Patents by Inventor Rajesh Baskaran

Rajesh Baskaran has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 10855230
    Abstract: Thermally-sensitive structures and methods for sensing the temperature in a region of a FET during device operation are described. The region may be at or near a region of highest temperature achieved in the FET. Metal resistance thermometry (MRT) can be implemented with gate or source structures to evaluate the temperature of the FET.
    Type: Grant
    Filed: August 12, 2019
    Date of Patent: December 1, 2020
    Assignee: MACOM Technology Solutions Holdings, Inc.
    Inventors: Simon John Mahon, Allen W. Hanson, Bryan Schwitter, Chuanxin Lian, Rajesh Baskaran, Frank Gao
  • Patent number: 10790787
    Abstract: Thermally-sensitive structures and methods for sensing the temperature in a region of a FET during device operation are described. The region may be at or near a region of highest temperature achieved in the FET. Metal resistance thermometry (MRT) can be implemented with gate or source structures to evaluate the temperature of the FET.
    Type: Grant
    Filed: August 12, 2019
    Date of Patent: September 29, 2020
    Assignee: MACOM TECHNOLOGY SOLUTIONS HOLDINGS, INC.
    Inventors: Simon John Mahon, Allen W. Hanson, Chuanxin Lian, Frank Gao, Rajesh Baskaran, Bryan Schwitter
  • Publication number: 20200144970
    Abstract: Thermally-sensitive structures and methods for sensing the temperature in a region of a FET during device operation are described. The region may be at or near a region of highest temperature achieved in the FET. Metal resistance thermometry (MRT) can be implemented with gate or source structures to evaluate the temperature of the FET.
    Type: Application
    Filed: August 12, 2019
    Publication date: May 7, 2020
    Applicant: MACOM Technology Solutions Holdings, Inc.
    Inventors: Simon John Mahon, Allen W. Hanson, Chuanxin Lian, Frank Gao, Rajesh Baskaran, Bryan Schwitter
  • Publication number: 20200144969
    Abstract: Thermally-sensitive structures and methods for sensing the temperature in a region of a FET during device operation are described. The region may be at or near a region of highest temperature achieved in the FET. Metal resistance thermometry (MRT) can be implemented with gate or source structures to evaluate the temperature of the FET.
    Type: Application
    Filed: August 12, 2019
    Publication date: May 7, 2020
    Applicant: MACOM Technology Solutions Holdings, Inc.
    Inventors: Simon John Mahon, Allen W. Hanson, Bryan Schwitter, Chuanxin Lian, Rajesh Baskaran, Frank Gao
  • Publication number: 20190096743
    Abstract: A method involving a barrier for preventing eutectic break-through in through-substrate vias is disclosed. The method generally includes steps (A) to (D). Step (A) may form one or more vias through a substrate. The substrate generally comprises a semiconductor. Step (B) may form a first metal layer. Step (C) may form a barrier layer. The barrier layer generally resides between the vias and the first metal layer. Step (D) may form a second metal layer. The second metal layer may be in electrical contact with the first metal layer through the vias and the barrier layer.
    Type: Application
    Filed: October 19, 2018
    Publication date: March 28, 2019
    Inventors: Allen W. Hanson, Rajesh Baskaran, Timothy E. Boles
  • Patent number: 10147642
    Abstract: A method involving a barrier for preventing eutectic break-through in through-substrate vias is disclosed. The method generally includes steps (A) to (D). Step (A) may form one or more vias through a substrate. The substrate generally comprises a semiconductor. Step (B) may form a first metal layer. Step (C) may form a barrier layer. The barrier layer generally resides between the vias and the first metal layer. Step (D) may form a second metal layer. The second metal layer may be in electrical contact with the first metal layer through the vias and the barrier layer.
    Type: Grant
    Filed: April 25, 2013
    Date of Patent: December 4, 2018
    Assignee: MACOM TECHNOLOGY SOLUTIONS HOLDINGS, INC.
    Inventors: Allen W. Hanson, Rajesh Baskaran, Timothy E. Boles
  • Patent number: 9234293
    Abstract: Processes and systems for electrolytically processing a microfeature workpiece with a first processing fluid and a counter electrode are described. Microfeature workpieces are electrolytically processed using a first processing fluid, a counter electrode, a second processing fluid, and an anion permeable barrier layer. The anion permeable barrier layer separates the first processing fluid from the second processing fluid while allowing certain anionic species to transfer between the two fluids.
    Type: Grant
    Filed: October 6, 2014
    Date of Patent: January 12, 2016
    Assignee: APPLIED Materials, Inc.
