Patents by Inventor Rajesh Baskaran
Rajesh Baskaran has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Patent number: 11972254Abstract: A device may receive an application for transforming legacy applications into low-code/no-code applications to be managed by a low-code/no-code platform, and may execute the application for a legacy application of the legacy applications. The device may process the legacy application, with a machine learning model, to identify one or more components of the legacy application to be managed by the low-code/no-code platform, and may transform the one or more components into one or more transformed components to be managed by the low-code/no-code platform. The device may implement the one or more transformed components in the legacy application to generate a transformed legacy application, and may perform one or more actions based on the transformed legacy application.Type: GrantFiled: July 12, 2022Date of Patent: April 30, 2024Assignee: Accenture Global Solutions LimitedInventors: Rajesh Pappu, Surender Subramanian, Jeevak Balasubramaniam, Vijay Baskaran
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Patent number: 11676860Abstract: A method involving a barrier for preventing eutectic break-through in through-substrate vias is disclosed. The method generally includes steps (A) to (D). Step (A) may form one or more vias through a substrate. The substrate generally comprises a semiconductor. Step (B) may form a first metal layer. Step (C) may form a barrier layer. The barrier layer generally resides between the vias and the first metal layer. Step (D) may form a second metal layer. The second metal layer may be in electrical contact with the first metal layer through the vias and the barrier layer.Type: GrantFiled: October 19, 2018Date of Patent: June 13, 2023Assignee: MACOM TECHNOLOGY SOLUTIONS HOLDINGS, INC.Inventors: Allen W. Hanson, Rajesh Baskaran, Timothy E. Boles
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Patent number: 10855230Abstract: Thermally-sensitive structures and methods for sensing the temperature in a region of a FET during device operation are described. The region may be at or near a region of highest temperature achieved in the FET. Metal resistance thermometry (MRT) can be implemented with gate or source structures to evaluate the temperature of the FET.Type: GrantFiled: August 12, 2019Date of Patent: December 1, 2020Assignee: MACOM Technology Solutions Holdings, Inc.Inventors: Simon John Mahon, Allen W. Hanson, Bryan Schwitter, Chuanxin Lian, Rajesh Baskaran, Frank Gao
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Patent number: 10790787Abstract: Thermally-sensitive structures and methods for sensing the temperature in a region of a FET during device operation are described. The region may be at or near a region of highest temperature achieved in the FET. Metal resistance thermometry (MRT) can be implemented with gate or source structures to evaluate the temperature of the FET.Type: GrantFiled: August 12, 2019Date of Patent: September 29, 2020Assignee: MACOM TECHNOLOGY SOLUTIONS HOLDINGS, INC.Inventors: Simon John Mahon, Allen W. Hanson, Chuanxin Lian, Frank Gao, Rajesh Baskaran, Bryan Schwitter
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Publication number: 20200144970Abstract: Thermally-sensitive structures and methods for sensing the temperature in a region of a FET during device operation are described. The region may be at or near a region of highest temperature achieved in the FET. Metal resistance thermometry (MRT) can be implemented with gate or source structures to evaluate the temperature of the FET.Type: ApplicationFiled: August 12, 2019Publication date: May 7, 2020Applicant: MACOM Technology Solutions Holdings, Inc.Inventors: Simon John Mahon, Allen W. Hanson, Chuanxin Lian, Frank Gao, Rajesh Baskaran, Bryan Schwitter
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Publication number: 20200144969Abstract: Thermally-sensitive structures and methods for sensing the temperature in a region of a FET during device operation are described. The region may be at or near a region of highest temperature achieved in the FET. Metal resistance thermometry (MRT) can be implemented with gate or source structures to evaluate the temperature of the FET.Type: ApplicationFiled: August 12, 2019Publication date: May 7, 2020Applicant: MACOM Technology Solutions Holdings, Inc.Inventors: Simon John Mahon, Allen W. Hanson, Bryan Schwitter, Chuanxin Lian, Rajesh Baskaran, Frank Gao
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Publication number: 20190096743Abstract: A method involving a barrier for preventing eutectic break-through in through-substrate vias is disclosed. The method generally includes steps (A) to (D). Step (A) may form one or more vias through a substrate. The substrate generally comprises a semiconductor. Step (B) may form a first metal layer. Step (C) may form a barrier layer. The barrier layer generally resides between the vias and the first metal layer. Step (D) may form a second metal layer. The second metal layer may be in electrical contact with the first metal layer through the vias and the barrier layer.Type: ApplicationFiled: October 19, 2018Publication date: March 28, 2019Inventors: Allen W. Hanson, Rajesh Baskaran, Timothy E. Boles
