Patents by Inventor Rajeev Joshi

Rajeev Joshi has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 11961088
    Abstract: An embodiment of the present invention is directed to a Temporal CVV2 of CVV, which may be represented as a temporary three digit number generated using unique credentials associated with a card product. According to an embodiment of the present invention, the Temporal CVV2 may be generated for each transaction request or other defined set of transactions based on one or more factors, including time period/limit, usage, fraud/risk considerations. With this solution, a customer may request a new Temporal CVV2 each time a purchase is initiated. This may include online purchases, e-commerce transactions, manual link and provision requests, customer authentication for servicing channels, etc. An embodiment of the present invention seeks to mitigate risk and provide a safer and secure solution for customers while providing flexibility to make various purchases before a new card arrives.
    Type: Grant
    Filed: April 21, 2020
    Date of Patent: April 16, 2024
    Assignee: JPMORGAN CHASE BANK, N.A.
    Inventors: Sridhar Aravamudhan, Anishkumar C. Patel, Rajeev Kumar Balasubramanian, Brian P. Dunphe, David Christopher Carey, Jonathan Rosner, Shruti K. Patel, Deepak Joshi
  • Patent number: 11899676
    Abstract: At least some embodiments are directed to an entity matching detection system. The entity matching detection system includes a latent similarity identification machine learning model that receives one or more data records and generates a final similarity score indicative of a latent similarity between the one or more data records and a second data record. The entity matching detection system can identify lexical and semantic similarities between attribute values and can analyze and compute similarity scores for direct-linked attribute values and cross-linked attribute values extracted from different data records.
    Type: Grant
    Filed: December 12, 2022
    Date of Patent: February 13, 2024
    Assignee: AMERICAN EXPRESS TRAVEL RELATED SERVICES COMPANY, INC.
    Inventors: Arpan Somani, Salil Rajeev Joshi, Shourya Roy
  • Patent number: 11798666
    Abstract: A computing system for redirecting electronic prescription refills is disclosed herein. A server computer device executing an electronic health records application constructs an electronic prescription for a patient and causes the electronic prescription to be routed to a first pharmacy device of a first pharmacy. The electronic prescription includes at least one refill. Subsequently, the server computing device receives an identifier for the electronic prescription and an identifier for a second pharmacy from a second server computing device executing a patient portal application, wherein the identifier for the second pharmacy is specified by the patient. The server computing device identifies the electronic prescription, determines a number of refills remaining on the electronic prescription, and constructs a second electronic prescription including the number of refills.
    Type: Grant
    Filed: August 31, 2021
    Date of Patent: October 24, 2023
    Assignee: Allscripts Software, LLC
    Inventors: Igor Chmil, Stanislav Makarskyy, Nikhil Rajeev Joshi, Anu Jindal
  • Publication number: 20230177059
    Abstract: At least some embodiments are directed to an entity matching detection system. The entity matching detection system includes a latent similarity identification machine learning model that receives one or more data records and generates a final similarity score indicative of a latent similarity between the one or more data records and a second data record. The entity matching detection system can identify lexical and semantic similarities between attribute values and can analyze and compute similarity scores for direct-linked attribute values and cross-linked attribute values extracted from different data records.
    Type: Application
    Filed: December 12, 2022
    Publication date: June 8, 2023
    Applicant: American Express Travel Related Services Company, Inc.
    Inventors: Arpan SOMANI, Salil Rajeev JOSHI, Shourya ROY
  • Patent number: 11526523
    Abstract: At least some embodiments are directed to an entity matching detection system. The entity matching detection system includes a latent similarity identification machine learning model that receives one or more data records and generates a final similarity score indicative of a latent similarity between the one or more data records and a second data record. The entity matching detection system can identify lexical and semantic similarities between attribute values and can analyze and compute similarity scores for direct-linked attribute values and cross-linked attribute values extracted from different data records.
    Type: Grant
    Filed: January 28, 2021
    Date of Patent: December 13, 2022
    Assignee: American Express Travel Related Services Company, Inc.
    Inventors: Arpan Somani, Salil Rajeev Joshi, Shourya Roy
  • Patent number: 11200042
    Abstract: A method includes providing, by a healthcare software provider, an updated version of a healthcare software application; maintaining a list of events each mapped to one or more actions to be taken upon occurrence of such event; generating, by an instance of the updated version of the healthcare software application running on an electronic device, a log of events representing user actions; looking up in the maintained list of events, based on the occurrence of a logged event, a mapped action to take in response thereto, the mapped action being to provide a first user notification; and providing, in the healthcare software application, the first user notification.
