Abstract: A method, system, and apparatus are disclosed. In one embodiment method includes causing a cooling medium to flow through a hollow cable. The cable couples an external cooling station to a heat exchanging unit. The heat exchanging unit is located within a mobile computing device. The method then transfers heat from within the mobile computing device to the cooling medium at the heat exchanging unit. Then the cooling medium contained the transferred heat is expelled out of the mobile computing device.

Abstract: A cooling system includes a heat pipe and a refrigerator. A combination at least one or more of the heat pipe and the refrigerator is used to cool an electronic component capable of generating heat. Depending on the cooling requirement, a different cooling combination may be used.

Abstract: Embodiments disclosed herein include EMI shielding to cool a computing device with one or more vents. In some embodiments, a louvered vent formed in the EMI shield of a computing device creates an air curtain between the EMI shield and a heat-generating component to cool the component, the EMI shield and the external wall. Other embodiments are described.

Abstract: Apparatuses, systems, and methods for a heat spreader plate and pulsating heat pipes to transfer heat sourced from one or more electronic components are described herein. Other embodiments may also be described and claimed.

Abstract: An apparatus with some embodiments is described having a protrusion to provide air flow distribution to a computing device. In some embodiments, the apparatus may include a housing with one or more openings on each of the external surfaces of the housing, an air mover, and a protrusion to channel airflow to an inlet while restricting airflow from an outlet from being circulated back into the inlet. Furthermore, in some embodiments, the apparatus may be implemented on a computer system that includes one or more electronic components can generate thermal energy. Other embodiments are described.

Abstract: Some embodiments of a method, apparatus and computer system are described for inverted vortex generator enhanced cooling. In various embodiments an apparatus may comprise a first surface comprising at least one heated component, a second surface in proximity to the first surface, the second surface comprising a non-heated surface, and one or more inverted vortex generators attached to the non-heated surface, a portion of the one or more inverted vortex generators in proximity to and configured to dissipate heat from the at least one heated component. Other embodiments are described.

Abstract: Some embodiments of a method, apparatus and computer system are described for vortex generator enhanced cooling. The computer system may include a housing and an apparatus. The apparatus may include one or more vortex generators coupled to a heat spreader and positioned in close proximity to an electronic component, and a flow of air to provide for an exchange of thermal energy, where the flow of air is provided by a configuration of the housing, and where the one or more vortex generators may promote turbulence to enhance the exchange of thermal energy of the electronic component. In some embodiments, an air mover may be used to increase the flow of air in the housing. Other embodiments are described.

Abstract: For some embodiments, skin temperature of a computer system may be determined by using a network of thermistors and conductors. A thermistor may be positioned at an intersection of two conductors. Current may be supplied to a first conductor. Voltage may be measured at a second conductor. Resistance information associated with the thermistor may be determined. Skin temperature may be determined from the resistance information.

Abstract: An evaporator thermally coupled with a heat source is operated in manner with the coolant exiting the evaporator in a less than fully vaporous state. For an embodiment, the exiting coolant may be brought to at least a substantially vaporous state by being thermally coupled to a compressor.

Abstract: In one embodiment, a heat exchanger may be formed using a corrosion-resistant aluminum material to enable usage of water as a working fluid for the exchanger. In one embodiment, the exchanger may have an aluminum substrate with multiple treated layers formed thereon. A first treated layer corresponds to a hydrated aluminum oxide layer, and a second treated layer corresponds to a mono-layer organic molecule layer. Other embodiments are described and claimed.

Abstract: An apparatus with some embodiments is described having cooling capabilities for a computing device. In some embodiments, the apparatus may include a thermoelectric component (TEC) to transfer thermal energy with a first heat exchanger, through a heat attach and heat pipe, to or from the TEC, and then with a second heat exchanger. In some embodiments, the apparatus may include a second heat attach and a second heat pipe between the second heat exchanger and the TEC. Furthermore, in some embodiments, the apparatus may be at a docking station, where the docking station may connect with the computing device. Other embodiments are described.

