Patents by Inventor Rajesh Bhaskar

Rajesh Bhaskar has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 11506702
    Abstract: An apparatus of a multi-chip package (MCP) of a functional safety system, comprises a processor to be configured as a master chip in a master-slave arrangement with a slave chip in the MCP, and a memory coupled to the processor to store one or more infield test scan patterns. The processor includes a bock to couple the master chip to the slave chip via a high-speed input/output (IO) interface to retrieve the one or more infield test scan patterns from the memory via the master chip, and to provide the one or more infield test scan patterns to the slave chip via the high-speed IO interface in response to the functional safety system entering an infield test mode.
    Type: Grant
    Filed: September 24, 2020
    Date of Patent: November 22, 2022
    Assignee: Intel Corporation
    Inventors: Asad Azam, Amit Kumar Srivastava, Enrico Carrieri, Rajesh Bhaskar
  • Publication number: 20220171669
    Abstract: An apparatus and method to monitor status of a serial data signal on a low speed serial bus is provided. A controller configures a watchdog timer in each target device, sends a heart-beat command to all of the target devices over the low speed serial bus prior to the expiration of the watchdog timer and issues a broadcast read command to any one of the target devices on the low speed serial bus. A response to the broadcast read command confirms that the low speed serial bus is functional. If a response is not received, the low speed serial bus is not functional and the controller initiates a broadcast reset command to initialize all target devices on the low speed serial bus.
    Type: Application
    Filed: February 15, 2022
    Publication date: June 2, 2022
    Inventors: Rajesh BHASKAR, George VERGIS, Myron LOEWEN, Matthew A. SCHNOOR
  • Patent number: 11334511
    Abstract: In one embodiment, an apparatus includes: a peer-to-peer (P2P) control circuit to issue a P2P communication request to a bus master of a multi-drop interconnect to request authorization to send a P2P transaction to at least one slave device coupled to the multi-drop interconnect; a transmitter to transmit the P2P transaction to the at least one slave device when the bus master grants the authorization for the P2P transaction; and another transmitter to output the clock signal to the multi-drop interconnect during the P2P transaction. Other embodiments are described and claimed.
    Type: Grant
    Filed: October 17, 2019
    Date of Patent: May 17, 2022
    Assignee: Intel Corporation
    Inventors: Rajesh Bhaskar, Enrico Carrieri, Kenneth Foust, Janusz Jurski, Myron Loewen, Matthew A. Schnoor, Amit Kumar Srivastava, George Vergis
  • Publication number: 20220006883
    Abstract: In one embodiment, an apparatus includes a unified adapter layer and a first bus controller. The unified adapter layer is to receive a first host data packet packetized in accordance with a host protocol and directed to a first device and decode the first host data packet to generate first and second data elements based on the first host data packet, the first device associated with a first device protocol. The first bus controller is coupled to the unified adapter layer and is to be coupled to the first device via a first bus. The first bus controller is to packetize the first data element in accordance with the first device protocol to generate a first device data packet for transmission to the first device in accordance with the first device protocol via the first bus and adjust a bus controller parameter based in part on the second data element. Other embodiments are described and claimed.
    Type: Application
    Filed: September 16, 2021
    Publication date: January 6, 2022
    Inventors: Amit Srivastava, Matthew A. Schnoor, Rajesh Bhaskar, Aruni P. Nelson, Enrico David Carrieri, Devon Worrell
  • Patent number: 11119704
    Abstract: In one embodiment, a flash sharing controller is to enable a plurality of components of a platform to share a flash memory. The flash sharing controller may include: a flash sharing class layer including a configuration controller to configure the plurality of components to be flash master devices and configure a flash sharing slave device for the flash memory; and a physical layer coupled to the flash sharing class layer to communicate with the plurality of components via a bus. Other embodiments are described and claimed.
