Patents by Inventor Rajeev

Rajeev has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 12003306
    Abstract: A system and method for selecting a beam from satellite beams to communicate with a terminal at a location. The method includes dividing a satellite coverage area into beam service areas (BSAs) for a satellite network, where each of the BSAs is associated with a respective beam information; selecting, with a computer, a select BSA from the BSAs based on the location; and communicating between the terminal and a gateway using a beam. In the method, the location is located in the select BSA, the beam is identified by the respective beam information associated with the select BSA, and the BSAs define a boundary having a closed polygon shape.
    Type: Grant
    Filed: November 16, 2021
    Date of Patent: June 4, 2024
    Assignee: Hughes Network Systems, LLC
    Inventors: Rajeev Oza, Suresh Korada, Guy Montgomery
  • Patent number: 12002295
    Abstract: A system and method for video authentication may apply machine learning to analyze whether a person's face captured by live video matches a face in a photo ID captured by live video and to analyze other features based on a video session with the person. For example, machine learning may be applied to analyze a set of features indicating whether the person is a real, live person (as opposed to a photo image held up over the person's face in the video, etc.). Finally, the machine learning may be applied to analyze a set of features to determine whether a lower probability prediction that the person's face captured by live video matches a face in a photo ID captured by live video should be either pass authentication (due to one or more features/circumstances mitigating the lower probability) or fail authentication (due to one or more features not mitigating the lower probability). In such a situation, the set of features may indicate that mitigating factors/conditions exist that can offset the lower probability.
    Type: Grant
    Filed: August 13, 2021
    Date of Patent: June 4, 2024
    Assignee: ACCENTURE GLOBAL SOLUTIONS LIMITED
    Inventors: Ankit Suneja, Rajeev Divakaran Nair, S. Abishek Kumar
  • Patent number: 12002030
    Abstract: The present invention provides a method and system which facilitates easy and smooth detection of available one or more Point-of-sale (POS) terminals automatically at a merchant's site when a user desires to use a user device in order to pay for services/goods availed by the user device. The present invention provides a scalable, easy to use, seamless, and an efficient method to detect the POS terminals over a Wi-Fi network available to the user equipment. Information corresponding to the detected and available POS terminals are presented on the user device so that the user may easily select an appropriate POS terminal and may initiate the further payment process. The one or more available POS terminals are detected by the user device with the help of a first server device and a second server device.
    Type: Grant
    Filed: July 6, 2019
    Date of Patent: June 4, 2024
    Assignee: JIO PLATFORMS LIMITED
    Inventors: Ajay Kumar Gupta, Vishal Vasant Oak, Anish Shah, Rajeev Gupta
  • Patent number: 12001266
    Abstract: A packaging technology to improve performance of an AI processing system resulting in an ultra-high bandwidth system. An IC package is provided which comprises: a substrate; a first die on the substrate, and a second die stacked over the first die. The first die can be a first logic die (e.g., a compute chip, CPU, GPU, etc.) while the second die can be a compute chiplet comprising ferroelectric or paraelectric logic. Both dies can include ferroelectric or paraelectric logic. The ferroelectric/paraelectric logic may include AND gates, OR gates, complex gates, majority, minority, and/or threshold gates, sequential logic, etc. The IC package can be in a 3D or 2.5D configuration that implements logic-on-logic stacking configuration. The 3D or 2.5D packaging configurations have chips or chiplets designed to have time distributed or spatially distributed processing. The logic of chips or chiplets is segregated so that one chip in a 3D or 2.5D stacking arrangement is hot at a time.
    Type: Grant
    Filed: August 20, 2021
    Date of Patent: June 4, 2024
    Assignee: Kepler Computing Inc.
    Inventors: Amrita Mathuriya, Christopher B. Wilkerson, Rajeev Kumar Dokania, Debo Olaosebikan, Sasikanth Manipatruni
  • Patent number: 12004089
    Abstract: A system and method for providing terminals with permitted power spectral density (PSD) limits for regions of a coverage area including: dividing a coverage area into regions, each region having a boundary; assigning a PSD limit to each region; receiving a location of a transmitting entity; determining a transmitting entity region from the regions based on the location; and transmitting with a respective PSD limit of the transmitting entity region.
