Abstract: In one implementation, a method for providing a fluid at a target pressure may include providing a fluid at a velocity to a supply line through a dispenser, measuring a pressure of the fluid flowing through the supply line, comparing the measured pressure with the target pressure, and adjusting the velocity based on the results of the comparison.

Abstract: A protective chuck is magnetically levitated on a substrate with a gas layer between the bottom surface of the protective chuck and the substrate surface. The gas layer protects a surface region of the substrate against a fluid layer covering the remaining of the substrate surface without contacting the substrate, reducing or eliminating potential damage to the substrate surface. The magnetically levitated protective chuck can enable combinatorial processing of a substrate, providing multiple isolated processing regions on a single substrate with different material and processing conditions.

Abstract: Method for providing a fluid at a target pressure. In one implementation, the method may include providing a semiconductor solution at a velocity to a supply line through a dispenser, measuring a pressure of the semiconductor solution flowing through the supply line, comparing the measured pressure with the target pressure, and adjusting the velocity based on the results of the comparison.

Abstract: A pressure gauge may be coupled to a vessel into which a liquid chemical is to be dispensed. The volume of the vessel may be known and a control device may determine an initial pressure of the vessel using the pressure gauge. A volume of liquid chemical may be dispensed into the vessel which may cause the pressure within the vessel to increase to a second pressure. The control device may determine the second pressure using the pressure gauge may calculate the volume of liquid chemical dispensed into the vessel using the volume of the vessel, the initial pressure of the vessel, and the second pressure of the vessel.

Abstract: Overlapping combinatorial processing can offer more processed regions, better particle performance and simpler process equipment. In overlapping combinatorial processing, one or more regions are processed in series with some degrees of overlapping between regions. In some embodiments, overlapping combinatorial processing can be used in conjunction with non-overlapping combinatorial processing and non-combinatorial processing to develop and investigate materials and processes for device processing and manufacturing.

Abstract: A substrate for processing in a heating system is disclosed. The substrate includes a bottom portion for absorbing heat from a radiating heat source, the bottom portion having a first region having a first emissivity and a second region having a second emissivity less than the first emissivity. The first region and the second region promote thermal uniformity of the substrate by compensating for thermal non-uniformity of the radiating heat source.

Abstract: A protective chuck is disposed on a substrate with a gas layer between the bottom surface of the protective chuck and the substrate surface. The gas layer protects a surface region against a fluid layer covering the substrate surface. In some embodiments, the pressure fluctuation at the gas layers is monitored, and through the dynamic feedback, the gas flow rate can be adjusted to achieve a desired operation regime.

Abstract: Methods and apparatuses are disclosed for rinsing the interface area of a liquid and air boundary after a substrate cleaning process using gas barrier. In some embodiments, a protective chuck having an inner gas ring and an outer liquid ring can be used to clean the area under the edge of the protective chuck. A gas flowing outward from the gas ring can enable a liquid to flow outward from the liquid ring, rinsing the outer portion of the protective chuck. The interface rinsing process can enable combinatorial processing of a substrate, providing multiple isolated processing regions on a single substrate with different material and processing conditions.

Abstract: A protective chuck is magnetically levitated on a substrate with a gas layer between the bottom surface of the protective chuck and the substrate surface. The gas layer protects a surface region of the substrate against a fluid layer covering the remaining of the substrate surface without contacting the substrate, reducing or eliminating potential damage to the substrate surface. The magnetically levitated protective chuck can enable combinatorial processing of a substrate, providing multiple isolated processing regions on a single substrate with different material and processing conditions.

Abstract: A protective chuck is disposed on a substrate with a gas bearing layer between the bottom surface of the protective chuck and the substrate surface. The gas bearing layer protects a surface region against a fluid layer covering the substrate surface. The protection of the gas bearing is a non-contact protection, reducing or eliminating potential damage to the substrate surface due to friction. The gas bearing can enable combinatorial processing of a substrate, providing multiple isolated processing regions on a single substrate with different material and processing conditions.

Abstract: A dual purpose processing chamber is provided. The dual purpose processing chamber includes a lid disposed over a top surface of a processing region of the processing chamber. A plurality of sputter guns with a target affixed to one end of each of the sputter guns is included. The plurality of sputter guns extend through the lid of the process chamber, wherein each of the plurality of sputter guns is oriented such that a surface of the target affixed to each gun is angled toward an outer periphery of a substrate. In another embodiment, each of the sputter guns is affixed to an extension arm and the extension arm is configured to enable movement in four degrees of freedom. A method of performing a deposition process is also included.