Abstract: A method, apparatus, and system are described for an ionic wind generator. The ionic wind generator may have a first electrode that is elevated off a surface of a device that the ionic wind generator is intended to cool. A first surface of the first electrode is in contact with a first surface of a first post that elevates the first electrode off the surface of the device that the ionic wind generator is intended to cool. The ionic wind generator causes a generation of ions that are then drawn through an interstitial atmosphere from the first electrode to a second electrode to affect a velocity of local flow over the surface of the device between the first electrode and the second electrode. The flow from a forced flow device also affects the velocity of local flow over the surface of the device between the first electrode and the second electrode.

Abstract: An apparatus with some embodiments is described having cooling capabilities for a computing device. In some embodiments, the apparatus may include a thermoelectric component (TEC) to transfer thermal energy with a first heat exchanger, through a heat attach and heat pipe, to or from the TEC, and then with a second heat exchanger. In some embodiments, the apparatus may include a second heat attach and a second heat pipe between the second heat exchanger and the TEC. Furthermore, in some embodiments, the apparatus may be at a docking station, where the docking station may connect with the computing device. Other embodiments are described.

Abstract: An apparatus with some embodiments is described having a protrusion to provide air flow distribution to a computing device. In some embodiments, the apparatus may include a housing with one or more openings on each of the external surfaces of the housing, an air mover, and a protrusion to channel airflow to an inlet while restricting airflow from an outlet from being circulated back into the inlet. Furthermore, in some embodiments, the apparatus may be implemented on a computer system that includes one or more electronic components can generate thermal energy. Other embodiments are described.

Abstract: A winged piezo-fan to dissipate the heat generated by the devices in an electronic system is disclosed. The winged piezo-fan may comprise a piezo-ceramic element and two blades. The blades may be coupled to the piezo-ceramic element, which may change its physical dimension in response to receiving an alternating voltage signal. The blades coupled to the piezo-ceramic element may move upwards and downwards in a direction that is perpendicular to the axis drawn along the length dimension of the blades in response to the changes in the physical dimension of the piezo-ceramic element. The movement of the blades may cause a flapping movement, which may create turbulence in the surrounding air. The turbulence so created may create eddies, which may dissipate the heat generated by the devices positioned close to the winged piezo-fan.

Abstract: A method, apparatus, and system are described for an ionic wind generator. The ionic wind generator may have a first electrode that is elevated off a surface of a device that the ionic wind generator is intended to cool. A first surface of the first electrode is in contact with a first surface of a first post that elevates the first electrode off the surface of the device that the ionic wind generator is intended to cool. The ionic wind generator causes a generation of ions that are then drawn through an interstitial atmosphere from the first electrode to a second electrode to affect a velocity of local flow over the surface of the device between the first electrode and the second electrode.

Abstract: A cooling system includes a heat pipe and a refrigerator. A combination at least one or more of the heat pipe and the refrigerator is used to cool an electronic component capable of generating heat. Depending on the cooling requirement, a different cooling combination may be used.

Abstract: Embodiments disclosed herein include EMI shielding to cool a computing device with one or more vents. In some embodiments, a louvered vent formed in the EMI shield of a computing device creates an air curtain between the EMI shield and a heat-generating component to cool the component, the EMI shield and the external wall. Other embodiments are described.

Abstract: For some embodiments, skin temperature of a computer system may be determined by using a network of thermistors and conductors. A thermistor may be positioned at an intersection of two conductors. Current may be supplied to a first conductor. Voltage may be measured at a second conductor. Resistance information associated with the thermistor may be determined. Skin temperature may be determined from the resistance information.

Abstract: A self-focusing acoustic transducer for cooling a computing device is described. The self-focusing acoustic transducer is integrated into a heat generating component or into an external wall of a mobile computing device. The self-focusing acoustic transducer may be part of an array. A method of fabricating a self-focusing acoustic transducer as an integrated part of a heat generating component or as part of an external wall of a mobile computing device is also described, as well as a method of cooling a computing device using self-focusing acoustic transducers.