    Type: Grant
    Filed: October 7, 2021
    Date of Patent: June 4, 2024
    Assignee: Hughes Network Systems
    Inventors: Rajeev Oza, Suresh Korada, Guy Montgomery
  • Publication number: 20240177147
    Abstract: A custodial token platform may implement smart contracts for inbound transactions and flush transactions. The platform may deploy to a blockchain ledger, a plurality of inbound smart contracts, including first inbound smart contract for a first user of a plurality of users of a custodial token platform. The plurality of smart contracts may include a second inbound smart contract for a second user of the plurality of users of the custodial token platform. The platform may deploy a batch smart contract configured to control the plurality of inbound smart contracts. The platform may broadcast a transaction that calls the batch smart contract. The transaction causes a transfer of the first set of one or more crypto tokens of the first inbound smart contract and the second set of one or more crypto tokens of the second inbound smart contract to an outbound address of the custodial token platform.
    Type: Application
    Filed: November 28, 2022
    Publication date: May 30, 2024
    Inventors: Hao Wen, Jiangchuan He, Nate Welch, Hui Xie, Vignesh Muralidharan, Rajeev Vishaka
  • Patent number: 11994724
    Abstract: An optical input/output chiplet is disposed on a first package substrate. The optical input/output chiplet includes one or more supply optical ports for receiving continuous wave light. The optical input/output chiplet includes one or more transmit optical ports through which modulated light is transmitted. The optical input/output chiplet includes one or more receive optical ports through which modulated light is received by the optical input/output chiplet. An optical power supply module is disposed on a second package substrate. The second package substrate is separate from the first package substrate. The optical power supply module includes one or more output optical ports through which continuous wave laser light is transmitted. A set of optical fibers optically connect the one or more output optical ports of the optical power supply module to the one or more supply optical ports of the optical input/output chiplet.
    Type: Grant
    Filed: February 14, 2022
    Date of Patent: May 28, 2024
    Assignee: Ayar Labs, Inc.
    Inventors: Alexandra Wright, Mark Wade, Chen Sun, Vladimir Stojanovic, Rajeev Ram, Milos Popovic, Roy Edward Meade, Derek Van Orden
  • Patent number: 11997853
    Abstract: A configuration for efficiently placing a group of capacitors with one terminal connected to a common node is described. The capacitors are stacked and folded along the common node. In a stack and fold configuration, devices are stacked vertically (directly or with a horizontal offset) with one terminal of the devices being shared to a common node, and further the capacitors are placed along both sides of the common node. The common node is a point of fold. In one example, the devices are capacitors. N number of capacitors can be divided in L number of stack layers such that there are N/L capacitors in each stacked layer. The N/L capacitors are shorted together with an electrode (e.g., bottom electrode). The electrode can be metal, a conducting oxide, or a combination of a conducting oxide and a barrier material. The capacitors can be planar, non-planar or replaced by memory elements.
    Type: Grant
    Filed: March 10, 2022
    Date of Patent: May 28, 2024
    Assignee: Kepler Computing Inc.
    Inventors: Rajeev Kumar Dokania, Amrita Mathuriya, Debo Olaosebikan, Tanay Gosavi, Noriyuki Sato, Sasikanth Manipatruni
  • Patent number: 11997505
    Abstract: A method and apparatus for planning a wireless communication network operating in a spectrum-controlled radio band and determining spectrum availability at an enterprise location. A plurality of network models are generated using machine learning techniques, the network models are provided to a network planner unit, input is received regarding intended deployment, and spectrum availability is determined responsive to the enterprise location. The number of BS/APs needed is estimated, and an enterprise network may be planned and deployed. The enterprise network is monitored, and if network operation is not meeting expected performance, the models may be retrained and the network planner updated. Spectrum availability is determined by registering a discovery group with an SAS at a location to provide spectrum availability, and repeating for each location. The method may be periodically performed to generate a time series of data which may be analyzed to provide spectrum availability.
