Patents by Inventor Rajesh Baskaran

Rajesh Baskaran has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20080011450
    Abstract: Apparatus and method for thermally controlled processing of microelectronic workpieces with liquids. An apparatus in accordance with and embodiment of the invention includes a process vessel configured to carry a processing liquid, such as an electroless processing liquid. The vessel has a thermally transmissive wall for transferring heat to and/or from the processing liquid within. A heat transfer device, such as a reservoir that receives processing liquid spilling over from the process vessel, transfers heat to or from the processing liquid within the process vessel. The heat transfer device can also transfer heat to or from an internal or external heat source, such as a conduit carrying a heat transfer fluid, or an electrical resistance heater.
    Type: Application
    Filed: July 12, 2007
    Publication date: January 17, 2008
    Applicant: Semitool, Inc.
    Inventors: Kyle Hanson, Robert Batz, Rajesh Baskaran, Nolan Zimmerman, Zhongmin Hu, Gregory Wilson, Paul McHugh
  • Publication number: 20070261964
    Abstract: Reactors, systems and methods for electroplating and/or electro-etching microfeature workpieces. Reactors in accordance with the invention have a first chamber configured to direct a first processing solution to a processing zone, a second chamber configured to contain a second processing solution different than the first processing solution, and an ion exchange membrane between the first chamber and the second chamber. The reactors also include (a) a support member in the first chamber that contacts the ion exchange membrane across the surface of the membrane, and (b) a counter electrode in the second chamber. The ion exchange membrane enables a low conductivity catholyte to be used in the first chamber and an inert counter electrode in the second chamber.
    Type: Application
    Filed: May 10, 2006
    Publication date: November 15, 2007
    Applicant: Semitool, Inc.
    Inventors: Gregory Wilson, Paul McHugh, Kyle Hanson, Rajesh Baskaran
  • Patent number: 7252714
    Abstract: Apparatus and method for thermally controlled processing of microelectronic workpieces with liquids. An apparatus in accordance with and embodiment of the invention includes a process vessel configured to carry a processing liquid, such as an electroless processing liquid. The vessel has a thermally transmissive wall for transferring heat to and/or from the processing liquid within. A heat transfer device, such as a reservoir that receives processing liquid spilling over from the process vessel, transfers heat to or from the processing liquid within the process vessel. The heat transfer device can also transfer heat to or from an internal or external heat source, such as a conduit carrying a heat transfer fluid, or an electrical resistance heater.
    Type: Grant
    Filed: November 15, 2002
    Date of Patent: August 7, 2007
    Assignee: Semitool, Inc.
    Inventors: Kyle M. Hanson, Robert W. Batz, Jr., Rajesh Baskaran, Nolan Zimmerman, Zhongmin Hu, Gregory J. Wilson, Paul R. McHugh
  • Publication number: 20070068820
    Abstract: Processes and systems for electrolytically processing a microfeature workpiece with a first processing fluid and an anode are described. Microfeature workpieces are electrolytically processed using a first processing fluid, an anode, a second processing fluid, and an anion permeable barrier layer. The anion permeable barrier layer separates the first processing fluid from the second processing fluid while allowing certain anionic species to transfer between the two fluids. The described processes produce deposits over repeated plating cycles that exhibit resistivity values within desired ranges.
    Type: Application
    Filed: May 3, 2006
    Publication date: March 29, 2007
    Applicant: Semitool, Inc.
    Inventors: Rajesh Baskaran, Robert Batz, Bioh Kim, Tom Ritzdorf, John Klocke, Kyle Hanson
  • Publication number: 20060260946
    Abstract: Processes and systems for electrolytically processing a microfeature workpiece with a first processing fluid and an anode are described. Microfeature workpieces are electrolytically processed using a first processing fluid, an anode, a second processing fluid, and a cation permeable barrier layer. The cation permeable barrier layer separates the first processing fluid from the second processing fluid while allowing certain cationic species to transfer between the two fluids. The described processes produce deposits over repeated plating cycles that exhibit deposit properties (e.g., resistivity) within desired ranges.
    Type: Application
    Filed: April 28, 2006
    Publication date: November 23, 2006
    Applicant: Semitool, Inc.
    Inventors: Rajesh Baskaran, Robert Batz, Bioh Kim, Tom Ritzdorf, John Klocke, Kyle Hanson
  • Patent number: 7135404
    Abstract: The present invention is directed to a process for producing structures containing metallized features for use in microelectric workpieces. The process treats a barrier layer to promote the adhesion between the barrier layer and the metallized feature. Suitable means for promoting adhesion between barrier layers and the metallized features according to the invention include an acid treatment of the barrier layer, an electrolytic treatment of the barrier layer, or deposition of a bonding layer between the barrier layer and metallized feature. The present invention thus modifies an exterior surface of a barrier layer making it more suitable for electrodeposition of metal on a barrier, thus eliminating the need for a PVD or CVD seed layer deposition process.
    Type: Grant
    Filed: January 10, 2003
    Date of Patent: November 14, 2006
    Assignee: Semitool, Inc.
