, Yingdong Luo, Nag B. Patibandla
  • Patent number: 11724362
    Abstract: Embodiments of the present disclosure relate to advanced polishing pads with tunable chemical, material and structural properties, and new methods of manufacturing the same. According to one or more embodiments of the disclosure, it has been discovered that a polishing pad with improved properties may be produced by an additive manufacturing process, such as a three-dimensional (3D) printing process. Embodiments of the present disclosure thus may provide an advanced polishing pad that has discrete features and geometries, formed from at least two different materials that include functional polymers, functional oligomers, reactive diluents, and curing agents. For example, the advanced polishing pad may be formed from a plurality of polymeric layers, by the automated sequential deposition of at least one resin precursor composition followed by at least one curing step, wherein each layer may represent at least one polymer composition, and/or regions of different compositions.
    Type: Grant
    Filed: December 8, 2020
    Date of Patent: August 15, 2023
    Assignee: APPLIED MATERIALS, INC.
    Inventors: Rajeev Bajaj, Daniel Redfield, Mahendra C. Orilall, Boyi Fu, Aniruddh Jagdish Khanna, Jason G. Fung, Ashwin Chockalingam, Mayu Yamamura, Veera Raghava Reddy Kakireddy, Gregory E. Menk, Nag B. Patibandla
  • Publication number: 20230219190
    Abstract: Interpenetrating polymer networks (IPNs) for a forming polishing pad for a semiconductor fabrication operation are disclosed. Techniques for forming the polishing pads are provided. In an exemplary embodiment, a polishing pad includes an interpenetrating polymer network formed from a free-radically polymerized material and a cationically polymerized material.
    Type: Application
    Filed: March 21, 2023
    Publication date: July 13, 2023
    Inventors: Uma Sridhar, Sivapackia Ganapathiappan, Ashwin Murugappan Chockalingam, Mayu Felicia Yamamura, Daniel Redfield, Rajeev Bajaj, Yingdong Luo, Nag B. Patibandla
  • Patent number: 11685014
    Abstract: Methods and formulations for manufacturing polishing articles used in polishing processes are provided. In one implementation, a UV curable resin precursor composition is provided. The UV curable resin precursor comprises a precursor formulation. The precursor formulation comprises a first resin precursor component that comprises a semi-crystalline radiation curable oligomeric material, wherein the semi-crystalline radiation curable oligomeric material is selected from a semi-crystalline aliphatic polyester urethane acrylate, a semi-crystalline aliphatic polycarbonate urethane acrylate, a semi-crystalline aliphatic polyether urethane acrylate, or combinations thereof. The precursor formulation further comprises a second resin precursor component that comprises a monofunctional or multifunctional acrylate monomer.
    Type: Grant
    Filed: August 2, 2019
    Date of Patent: June 27, 2023
    Assignee: Applied Materials, Inc.
    Inventors: Sivapackia Ganapathiappan, Ankit Vora, Boyi Fu, Venkat Hariharan, Mayu Yamamura, Mario Cornejo, Igor Abramson, Mo Yang, Daniel Redfield, Rajeev Bajaj, Nag B. Patibandla
  • Patent number: 11673225
    Abstract: A method of fabricating a polishing layer of a polishing pad includes successively depositing a plurality of layers with a 3D printer, each layer of the plurality of polishing layers deposited by ejecting a pad material precursor from a nozzle and solidifying the pad material precursor to form a solidified pad material.
    Type: Grant
    Filed: December 17, 2021
    Date of Patent: June 13, 2023
    Assignee: Applied Materials, Inc.
    Inventors: Rajeev Bajaj, Barry Lee Chin, Terrance Y. Lee
  • Patent number: 11638979
    Abstract: A polishing pad for a semiconductor fabrication operation includes a polishing region and a window region, wherein both regions are made of an interpenetrating polymer network formed from a free-radically polymerized material and a cationically polymerized material.
    Type: Grant
    Filed: June 9, 2020
    Date of Patent: May 2, 2023
    Assignee: Applied Materials, Inc.