    Type: Grant
    Filed: March 28, 2019
    Date of Patent: September 14, 2021
    Assignee: Intel Corporation
    Inventors: Zhenyu Zhu, Mikal Hunsaker, Karthi R. Vadivelu, Rahul Bhatt, Kenneth P. Foust, Rajesh Bhaskar, Amit Kumar Srivastava
  • Publication number: 20210224206
    Abstract: An apparatus is described. The apparatus includes a DIMM hub circuit. The DIMM hub circuit includes first bus interface circuitry, control circuitry and second bus interface circuitry. The first bus interface circuitry is to receive header information and payload information from a host. The control circuitry is to process the header information and recognize that the payload is to be passed to a target component that is coupled to the DIMM hub circuit through a second bus that is a same type of bus as the first bus. The second bus interface circuitry to send the payload information over the second bus to the target component, wherein, the payload information is to include embedded header information to be processed by the target component.
    Type: Application
    Filed: April 5, 2021
    Publication date: July 22, 2021
    Inventors: Rajesh BHASKAR, Kenneth FOUST, George VERGIS
  • Patent number: 10970239
    Abstract: An apparatus is described. The apparatus includes a DIMM hub circuit. The DIMM hub circuit includes first bus interface circuitry, control circuitry and second bus interface circuitry. The first bus interface circuitry is to receive header information and payload information from a host. The control circuitry is to process the header information and recognize that the payload is to be passed to a target component that is coupled to the DIMM hub circuit through a second bus that is a same type of bus as the first bus. The second bus interface circuitry to send the payload information over the second bus to the target component, wherein, the payload information is to include embedded header information to be processed by the target component.
    Type: Grant
    Filed: May 3, 2018
    Date of Patent: April 6, 2021
    Assignee: Intel Corporation
    Inventors: Rajesh Bhaskar, Kenneth Foust, George Vergis
  • Publication number: 20210003629
    Abstract: An apparatus of a multi-chip package (MCP) of a functional safety system, comprises a processor to be configured as a master chip in a master-slave arrangement with a slave chip in the MCP, and a memory coupled to the processor to store one or more infield test scan patterns. The processor includes a bock to couple the master chip to the slave chip via a high-speed input/output (IO) interface to retrieve the one or more infield test scan patterns from the memory via the master chip, and to provide the one or more infield test scan patterns to the slave chip via the high-speed IO interface in response to the functional safety system entering an infield test mode.
    Type: Application
    Filed: September 24, 2020
    Publication date: January 7, 2021
    Applicant: Intel Corporation
    Inventors: Asad Azam, Amit Kumar Srivastava, Enrico Carrieri, Rajesh Bhaskar
  • Patent number: 10853289
    Abstract: In one embodiment, a host controller includes: a first credit tracker comprising at least one credit counter to maintain credit information for a first device; and a first credit handler to send a command code having a first predetermined value to indicate a credit request to request credit information from the first device, where the first credit tracker is to update the at least one credit counter based on receipt of an in-band interrupt from the first device having the credit information. Other embodiments are described and claimed.
    Type: Grant
    Filed: December 17, 2018
    Date of Patent: December 1, 2020
    Assignee: Intel Corporation
    Inventors: Amit Kumar Srivastava, Asad Azam, Rajesh Bhaskar, Mikal Hunsaker, Enrico D. Carrieri
  • Patent number: 10845407
    Abstract: An apparatus of a multi-chip package (MCP) of a functional safety system, comprises a processor configurable as a master chip in a master-slave arrangement with a slave chip in the MCP, and a memory coupled to the processor to store one or more infield test scan patterns. The processor includes a block to couple the master chip to the slave chip via a high-speed input/output (IO) interface to retrieve the one or more infield test scan patterns from the memory via the master chip, and to provide the one or more infield test scan patterns to the slave chip via the high-speed TO interface in response to the functional safety system entering an infield test mode.
    Type: Grant
    Filed: June 25, 2018
    Date of Patent: November 24, 2020
    Assignee: Intel Corporation
    Inventors: Asad Azam, Amit K. Srivastava, Enrico Carrieri, Rajesh Bhaskar
  • Publication number: 20200050571
    Abstract: In one embodiment, an apparatus includes: a peer-to-peer (P2P) control circuit to issue a P2P communication request to a bus master of a multi-drop interconnect to request authorization to send a P2P transaction to at least one slave device coupled to the multi-drop interconnect; a transmitter to transmit the P2P transaction to the at least one slave device when the bus master grants the authorization for the P2P transaction; and another transmitter to output the clock signal to the multi-drop interconnect during the P2P transaction. Other embodiments are described and claimed.