    Type: Grant
    Filed: May 18, 2016
    Date of Patent: December 14, 2021
    Assignee: Allscripts Software, LLC
    Inventor: Nikhil Rajeev Joshi
  • Patent number: 11114191
    Abstract: A computing system for redirecting electronic prescription refills is disclosed herein. A server computer device executing an electronic health records application constructs an electronic prescription for a patient and causes the electronic prescription to be routed to a first pharmacy device of a first pharmacy. The electronic prescription includes at least one refill. Subsequently, the server computing device receives an identifier for the electronic prescription and an identifier for a second pharmacy from a second server computing device executing a patient portal application, wherein the identifier for the second pharmacy is specified by the patient. The server computing device identifies the electronic prescription, determines a number of refills remaining on the electronic prescription, and constructs a second electronic prescription including the number of refills.
    Type: Grant
    Filed: June 7, 2018
    Date of Patent: September 7, 2021
    Assignee: ALLSCRIPTS SOFTWARE, LLC
    Inventors: Igor Chmil, Stanislav Makarskyy, Nikhil Rajeev Joshi, Anu Jindal
  • Publication number: 20210248149
    Abstract: At least some embodiments are directed to an entity matching detection system. The entity matching detection system includes a latent similarity identification machine learning model that receives one or more data records and generates a final similarity score indicative of a latent similarity between the one or more data records and a second data record. The entity matching detection system can identify lexical and semantic similarities between attribute values and can analyze and compute similarity scores for direct-linked attribute values and cross-linked attribute values extracted from different data records.
    Type: Application
    Filed: January 28, 2021
    Publication date: August 12, 2021
    Inventors: Arpan Somani, Salil Rajeev Joshi, Shourya Roy
  • Patent number: 10777309
    Abstract: A computing system for generating a delayed electronic prescription for a controlled substance is disclosed herein. A server computer device receives precursor data for an electronic prescription for a controlled substance that is to be prescribed to a patient from a client computing device operated by a healthcare worker. The server computing device transmits the precursor data to a second server computing device. The second server computing device then transmits a request for an identity of a pharmacy that is to provide the controlled substance to a patient computing device operated by the patient. The patient computing device receives input causing the identity for the pharmacy to be received by the server computing device. The server computing device constructs the electronic prescription using the precursor data and the identity of the pharmacy and signs the electronic prescription with an electronic signature for the healthcare worker.
    Type: Grant
    Filed: March 2, 2018
    Date of Patent: September 15, 2020
    Assignee: ALLSCRIPTS SOFTWARE, LLC
    Inventors: Nikhil Rajeev Joshi, Igor Chmil
  • Patent number: 9159656
    Abstract: Semiconductor die packages are disclosed. An exemplary semiconductor die package includes a premolded substrate. The premolded substrate can have a semiconductor die attached to it, and an encapsulating material may be disposed over the semiconductor die.
    Type: Grant
    Filed: September 5, 2013
    Date of Patent: October 13, 2015
    Assignee: Fairchild Semiconductor Corporation
    Inventors: Oseob Jeon, Yoonhwa Choi, Boon Huan Gooi, Maria Cristina B. Estacio, David Chong, Tan Teik Keng, Shibaek Nam, Rajeev Joshi, Chung-Lin Wu, Venkat Iyer, Lay Yeap Lim, Byoung-Ok Lee
  • Patent number: 9053853
    Abstract: Embodiments of the present invention relate to a method of forming a magnetics package. The method includes providing a primary coil configured to conduct a current flow; providing a substrate having a surface and a secondary coil extending from the surface, the secondary coil configured to conduct a current flow; encapsulating the secondary coil in a secondary mold compound; removing the substrate from the secondary coil, thereby leaving the secondary coil embedded in the secondary mold compound; and inductively coupling the secondary coil to the primary coil through a magnetic core, the secondary coil is electrically isolated from the primary coil, wherein a current flow in the primary coil produces a magnetic field in the magnetic core, and the magnetic field in the magnetic core induces a current flow in the secondary coil.
    Type: Grant
    Filed: November 23, 2012
    Date of Patent: June 9, 2015
    Assignee: Flextronics AP, LLC
    Inventor: Rajeev Joshi
  • Publication number: 20140167238
    Abstract: Semiconductor die packages are disclosed. An exemplary semiconductor die package includes a premolded substrate. The premolded substrate can have a semiconductor die attached to it, and an encapsulating material may be disposed over the semiconductor die.