    Inventors: Uma Sridhar, Sivapackia Ganapathiappan, Ashwin Murugappan Chockalingam, Rajeev Bajaj, Daniel Redfield, Mayu Felicia Yamamura, Yingdong Luo, Nag B. Patibandla
  • Patent number: 11612978
    Abstract: Interpenetrating polymer networks (IPNs) for a forming polishing pad for a semiconductor fabrication operation are disclosed. Techniques for forming the polishing pads are provided. In an exemplary embodiment, a polishing pad includes an interpenetrating polymer network formed from a free-radically polymerized material and a cationically polymerized material.
    Type: Grant
    Filed: June 9, 2020
    Date of Patent: March 28, 2023
    Assignee: Applied Materials, Inc.
    Inventors: Uma Sridhar, Sivapackia Ganapathiappan, Ashwin Murugappan Chockalingam, Mayu Felicia Yamamura, Daniel Redfield, Rajeev Bajaj, Yingdong Luo, Nag B. Patibandla
  • Publication number: 20230080430
    Abstract: Embodiments herein generally relate to polishing pads and methods of forming polishing pads. A polishing pad includes a plurality of polishing elements. Each polishing element comprises an individual surface that forms a portion of a polishing surface of the polishing pad and one or more sidewalls extending downwardly from the individual surface to define a plurality of channels disposed between the polishing elements. Each of the polishing elements has a plurality of pore-features formed therein. Each of the polishing elements is formed of a pre-polymer composition and a sacrificial material composition. In some cases, a sample of the cured pre-polymer composition has a glass transition temperature (Tg) of about 80° C. or greater. A storage modulus (E?) of the cured pre-polymer composition at a temperature of 80° C. (E?80) can be about 200 MPa or greater.
    Type: Application
    Filed: September 10, 2021
    Publication date: March 16, 2023
    Inventors: Sivapackia GANAPATHIAPPAN, Rajeev Bajaj, Yingdong Luo, Aniruddh Jagdish Khanna, You Wang, Daniel Redfield
  • Patent number: 11597052
    Abstract: A chemical mechanical polishing apparatus includes a platen to hold a polishing pad, a carrier to hold a substrate against a polishing surface of the polishing pad during a polishing process, a dispenser to supply a polishing liquid to the polishing surface, and a temperature control system including a body configured to contact the polishing surface or the polishing liquid on the polishing surface. The body supports a thermal control module positioned over the polishing pad.
    Type: Grant
    Filed: June 21, 2019
    Date of Patent: March 7, 2023
    Assignee: Applied Materials, Inc.
    Inventors: Hari Soundararajan, Shou-Sung Chang, Haosheng Wu, Jianshe Tang, Jeonghoon Oh, Rajeev Bajaj, Andrew Siordia
  • Patent number: 11597054
    Abstract: A method of fabricating an object using an additive manufacturing system includes receiving data indicative of a desired shape of the object to be fabricated by droplet ejection. The desired shape defines a profile including a top surface and one or more recesses. Data indicative of a pattern of dispensing feed material is generated to at least partially compensate for distortions of the profile caused by the additive manufacturing system, and a plurality of layers of the feed material are dispensed by droplet ejection in accordance to the pattern.
    Type: Grant
    Filed: September 17, 2021
    Date of Patent: March 7, 2023
    Assignee: Applied Materials, Inc.
    Inventors: Mayu Felicia Yamamura, Jason Garcheung Fung, Daniel Redfield, Rajeev Bajaj, Hou T. Ng
  • Publication number: 20230063929
    Abstract: Embodiments described herein relate to layered structures having a top surface which is hydrophobic for reducing the wetting of water or ice on the layered structure without requiring reapplication. In one or more embodiments, a layered structure is provided and includes a coating containing silicon, oxygen, and carbon disposed over a substrate and an interface disposed between the substrate and the coating. The substrate is at least partially transparent to visible light, a concentration of carbon in the coating is greater at a top surface of the coating than the interface, and the top surface of the coating is disposed on the opposite side of the coating than the interface.
    Type: Application
    Filed: November 7, 2022
    Publication date: March 2, 2023
    Inventors: Rajeev BAJAJ, Mei CHANG, Deenesh PADHI