    Type: Grant
    Filed: September 2, 2020
    Date of Patent: May 28, 2024
    Assignee: Celona, Inc.
    Inventors: Nagi Mahalingam, Mohit Goyal, Mehmet Yavuz, Rajeshwar Ponna, Rajeev Shah, Sourav Bandyopadhyay, Aparna Jaiswal
  • Patent number: 11996438
    Abstract: A device includes, in a first region, a first conductive interconnect, an electrode structure on the first conductive interconnect, where the electrode structure includes a first conductive hydrogen barrier layer and a first conductive fill material. A trench capacitor including a ferroelectric material or a paraelectric material is on the electrode structure. A second dielectric includes an amorphous, greater than 90% film density hydrogen barrier material laterally surrounds the memory device. A via electrode including a second conductive hydrogen barrier material is on at least a portion of the memory device. A second region includes a conductive interconnect structure embedded within a less than 90% film density dielectric material.
    Type: Grant
    Filed: December 15, 2021
    Date of Patent: May 28, 2024
    Assignee: Kepler Computing Inc.
    Inventors: Somilkumar J. Rathi, Noriyuki Sato, Niloy Mukherjee, Rajeev Kumar Dokania, Amrita Mathuriya, Tanay Gosavi, Pratyush Pandey, Jason Y. Wu, Sasikanth Manipatruni
  • Patent number: 11997232
    Abstract: A method and a system for routing an emergency call to a PSAP [322]. Upon receiving an emergency call request from at least one user device [302] at an eNodeB [304], an ESMLC [310] computes a current location information of the at least one user device [302]. Further, a GMLC [312] identifies a serving cell identifier for the at least one user device [302] based on the current location. Furthermore, an emergency location platform [314] identifies at least one PSAP [322] in a cell site master database [316] based on the serving cell identifier and extracts one or more parameters for the at least one user device [302] from a subscriber information database [318]. Lastly, the emergency location platform [314] provides at least one of the current location information and the one or more parameters to the identified at least one PSAP [322] on an access network channel.
    Type: Grant
    Filed: October 4, 2022
    Date of Patent: May 28, 2024
    Assignee: JIO PLATFORMS LIMITED
    Inventors: Yatin Gujar, Shilpa Salunkhe, Thiagarajan Arumugam, Rajeev Gupta
  • Publication number: 20240169273
    Abstract: A method can include receiving real-time, time series data from equipment at a wellsite that includes a wellbore in contact with a fluid reservoir; processing the time series data as input to a trained machine learning model to predict a future solids event related to influx of solids into the wellbore from the fluid reservoir; and outputting a time of the future solids event.
    Type: Application
    Filed: March 25, 2022
    Publication date: May 23, 2024
    Inventors: Garud Sridhar, Sr., Surej Kumar Subbiah, Muhammad Ibrahim, Adrian Enrique Rodriguez Herrera, Nasser Alhamad, Supriya Gupta, Assef Mohamad Hussein, Vigneshwaran Santhalingam, Rajeev Ranjan Sinha
  • Publication number: 20240170707
    Abstract: A system to manufacture an electrode layer stack is disclosed. The system can include a conveyor device to move a carrier. The system can include a first placing device to place a first electrode layer on the carrier. The system can include a first alignment device to obtain first positional information associated with the first electrode layer. The system can include a second placing device to place a second electrode layer on the first electrode layer based on the first positional information to form the electrode layer stack. The electrode layer stack can include a separator layer between the first electrode layer and the second electrode layer.
    Type: Application
    Filed: November 21, 2022
    Publication date: May 23, 2024
    Applicant: Rivian IP Holdings, LLC
    Inventors: Daniel Bayat, Susheel Teja Gogineni, Rajeev Dhiman
  • Publication number: 20240165301
    Abstract: Compositions for generating cardiac tissue are provided. The compositions may improve cardiac tissue function.