    Type: Application
    Filed: September 5, 2013
    Publication date: June 19, 2014
    Applicant: FAIRCHILD SEMICONDUCTOR CORPORATION
    Inventors: Oseob Jeon, Yoonhwa Choi, Boon Huan Gooi, Maria Cristina B. Estacio, David Chong, Tan Teik Keng, Shibaek Nam, Rajeev Joshi, Chung-Lin Wu, Venkat Iyer, Lay Yeap Lim, Byoung-Ok Lee
  • Patent number: 8679896
    Abstract: Methods and systems are described for enabling the efficient fabrication of small form factor power converters and also the small form factor power converter devices.
    Type: Grant
    Filed: April 2, 2013
    Date of Patent: March 25, 2014
    Assignee: National Semiconductor Corporation
    Inventors: Rajeev Joshi, Jaime Bayan, Ashok S. Prabhu
  • Patent number: 8664752
    Abstract: Semiconductor die packages are disclosed. An exemplary semiconductor die package includes a premolded substrate. The premolded substrate can have a semiconductor die attached to it, and an encapsulating material may be disposed over the semiconductor die.
    Type: Grant
    Filed: March 26, 2012
    Date of Patent: March 4, 2014
    Assignee: Fairchild Semiconductor Corporation
    Inventors: Oseob Jeon, Yoonhwa Choi, Boon Huan Gooi, Maria Cristina B. Estacio, David Chong, Tan Teik Keng, Shibaek Nam, Rajeev Joshi, Chung-Lin Wu, Venkat Iyer, Lay Yeap Lim, Byoung-Ok Lee
  • Patent number: 8609978
    Abstract: A leadframe based photovoltaic assembly and method for assembling the same is disclosed. The photovoltaic assembly comprises a first and second mold compounds to effectuate the accurate placement of an optical concentrator above a photovoltaic cell. The photovoltaic assembly is able to be assembled using existing mature semiconductor packaging technologies.
    Type: Grant
    Filed: February 6, 2008
    Date of Patent: December 17, 2013
    Assignee: Flextronics AP, LLC
    Inventor: Rajeev Joshi
  • Patent number: 8541890
    Abstract: A semiconductor die package is disclosed. In one embodiment, the semiconductor die package has a substrate. It includes (i) a lead frame structure including a die attach region with a die attach surface and a lead having a lead surface, and (ii) a molding material. The die attach surface and the lead surface are exposed through the molding material. A semiconductor die is on the die attach region, and the semiconductor die is electrically coupled to the lead.
    Type: Grant
    Filed: July 12, 2005
    Date of Patent: September 24, 2013
    Assignee: Fairchild Semiconductor Corporation
    Inventor: Rajeev Joshi
  • Patent number: 8524532
    Abstract: One aspect of the invention pertains to an integrated circuit package with an embedded power stage. The integrated circuit package includes a first field effect transistor (FET) and a second FET that are electrically coupled with one another. The FETs are embedded in a dielectric substrate that is formed from multiple dielectric layers. The dielectric layers are laminated together with one or more foil layers that help form an electrical interconnect for the package. Various embodiments relate to method of forming the above package.
    Type: Grant
    Filed: February 27, 2012
    Date of Patent: September 3, 2013
    Assignee: Texas Instruments Incorporated
    Inventor: Rajeev Joshi
  • Publication number: 20130221442
    Abstract: One aspect of the invention pertains to an integrated circuit package with an embedded power stage. The integrated circuit package includes a first field effect transistor (FET) and a second FET that are electrically coupled with one another. The FETs are embedded in a dielectric substrate that is formed from multiple dielectric layers. The dielectric layers are laminated together with one or more foil layers that help form an electrical interconnect for the package. Various embodiments relate to method of forming the above package.
    Type: Application
    Filed: February 27, 2012
    Publication date: August 29, 2013
    Applicant: TEXAS INSTRUMENTS INCORPORATED
    Inventor: Rajeev JOSHI
  • Publication number: 20120326287
    Abstract: Methods and systems are described for enabling the efficient fabrication of small form factor power converters and also the small form factor power converter devices.
    Type: Application
    Filed: June 27, 2011
    Publication date: December 27, 2012
    Applicant: NATIONAL SEMICONDUCTOR CORPORATION
    Inventors: Rajeev Joshi, Jaime A. Bayan, Ashok S. Prabhu
  • Patent number: 8339231
    Abstract: A magnetics package comprising: a primary coil configured to conduct a current flow; a secondary coil electrically isolated from the primary coil and configured to conduct a current flow, wherein the secondary coil is embedded in a mold compound; and a magnetic core inductively coupling the primary coil and the secondary coil, wherein a current flow in the primary coil produces a magnetic field in the magnetic core, and the magnetic field in the magnetic core induces a current flow in the secondary coil.
    Type: Grant
    Filed: March 22, 2010
    Date of Patent: December 25, 2012
    Assignee: Flextronics AP, LLC
    Inventor: Rajeev Joshi