    Type: Application
    Filed: October 17, 2019
    Publication date: February 13, 2020
    Inventors: Rajesh Bhaskar, Enrico Carrieri, Kenneth Foust, Janusz Jurski, Myron Loewen, Matthew A. Schnoor, Amit Kumar Srivastava, George Vergis
  • Publication number: 20190227753
    Abstract: In one embodiment, a flash sharing controller is to enable a plurality of components of a platform to share a flash memory. The flash sharing controller may include: a flash sharing class layer including a configuration controller to configure the plurality of components to be flash master devices and configure a flash sharing slave device for the flash memory; and a physical layer coupled to the flash sharing class layer to communicate with the plurality of components via a bus. Other embodiments are described and claimed.
    Type: Application
    Filed: March 28, 2019
    Publication date: July 25, 2019
    Inventors: Zhenyu Zhu, Mikal Hunsaker, Karthi R. Vadivelu, Rahul Bhatt, Kenneth P. Foust, Rajesh Bhaskar, Amit Kumar Srivastava
  • Publication number: 20190188165
    Abstract: In embodiments, a device includes an input interface to receive a broadcast command from a host computer, the broadcast command including an access mode indication, and decoding circuitry coupled with the interface. The decoding circuitry is to determine, based at least in part on the received access mode indication, that the broadcast command is directed to access one or more pre-defined setup or control registers of one or more devices, or to access one or more internal registers of the one or more devices, and, in response to the determination, implement the access to the setup or control registers, or to the one or more internal registers. In embodiments, the device is disposed on a memory module coupled to the host computer.
    Type: Application
    Filed: February 22, 2019
    Publication date: June 20, 2019
    Inventors: Girish C. Venkatraman, Rajesh Bhaskar, George Vergis, John R. Goles
  • Publication number: 20190121765
    Abstract: In one embodiment, a host controller includes: a first credit tracker comprising at least one credit counter to maintain credit information for a first device; and a first credit handler to send a command code having a first predetermined value to indicate a credit request to request credit information from the first device, where the first credit tracker is to update the at least one credit counter based on receipt of an in-band interrupt from the first device having the credit information. Other embodiments are described and claimed.
    Type: Application
    Filed: December 17, 2018
    Publication date: April 25, 2019
    Inventors: Amit Kumar Srivastava, Asad Azam, Rajesh Bhaskar, Mikal Hunsaker, Enrico D. Carrieri
  • Publication number: 20190049513
    Abstract: An apparatus of a multi-chip package (MCP) of a functional safety system, comprises a processor to be configured as a master chip in a master-slave arrangement with a slave chip in the MCP, and a memory coupled to the processor to store one or more infield test scan patterns. The processor includes a bock to couple the master chip to the slave chip via a high-speed input/output (IO) interface to retrieve the one or more infield test scan patterns from the memory via the master chip, and to provide the one or more infield test scan patterns to the slave chip via the high-speed IO interface in response to the functional safety system entering an infield test mode.
    Type: Application
    Filed: June 25, 2018
    Publication date: February 14, 2019
    Applicant: Intel Corporation
    Inventors: Asad Azam, Amit K. Srivastava, Enrico Carrieri, Rajesh Bhaskar
  • Publication number: 20190042497
    Abstract: An apparatus is described. The apparatus includes a DIMM hub circuit. The DIMM hub circuit includes first bus interface circuitry, control circuitry and second bus interface circuitry. The first bus interface circuitry is to receive header information and payload information from a host. The control circuitry is to process the header information and recognize that the payload is to be passed to a target component that is coupled to the DIMM hub circuit through a second bus that is a same type of bus as the first bus. The second bus interface circuitry to send the payload information over the second bus to the target component, wherein, the payload information is to include embedded header information to be processed by the target component.