    Type: Application
    Filed: November 17, 2023
    Publication date: May 23, 2024
    Inventors: Kareen Coulombe, Kiera Dwyer, Rajeev Kant
  • Publication number: 20240172027
    Abstract: Various aspects of the present disclosure generally relate to wireless communication. In some aspects, a user equipment (UE) may receive, from a base station, a quality of experience (QoE) configuration message that includes an access stratum identifier, wherein the access stratum identifier is a shortened version of an application-level identifier associated with one or more QoE configurations. The UE may obtain application layer QoE measurements. The UE may transmit, to the base station, a QoE report that includes the application layer QoE measurements, wherein the QoE report includes the access stratum identifier to indicate that the QoE report is associated with the application-level identifier or the one or more QoE configurations. Numerous other aspects are described.
    Type: Application
    Filed: May 8, 2021
    Publication date: May 23, 2024
    Inventors: Jianhua LIU, Xipeng ZHU, Shankar KRISHNAN, Rajeev KUMAR
  • Publication number: 20240171034
    Abstract: An electric machine including a stator, a rotor within the stator, and a shaft to which the rotor is mounted. The shaft extends through the stator. A first bearing and a second bearing support the shaft within the stator to allow the shaft and the rotor to rotate within the stator. The rotor is between the first bearing and the second bearing. A first magnetic core is at the shaft between the rotor and the first bearing. The first magnetic core is configured to suppress a bearing current flowing across the shaft, the first bearing, and the second bearing.
    Type: Application
    Filed: November 22, 2022
    Publication date: May 23, 2024
    Inventors: William T. IVAN, Alireza FATEMI, Rajeev VYAS
  • Patent number: 11986922
    Abstract: Chemical mechanical polishing (CMP) apparatus and methods for manufacturing CMP apparatus are provided herein. CMP apparatus may include polishing pads, polishing head retaining rings, and polishing head membranes, among others, and the CMP apparatus may be manufactured via additive manufacturing processes, such as three dimensional (3D) printing processes. The CMP apparatus may include wireless communication apparatus components integrated therein. Methods of manufacturing CMP apparatus include 3D printing wireless communication apparatus into a polishing pad and printing a polishing pad with a recess configured to receive a preformed wireless communication apparatus.
    Type: Grant
    Filed: December 31, 2019
    Date of Patent: May 21, 2024
    Assignee: Applied Materials, Inc.
    Inventors: Jason G. Fung, Rajeev Bajaj, Daniel Redfield, Aniruddh Jagdish Khanna, Mario Cornejo, Gregory E. Menk, John Watkins
  • Patent number: 11990713
    Abstract: Apparatuses, systems, and methods to move end connectors. In at least one embodiment, a linkage system to move an end connector between at least a first position and a second position is driven by an actuator in a first direction to drive movement of the end connector in a second direction, perpendicular to the first direction.
    Type: Grant
    Filed: October 25, 2021
    Date of Patent: May 21, 2024
    Assignee: Nvidia Corporation
    Inventors: Ryan Albright, Devarshi Patel, Chris Fox, Mark White, Rajeev Jayavant, Susheela Narasimhan, Kelly McArthur, Ben Watkins
  • Patent number: 11991226
    Abstract: A system for data and signal routing for videotelephonic conferencing is provided.
    Type: Grant
    Filed: July 29, 2021
    Date of Patent: May 21, 2024
    Assignee: OPEN4SALE INTERNATIONAL PTE LTD
    Inventors: Simeon La Barrie, Rajeev Dujari
  • Patent number: 11990970
    Abstract: Systems, methods, apparatuses, and computer program products for multi-user (MU) multiple-input multiple-output (MIMO) user pairing selection are provided. One method may include selecting multi-user multiple input multiple output (MU MIMO) candidate beams using deep neural network(s) (DNNs), and selecting paired users based on the selected beams. The deep neural network(s) (DNNs) are trained to maximize multi-user priority metric (MU-PM) or a heuristic of the multi-user priority metric (MU-PM).
    Type: Grant
    Filed: June 20, 2019
    Date of Patent: May 21, 2024
    Assignee: Nokia Technologies Oy
    Inventors: Ian Dexter Garcia, Igor Filipovich, Chandrasekar Sankaran, Hua Xu, Suresh Kalyanasundaram, Jamil Shihab, Rajeev Agrawal, Anand Bedekar