Abstract: A pressure gauge may be coupled to a vessel into which a liquid chemical is to be dispensed. The volume of the vessel may be known and a control device may determine an initial pressure of the vessel using the pressure gauge. A volume of liquid chemical may be dispensed into the vessel which may cause the pressure within the vessel to increase to a second pressure. The control device may determine the second pressure using the pressure gauge may calculate the volume of liquid chemical dispensed into the vessel using the volume of the vessel, the initial pressure of the vessel, and the second pressure of the vessel.

Abstract: An apparatus and system for stirring liquid inside a flow cell. In one implementation, the apparatus includes a rotatable disc configured to receive liquid at a top side of the disc and distribute the liquid substantially evenly around a periphery of the flow cell. The disc has a triangular cross sectional area. The apparatus may further include a set of fins attached to a bottom side of the disc, wherein the set of fins is configured to draw the liquid from the periphery of the flow cell into the center of the flow cell.

Abstract: Embodiments of the current invention describe a substrate processing tool. The substrate processing tool includes a housing defining a chamber, a substrate support, a container, and an impelling mechanism. The substrate support is coupled to the housing and configured to support a substrate within the chamber. The container is coupled to the housing within the chamber and configured to hold a liquid. The container is below and spaced apart from the substrate. The impelling mechanism is coupled to the housing and configured to apply a force to the liquid within the container such that an impelled portion of the liquid contacts a lower surface of the substrate.

Abstract: A substrate for processing in a heating system is disclosed. The substrate includes a bottom portion for absorbing heat from a radiating heat source, the bottom portion having a first region having a first emissivity and a second region having a second emissivity less than the first emissivity. The first region and the second region promote thermal uniformity of the substrate by compensating for thermal non-uniformity of the radiating heat source.

Abstract: Method for preparing a chemical delivery line for delivery. In one implementation, the method may include starting a flow of a semiconductor solution from a vessel into the chemical delivery line coupled to the vessel, measuring a volume of the semiconductor solution flowing through the chemical delivery line, and performing a subsequent process when the volume of the semiconductor solution is equal to or greater than the volume of the chemical delivery line.

Abstract: A pressure gauge may be coupled to a vessel into which a liquid chemical is to be dispensed. The volume of the vessel may be known and a control device may determine an initial pressure of the vessel using the pressure gauge. A volume of liquid chemical may be dispensed into the vessel which may cause the pressure within the vessel to increase to a second pressure. The control device may determine the second pressure using the pressure gauge may calculate the volume of liquid chemical dispensed into the vessel using the volume of the vessel, the initial pressure of the vessel, and the second pressure of the vessel.

Abstract: An apparatus and method for combinatorial non-contact wet processing of a liquid material may include a source of a liquid material, a first reaction cell, a second reaction cell, a first plurality of gas jets disposed within an interior of the first reaction cell, the first plurality of gas jets configured to atomize the liquid material transferred to the interior of the first reaction cell, a second plurality of gas jets disposed within an interior of the second reaction cell, the second plurality of gas jets configured to atomize the liquid material transferred to the interior of the second reaction cell, a first vacuum element disposed along a periphery of the first reaction cell, and a second vacuum element disposed along a periphery of the at least a second reaction cell.

Abstract: An apparatus for combinatorial site-isolated thin film deposition may include a source of a liquid precursor, a nebulizer configured to convert the liquid precursor to an aerosolized mist of particles, a first deposition cell configured to direct an aerosolized mist of particles onto a first selected region of the substrate, and a second deposition cell configured to direct an aerosolized mist of particles onto a second selected region of the substrate. A method for combinatorial site-isolated thin film deposition may include providing a liquid precursor, converting the liquid precursor to an aerosolized mist of particles, transporting the aerosolized mist of particles to a first deposition cell and a second deposition cell in proximity to a surface of a substrate, and depositing the transported aerosolized mist of particles onto a first selected region and a second selected region of the surface of the substrate.

Abstract: An apparatus and system for stirring liquid inside a flow cell. In one implementation, the apparatus includes a rotatable disc configured to receive liquid at a top side of the disc and distribute the liquid substantially evenly around a periphery of the flow cell. The disc has a triangular cross sectional area. The apparatus may further include a set of fins attached to a bottom side of the disc, wherein the set of fins is configured to draw the liquid from the periphery of the flow cell into the center of the flow cell.