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Patent number: 10147642Abstract: A method involving a barrier for preventing eutectic break-through in through-substrate vias is disclosed. The method generally includes steps (A) to (D). Step (A) may form one or more vias through a substrate. The substrate generally comprises a semiconductor. Step (B) may form a first metal layer. Step (C) may form a barrier layer. The barrier layer generally resides between the vias and the first metal layer. Step (D) may form a second metal layer. The second metal layer may be in electrical contact with the first metal layer through the vias and the barrier layer.Type: GrantFiled: April 25, 2013Date of Patent: December 4, 2018Assignee: MACOM TECHNOLOGY SOLUTIONS HOLDINGS, INC.Inventors: Allen W. Hanson, Rajesh Baskaran, Timothy E. Boles
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Patent number: 9234293Abstract: Processes and systems for electrolytically processing a microfeature workpiece with a first processing fluid and a counter electrode are described. Microfeature workpieces are electrolytically processed using a first processing fluid, a counter electrode, a second processing fluid, and an anion permeable barrier layer. The anion permeable barrier layer separates the first processing fluid from the second processing fluid while allowing certain anionic species to transfer between the two fluids.Type: GrantFiled: October 6, 2014Date of Patent: January 12, 2016Assignee: APPLIED Materials, Inc.Inventors: Rajesh Baskaran, Robert W. Batz, Jr., Bioh Kim, Thomas L. Ritzdorf, John Lee Klocke, Kyle M. Hanson
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Publication number: 20150083600Abstract: Processes and systems for electrolytically processing a microfeature workpiece with a first processing fluid and a counter electrode are described. Microfeature workpieces are electrolytically processed using a first processing fluid, a counter electrode, a second processing fluid, and an anion permeable barrier layer. The anion permeable barrier layer separates the first processing fluid from the second processing fluid while allowing certain anionic species to transfer between the two fluids.Type: ApplicationFiled: October 6, 2014Publication date: March 26, 2015Applicant: APPLIED Materials, Inc.Inventors: Rajesh Baskaran, Robert W. Batz, JR., Bioh Kim, Thomas L. Ritzdorf, John Lee Klocke, Kyle M. Hanson
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Patent number: 8961771Abstract: Processes and systems for electrolytically processing a microfeature workpiece with a first processing fluid and an anode are described. Microfeature workpieces are electrolytically processed using a first processing fluid, an anode, a second processing fluid, and a cation permeable barrier layer. The cation permeable barrier layer separates the first processing fluid from the second processing fluid while allowing certain cationic species to transfer between the two fluids. The described processes produce deposits over repeated plating cycles that exhibit deposit properties (e.g., resistivity) within desired ranges.Type: GrantFiled: July 26, 2012Date of Patent: February 24, 2015Assignee: APPLIED Materials, Inc.Inventors: Rajesh Baskaran, Robert W. Batz, Jr., Bioh Kim, Tom L. Ritzdorf, John L. Klocke, Kyle M. Hanson
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Patent number: 8928133Abstract: An apparatus comprising a first substrate and a second substrate. The first substrate has disposed thereon a first feature. The second substrate has disposed thereon a second feature. The first feature is configured to interlock with the second feature such that the first substrate and the second substrate are aligned by the first and the second features within a predefined accuracy.Type: GrantFiled: May 7, 2012Date of Patent: January 6, 2015Assignee: M/A-COM Technology Solutions Holdings, Inc.Inventor: Rajesh Baskaran
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Patent number: 8852417Abstract: Processes and systems for electrolytically processing a microfeature workpiece with a first processing fluid and a counter electrode are described. Microfeature workpieces are electrolytically processed using a first processing fluid, a counter electrode, a second processing fluid, and an anion permeable barrier layer. The anion permeable barrier layer separates the first processing fluid from the second processing fluid while allowing certain anionic species to transfer between the two fluids. Some of the described processes produce deposits over repeated plating cycles that exhibit resistivity values within desired ranges.Type: GrantFiled: February 27, 2012Date of Patent: October 7, 2014Assignee: APPLIED Materials, Inc.Inventors: Rajesh Baskaran, Robert W. Batz, Jr., Bioh Kim, Tom L. Ritzdorf, John Lee Klocke, Kyle M. Hanson
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Publication number: 20140246324Abstract: Processes and systems for electrochemical deposition of a multi-component solder by processing a microfeature workpiece with a first processing fluid and an anode are described. Microfeature workpieces are electrolytically processed using a first processing fluid, an anode, a second processing fluid, and a cation permeable barrier layer. The cation permeable barrier layer separates the first processing fluid from the second processing fluid while allowing certain cationic species to transfer between the two fluids.Type: ApplicationFiled: February 28, 2014Publication date: September 4, 2014Applicant: APPLIED Materials, Inc.Inventors: Rajesh Baskaran, Robert W. Batz, JR., Bioh Kim, Thomas L. Ritzdorf, John L. Klocke, Kyle M. Hanson, Marvin L. Bernt, Ross Kulzer