    Inventors: Rajesh Baskaran, Robert W. Batz, Jr., Bioh Kim, Thomas L. Ritzdorf, John Lee Klocke, Kyle M. Hanson
  • Publication number: 20150083600
    Abstract: Processes and systems for electrolytically processing a microfeature workpiece with a first processing fluid and a counter electrode are described. Microfeature workpieces are electrolytically processed using a first processing fluid, a counter electrode, a second processing fluid, and an anion permeable barrier layer. The anion permeable barrier layer separates the first processing fluid from the second processing fluid while allowing certain anionic species to transfer between the two fluids.
    Type: Application
    Filed: October 6, 2014
    Publication date: March 26, 2015
    Applicant: APPLIED Materials, Inc.
    Inventors: Rajesh Baskaran, Robert W. Batz, JR., Bioh Kim, Thomas L. Ritzdorf, John Lee Klocke, Kyle M. Hanson
  • Patent number: 8961771
    Abstract: Processes and systems for electrolytically processing a microfeature workpiece with a first processing fluid and an anode are described. Microfeature workpieces are electrolytically processed using a first processing fluid, an anode, a second processing fluid, and a cation permeable barrier layer. The cation permeable barrier layer separates the first processing fluid from the second processing fluid while allowing certain cationic species to transfer between the two fluids. The described processes produce deposits over repeated plating cycles that exhibit deposit properties (e.g., resistivity) within desired ranges.
    Type: Grant
    Filed: July 26, 2012
    Date of Patent: February 24, 2015
    Assignee: APPLIED Materials, Inc.
    Inventors: Rajesh Baskaran, Robert W. Batz, Jr., Bioh Kim, Tom L. Ritzdorf, John L. Klocke, Kyle M. Hanson
  • Patent number: 8928133
    Abstract: An apparatus comprising a first substrate and a second substrate. The first substrate has disposed thereon a first feature. The second substrate has disposed thereon a second feature. The first feature is configured to interlock with the second feature such that the first substrate and the second substrate are aligned by the first and the second features within a predefined accuracy.
    Type: Grant
    Filed: May 7, 2012
    Date of Patent: January 6, 2015
    Assignee: M/A-COM Technology Solutions Holdings, Inc.
    Inventor: Rajesh Baskaran
  • Patent number: 8852417
    Abstract: Processes and systems for electrolytically processing a microfeature workpiece with a first processing fluid and a counter electrode are described. Microfeature workpieces are electrolytically processed using a first processing fluid, a counter electrode, a second processing fluid, and an anion permeable barrier layer. The anion permeable barrier layer separates the first processing fluid from the second processing fluid while allowing certain anionic species to transfer between the two fluids. Some of the described processes produce deposits over repeated plating cycles that exhibit resistivity values within desired ranges.
    Type: Grant
    Filed: February 27, 2012
    Date of Patent: October 7, 2014
    Assignee: APPLIED Materials, Inc.
    Inventors: Rajesh Baskaran, Robert W. Batz, Jr., Bioh Kim, Tom L. Ritzdorf, John Lee Klocke, Kyle M. Hanson
  • Publication number: 20140246324
    Abstract: Processes and systems for electrochemical deposition of a multi-component solder by processing a microfeature workpiece with a first processing fluid and an anode are described. Microfeature workpieces are electrolytically processed using a first processing fluid, an anode, a second processing fluid, and a cation permeable barrier layer. The cation permeable barrier layer separates the first processing fluid from the second processing fluid while allowing certain cationic species to transfer between the two fluids.
    Type: Application
    Filed: February 28, 2014
    Publication date: September 4, 2014
    Applicant: APPLIED Materials, Inc.
    Inventors: Rajesh Baskaran, Robert W. Batz, JR., Bioh Kim, Thomas L. Ritzdorf, John L. Klocke, Kyle M. Hanson, Marvin L. Bernt, Ross Kulzer
  • Publication number: 20140209472
    Abstract: Processes and systems for electrolytically processing a microfeature workpiece with a first processing fluid and an anode are described. Microfeature workpieces are electrolytically processed using a first processing fluid, an anode, a second processing fluid, and a cation permeable barrier layer. The cation permeable barrier layer separates the first processing fluid from the second processing fluid while allowing certain cationic species to transfer between the two fluids. The described processes produce deposits over repeated plating cycles that exhibit deposit properties (e.g., resistivity) within desired ranges.
    Type: Application
    Filed: February 10, 2014
    Publication date: July 31, 2014
    Applicant: APPLIED MATERIALS, INC.
    Inventors: Rajesh Baskaran, Robert W. Batz, JR., Bioh Kim, Tom L. Ritzdorf, John L. Klocke, Kyle M. Hanson
  • Publication number: 20130292037
    Abstract: An apparatus comprising a first substrate and a second substrate. The first substrate has disposed thereon a first feature. The second substrate has disposed thereon a second feature. The first feature is configured to interlock with the second feature such that the first substrate and the second substrate are aligned by the first and the second features within a predefined accuracy.