    Inventors: Rajesh Baskaran, Bioh Kim, Linlin Chen, Lyndon W Graham
  • Publication number: 20060237323
    Abstract: Processes and systems for electrolytically processing a microfeature workpiece with a first processing fluid and an anode are described. Microfeature workpieces are electrolytically processed using a first processing fluid, an anode, a second processing fluid, and a cation permeable barrier layer. The cation permeable barrier layer separates the first processing fluid from the second processing fluid while allowing certain cationic species to transfer between the two fluids. The described processes produce deposits over repeated plating cycles that exhibit deposit properties (e.g., resistivity) within desired ranges.
    Type: Application
    Filed: April 28, 2006
    Publication date: October 26, 2006
    Applicant: Semitool, Inc.
    Inventors: Rajesh Baskaran, Robert Batz, Bioh Kim, Tom Ritzdorf, John Klocke, Kyle Hanson
  • Publication number: 20060226019
    Abstract: The present invention provides a semiconductor workpiece support and contact assembly for providing localized electrical connections with the device side of the workpiece. The additional contact points help overcome the terminal effect caused by very high sheet resistance of thin barrier layers and enable plating a conformal seed layer or feature filling directly on thin barrier layers. By utilizing the streets that separate individual dice on a workpiece to make electrical connections with the workpiece and provide localized distribution of plating chemistry, the present invention provides a more uniform and conformal metallization layer.
    Type: Application
    Filed: April 7, 2006
    Publication date: October 12, 2006
    Applicant: Semitool, Inc.
    Inventors: Raymon Thompson, Paul McHugh, Daniel Woodruff, Gregory Wilson, Steve Eudy, Rajesh Baskaran
  • Publication number: 20060189129
    Abstract: The methods described are directed to processes for producing structures containing metallized features for use in microelectronic workpieces. The processes treat a barrier layer to promote the adhesion between the barrier layer and the metallized feature. Suitable means for promoting adhesion between barrier layers and metallized features include an acid treatment of the barrier layer, an electrolytic treatment of the barrier layer, or deposition of a bonding layer between the barrier layer and metallized feature. The processes described modify an exterior surface of a barrier layer making it more suitable for electrodeposition of metal on a barrier, thus eliminating the need for a PVD or CVD seed layer deposition process. According to the processes described metallized features are formed on the treated barrier layers using processes that employ ion permeable barriers.
    Type: Application
    Filed: April 28, 2006
    Publication date: August 24, 2006
    Applicant: Semitool, Inc.
    Inventors: Rajesh Baskaran, Bioh Kim, Robert Batz, Tom Ritzdorf, John Klocke, Kyle Hanson
  • Publication number: 20060163072
    Abstract: Processes and systems for electrolytically processing a microfeature workpiece with a first processing fluid and an anode are described. Microfeature workpieces are electrolytically processed using a first processing fluid, an anode, a second processing fluid, and an anion permeable barrier layer. The anion permeable barrier layer separates the first processing fluid from the second processing fluid while allowing certain anionic species to transfer between the two fluids. The described processes produce deposits over repeated plating cycles that exhibit resistivity values within desired ranges.
    Type: Application
    Filed: December 7, 2005
    Publication date: July 27, 2006
    Applicant: Semitool, Inc.
    Inventors: Rajesh Baskaran, Robert Batz, Bioh Kim, Tom Ritzdorf, John Klocke, Kyle Hanson
  • Publication number: 20060157355
    Abstract: Processes and systems for electrolytically processing a microfeature workpiece with a first processing fluid and an anode are described. Microfeature workpieces are electrolytically processed using a first processing fluid, an anode, a second processing fluid, and an anion permeable barrier layer. The anion permeable barrier layer separates the first processing fluid from the second processing fluid while allowing certain anionic species to transfer between the two fluids. The described processes produce deposits over repeated plating cycles that exhibit resistivity values within desired ranges.
    Type: Application
    Filed: December 8, 2005
    Publication date: July 20, 2006
    Applicant: Semitool, Inc.
    Inventors: Rajesh Baskaran, Robert Batz, Bioh Kim, Tom Ritzdorf, John Klocke, Kyle Hanson
  • Publication number: 20060084264
    Abstract: The present invention is directed to a process for producing structures containing metallized features for use in microelectronic workpieces. The process treats a barrier layer to promote the adhesion between the barrier layer and the metallized feature. Suitable means for promoting adhesion between barrier layers and metallized features according to the invention include an acid treatment of the barrier layer, an electrolytic treatment of the barrier layer, or deposition of a bonding layer between the barrier layer and metallized feature. The present invention thus modifies an exterior surface of a barrier layer making it more suitable for electrodeposition of metal on a barrier, thus eliminating the need for a PVD or CVD seed layer deposition process.
    Type: Application
    Filed: November 23, 2005
    Publication date: April 20, 2006
    Applicant: Semitool, Inc.