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Publication number: 20140209472Abstract: Processes and systems for electrolytically processing a microfeature workpiece with a first processing fluid and an anode are described. Microfeature workpieces are electrolytically processed using a first processing fluid, an anode, a second processing fluid, and a cation permeable barrier layer. The cation permeable barrier layer separates the first processing fluid from the second processing fluid while allowing certain cationic species to transfer between the two fluids. The described processes produce deposits over repeated plating cycles that exhibit deposit properties (e.g., resistivity) within desired ranges.Type: ApplicationFiled: February 10, 2014Publication date: July 31, 2014Applicant: APPLIED MATERIALS, INC.Inventors: Rajesh Baskaran, Robert W. Batz, JR., Bioh Kim, Tom L. Ritzdorf, John L. Klocke, Kyle M. Hanson
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Publication number: 20130292037Abstract: An apparatus comprising a first substrate and a second substrate. The first substrate has disposed thereon a first feature. The second substrate has disposed thereon a second feature. The first feature is configured to interlock with the second feature such that the first substrate and the second substrate are aligned by the first and the second features within a predefined accuracy.Type: ApplicationFiled: May 7, 2012Publication date: November 7, 2013Inventor: Rajesh Baskaran
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Publication number: 20120292194Abstract: Processes and systems for electrolytically processing a microfeature workpiece with a first processing fluid and an anode are described. Microfeature workpieces are electrolytically processed using a first processing fluid, an anode, a second processing fluid, and a cation permeable barrier layer. The cation permeable barrier layer separates the first processing fluid from the second processing fluid while allowing certain cationic species to transfer between the two fluids. The described processes produce deposits over repeated plating cycles that exhibit deposit properties (e.g., resistivity) within desired ranges.Type: ApplicationFiled: July 26, 2012Publication date: November 22, 2012Applicant: APPLIED MATERIALS INC.Inventors: Rajesh Baskaran, Robert W. Batz, JR., Bioh Kim, Tom L. Ritzdorf, John L. Klocke, Kyle M. Hanson
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Patent number: 8236159Abstract: Processes and systems for electrolytically processing a microfeature workpiece with a first processing fluid and an anode are described. Microfeature workpieces are electrolytically processed using a first processing fluid, an anode, a second processing fluid, and a cation permeable barrier layer. The cation permeable barrier layer separates the first processing fluid from the second processing fluid while allowing certain cationic species to transfer between the two fluids. The described processes produce deposits over repeated plating cycles that exhibit deposit properties (e.g., resistivity) within desired ranges.Type: GrantFiled: April 28, 2006Date of Patent: August 7, 2012Assignee: Applied Materials Inc.Inventors: Rajesh Baskaran, Robert W. Batz, Jr., Bioh Kim, Tom L. Ritzdorf, John L. Klocke, Kyle M. Hanson
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Publication number: 20120152751Abstract: Processes and systems for electrolytically processing a microfeature workpiece with a first processing fluid and a counter electrode are described. Microfeature workpieces are electrolytically processed using a first processing fluid, a counter electrode, a second processing fluid, and an anion permeable barrier layer. The anion permeable barrier layer separates the first processing fluid from the second processing fluid while allowing certain anionic species to transfer between the two fluids. Some of the described processes produce deposits over repeated plating cycles that exhibit resistivity values within desired ranges.Type: ApplicationFiled: February 27, 2012Publication date: June 21, 2012Applicant: APPLIED MATERIALS, INC.Inventors: Rajesh Baskaran, Robert W. Batz, JR., Bioh Kim, Tom L. Ritzdorf, John Lee Klocke, Kyle M. Hanson
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Patent number: 8123926Abstract: Processes and systems for electrolytically processing a microfeature workpiece with a first processing fluid and an anode are described. Microfeature workpieces are electrolytically processed using a first processing fluid, an anode, a second processing fluid, and an anion permeable barrier layer. The anion permeable barrier layer separates the first processing fluid from the second processing fluid while allowing certain anionic species to transfer between the two fluids. The described processes produce deposits over repeated plating cycles that exhibit resistivity values within desired ranges.Type: GrantFiled: May 3, 2006Date of Patent: February 28, 2012Assignee: Applied Materials, Inc.Inventors: Rajesh Baskaran, Robert W Batz, Jr., Bioh Kim, Tom L Ritzdorf, John L Klocke, Kyle M Hanson