    Type: Application
    Filed: May 7, 2012
    Publication date: November 7, 2013
    Inventor: Rajesh Baskaran
  • Publication number: 20120292194
    Abstract: Processes and systems for electrolytically processing a microfeature workpiece with a first processing fluid and an anode are described. Microfeature workpieces are electrolytically processed using a first processing fluid, an anode, a second processing fluid, and a cation permeable barrier layer. The cation permeable barrier layer separates the first processing fluid from the second processing fluid while allowing certain cationic species to transfer between the two fluids. The described processes produce deposits over repeated plating cycles that exhibit deposit properties (e.g., resistivity) within desired ranges.
    Type: Application
    Filed: July 26, 2012
    Publication date: November 22, 2012
    Applicant: APPLIED MATERIALS INC.
    Inventors: Rajesh Baskaran, Robert W. Batz, JR., Bioh Kim, Tom L. Ritzdorf, John L. Klocke, Kyle M. Hanson
  • Patent number: 8236159
    Abstract: Processes and systems for electrolytically processing a microfeature workpiece with a first processing fluid and an anode are described. Microfeature workpieces are electrolytically processed using a first processing fluid, an anode, a second processing fluid, and a cation permeable barrier layer. The cation permeable barrier layer separates the first processing fluid from the second processing fluid while allowing certain cationic species to transfer between the two fluids. The described processes produce deposits over repeated plating cycles that exhibit deposit properties (e.g., resistivity) within desired ranges.
    Type: Grant
    Filed: April 28, 2006
    Date of Patent: August 7, 2012
    Assignee: Applied Materials Inc.
    Inventors: Rajesh Baskaran, Robert W. Batz, Jr., Bioh Kim, Tom L. Ritzdorf, John L. Klocke, Kyle M. Hanson
  • Publication number: 20120152751
    Abstract: Processes and systems for electrolytically processing a microfeature workpiece with a first processing fluid and a counter electrode are described. Microfeature workpieces are electrolytically processed using a first processing fluid, a counter electrode, a second processing fluid, and an anion permeable barrier layer. The anion permeable barrier layer separates the first processing fluid from the second processing fluid while allowing certain anionic species to transfer between the two fluids. Some of the described processes produce deposits over repeated plating cycles that exhibit resistivity values within desired ranges.
    Type: Application
    Filed: February 27, 2012
    Publication date: June 21, 2012
    Applicant: APPLIED MATERIALS, INC.
    Inventors: Rajesh Baskaran, Robert W. Batz, JR., Bioh Kim, Tom L. Ritzdorf, John Lee Klocke, Kyle M. Hanson
  • Patent number: 8123926
    Abstract: Processes and systems for electrolytically processing a microfeature workpiece with a first processing fluid and an anode are described. Microfeature workpieces are electrolytically processed using a first processing fluid, an anode, a second processing fluid, and an anion permeable barrier layer. The anion permeable barrier layer separates the first processing fluid from the second processing fluid while allowing certain anionic species to transfer between the two fluids. The described processes produce deposits over repeated plating cycles that exhibit resistivity values within desired ranges.
    Type: Grant
    Filed: May 3, 2006
    Date of Patent: February 28, 2012
    Assignee: Applied Materials, Inc.
    Inventors: Rajesh Baskaran, Robert W Batz, Jr., Bioh Kim, Tom L Ritzdorf, John L Klocke, Kyle M Hanson
  • Patent number: 7628898
    Abstract: Methods and systems for electrochemically processing microfeature workpieces are described herein. In one embodiment, a process for electrochemically treating a surface of a plurality of microfeature workpieces in an electrochemical treating chamber that includes a processing unit separated from an electrode unit by an ion-permeable barrier is described. The process involves an idle stage wherein during the idle stage, processing fluid components are prevented from transferring between the first processing fluid and the second processing fluid. The described system includes a flow control system for controlling the flow of processing fluid to achieve separation of a processing fluid from the barrier during the idle stage.
    Type: Grant
    Filed: August 5, 2005
    Date of Patent: December 8, 2009
    Assignee: Semitool, Inc.
    Inventors: John Klocke, Kyle M. Hanson, Rajesh Baskaran
  • Publication number: 20080264774
    Abstract: Metal seed layers and/or barrier layers are treated to render them more suitable for subsequent electrochemical deposition of metals thereon. The processes employ thermal techniques to reduce metal oxides that have formed on the surface of the seed layers and/or barrier layers.
    Type: Application
    Filed: April 25, 2007
    Publication date: October 30, 2008
    Applicant: SEMITOOL, INC.
    Inventors: Rajesh Baskaran, Dakin Fulton