    Inventors: Rajesh Baskaran, Bioh Kim, Linlin Chen, Lyndon Graham
  • Publication number: 20060079083
    Abstract: The present invention is directed to a process for producing structures containing metallized features for use in microelectronic workpieces. The process treats a barrier layer to promote the adhesion between the barrier layer and the metallized feature. Suitable means for promoting adhesion between barrier layers and metallized features according to the invention include an acid treatment of the barrier layer, an electrolytic treatment of the barrier layer, or deposition of a bonding layer between the barrier layer and metallized feature. The present invention thus modifies an exterior surface of a barrier layer making it more suitable for electrodeposition of metal on a barrier, thus eliminating the need for a PVD or CVD seed layer deposition process.
    Type: Application
    Filed: November 23, 2005
    Publication date: April 13, 2006
    Applicant: Semitool, Inc.
    Inventors: Rajesh Baskaran, Bioh Kim, Linlin Chen, Lyndon Graham
  • Publication number: 20060079084
    Abstract: The present invention is directed to a process for producing structures containing metallized features for use in microelectronic workpieces. The process treats a barrier layer to promote the adhesion between the barrier layer and the metallized feature. Suitable means for promoting adhesion between barrier layers and metallized features according to the invention include an acid treatment of the barrier layer, an electrolytic treatment of the barrier layer, or deposition of a bonding layer between the barrier layer and metallized feature. The present invention thus modifies an exterior surface of a barrier layer making it more suitable for electrodeposition of metal on a barrier, thus eliminating the need for a PVD or CVD seed layer deposition process.
    Type: Application
    Filed: November 23, 2005
    Publication date: April 13, 2006
    Applicant: Semitool, Inc.
    Inventors: Rajesh Baskaran, Bioh Kim, Linlin Chen, Lyndon Graham
  • Publication number: 20060079085
    Abstract: The present invention is directed to a process for producing structures containing metallized features for use in microelectronic workpieces. The process treats a barrier layer to promote the adhesion between the barrier layer and the metallized feature. Suitable means for promoting adhesion between barrier layers and metallized features according to the invention include an acid treatment of the barrier layer, an electrolytic treatment of the barrier layer, or deposition of a bonding layer between the barrier layer and metallized feature. The present invention thus modifies an exterior surface of a barrier layer making it more suitable for electrodeposition of metal on a barrier, thus eliminating the need for a PVD or CVD seed layer deposition process.
    Type: Application
    Filed: November 23, 2005
    Publication date: April 13, 2006
    Applicant: Semitool, Inc.
    Inventors: Rajesh Baskaran, Bioh Kim, Linlin Chen, Lyndon Graham
  • Publication number: 20060032758
    Abstract: Methods and systems for electrochemically processing microfeature workpieces are described herein. In one embodiment, a process for electrochemically treating a surface of a plurality of microfeature workpieces in an electrochemical treating chamber that includes a processing unit separated from an electrode unit by an ion-permeable barrier is described. The process involves an idle stage wherein during the idle stage, processing fluid components are prevented from transferring between the first processing fluid and the second processing fluid. The described system includes a flow control system for controlling the flow of processing fluid to achieve separation of a processing fluid from the barrier during the idle stage.
    Type: Application
    Filed: August 5, 2005
    Publication date: February 16, 2006
    Inventors: John Klocke, Kyle Hanson, Rajesh Baskaran
  • Publication number: 20040072419
    Abstract: The present invention is directed to a process for producing structures containing metallized features for use in microelectric workpieces. The process treats a barrier layer to promote the adhesion between the barrier layer and the metallized feature. Suitable means for promoting adhesion between barrier layers and the metallized features according to the invention include an acid treatment of the barrier layer, an electrolytic treatment of the barrier layer, or deposition of a bonding layer between the barrier layer and metallized feature. The present invention thus modifies an exterior surface of a barrier layer making it more suitable for electrodeposition of metal on a barrier, thus eliminating the need for a PVD or CVD seed layer deposition process.
    Type: Application
    Filed: July 22, 2003
    Publication date: April 15, 2004
    Inventors: Rajesh Baskaran, Bioh Kim, Linlin Chen, Lyndon W. Graham
  • Publication number: 20040013808
    Abstract: Apparatus and method for thermally controlled processing of microelectronic workpieces with liquids. An apparatus in accordance with and embodiment of the invention includes a process vessel configured to carry a processing liquid, such as an electroless processing liquid. The vessel has a thermally transmissive wall for transferring heat to and/or from the processing liquid within. A heat transfer device, such as a reservoir that receives processing liquid spilling over from the process vessel, transfers heat to or from the processing liquid within the process vessel. The heat transfer device can also transfer heat to or from an internal or external heat source, such as a conduit carrying a heat transfer fluid, or an electrical resistance heater.
    Type: Application
    Filed: November 15, 2002
    Publication date: January 22, 2004
    Inventors: Kyle M. Hanson, Robert W. Batz, Rajesh Baskaran, Nolan Zimmerman, Zhongmin Hu, Gregory J. Wilson, Paul R. McHugh