    Type: Application
    Filed: May 3, 2018
    Publication date: February 7, 2019
    Inventors: Rajesh BHASKAR, Kenneth FOUST, George VERGIS
  • Publication number: 20190042473
    Abstract: Technologies for secure I/O include a computing device that further includes an I/O controller and a trusted I/O (TIO) mode manager. The TIO mode manager is to program, over a secure routing hardware of the computing device, the I/O controller of the computing device to allow or disallow trusted I/O. The I/O controller is to disable accesses to memory regions associated with one or more programmable I/O registers of an I/O controller of the computing device in response to programming the I/O controller to allow trusted I/O; perform I/O data transfers to or from an I/O device via direct memory access in response to disabling the accesses to the memory regions associated with the one or more programmable I/O registers, wherein the I/O data transfers are protected by a trusted I/O channel; and enable accesses to the address regions associated with the one or more programmable I/O registers in response to programming the I/O controller to disallow trusted I/O.
    Type: Application
    Filed: December 28, 2017
    Publication date: February 7, 2019
    Inventors: Rajesh Bhaskar, Reshma Lal, Siddhartha Chhabra
  • Publication number: 20170280098
    Abstract: Techniques are disclosed for enhancing user experience in video conferencing. In accordance with some embodiments, the graphical user interface (GUI) displayed on a device involved in a video conferencing session may undergo dynamic adjustment of its video composition, for example, to render video content in either a prominent or a thumbnail region of the GUI. Reorganization of the GUI's video composition may be performed, for example: (1) automatically based on detected audio activity levels of the video conferencing participants; and/or (2) upon user instruction. In accordance with some embodiments, individualized volume control over video conferencing participants may be provided. In accordance with some embodiments, the resolution and/or frame rate of video data captured at a source device involved in a video conferencing session may be adaptively varied, for example, during capture and/or processing before encoding based on the detected audio activity level of the user of that source device.
    Type: Application
    Filed: September 26, 2014
    Publication date: September 28, 2017
    Applicant: INTEL CORPORATION
    Inventors: RAMANATHAN SETHURAMAN, RAGHUNANDAN BN, RAJESH BHASKAR, JEAN-PIERRE GIACALONE
  • Patent number: 9005571
    Abstract: Hydrogenated liquid organic compounds are used for storage and supply of hydrogen at near ambient conditions. The hydrogen is released from the hydrogenated liquid organic compounds through a catalytic dehydrogenation reaction using a M/support or M-M?/support catalyst. The M/support catalyst comprises a metal M selected from Pt, Pd, Rh, Ru, Ir, Os, or combination thereof, and a support selected from Y2O3 or V2O5 or combinations thereof. The M-M?/support catalyst comprises a first metal M selected from Cu, Ag, Au, or combination thereof, a second metal M? selected from Pt, Pd, Rh, Ru, Ir, Os, Fe, Ni, Re, Mo, W, V, Cr, Co or combinations thereof, and a support selected from activated carbon, alumina, alumite, zirconia, silica or combination thereof. Synergistic effects are created by using the combination of the M and M? in the catalyst, which result in shifting of the equilibrium of the reaction favorably to dehydrogenation.
    Type: Grant
    Filed: January 25, 2013
    Date of Patent: April 14, 2015
    Assignee: Council of Scientific & Industrial Research
    Inventors: Rajesh Bhaskar Biniwale, Jayshri Vijay Pande, Anshu Ajit Shukla
  • Publication number: 20130142726
    Abstract: Hydrogenated liquid organic compounds are used for storage and supply of hydrogen at near ambient conditions. The hydrogen is released from the hydrogenated liquid organic compounds through a catalytic dehydrogenation reaction using a M/support or M-M?/support catalyst. The M/support catalyst comprises a metal M selected from Pt, Pd, Rh, Ru, Ir, Os, or combination thereof, and a support selected from Y2O3 or V2O5 or combinations thereof. The M-M?/support catalyst comprises a first metal M selected from Cu, Ag, Au, or combination thereof, a second metal M? selected from Pt, Pd, Rh, Ru, Ir, Os, Fe, Ni, Re, Mo, W, V, Cr, Co or combinations thereof, and a support selected from activated carbon, alumina, alumite, zirconia, silica or combination thereof. Synergistic effects are created by using the combination of the M and M? in the catalyst, which result in shifting of the equilibrium of the reaction favorably to dehydrogenation.
    Type: Application
    Filed: January 25, 2013
    Publication date: June 6, 2013
    Inventors: Rajesh Bhaskar Biniwale, Jayshri Vijay Pande, Anshu Ajit Shukla