Abstract: Disclosed is a charge/discharge circuit structure for an output node (e.g., of a device, such as a charge pump in a memory structure, such as in a resistive random access memory (RRAM) structure). The circuit structure includes, among other components: a positive supply voltage node at a positive supply voltage level; a first input node connected to an output node of a device (e.g., a charge pump) to receive a variable output voltage (Vout); and an N-type field effect transistor (NFET) and a first P-type field effect transistor (PFET) connected in series between the positive supply voltage node and the first input node. The gate of the NFET can be connected to the drain region of the first PFET (and thereby also the first input node). Thus, the NFET functions as a source follower NFET switch controlled by feedback from the drain region of the first PFET.

Abstract: An antenna module is described. The antenna module include a ground plane in a multilayer substrate. The antenna module also includes a mold on the multilayer substrate. The antenna module further includes a conductive wall separating a first portion of the mold from a second portion of the mold. The conductive wall is electrically coupled to the ground plane. A conformal shield may be placed on a surface of the second portion of the mold. The conformal shield is electrically coupled to the ground plane.

Abstract: In an aspect, an electronic device includes a plurality of stacked substrates, each substrate includes a first planar surface and a second planar surface opposite the first planar surface. Adjacent substrates are stacked so that the second planar surface of each upper substrate of the adjacent substrates extends beyond the first planar surface of each lower substrate of the adjacent substrates to form planar connection surfaces at the second planar surface of the upper substrate of the adjacent substrates, A redistribution layer underlies the stacked substrates. Conductive pillars extend in a direction perpendicular to the planar connection surface of each upper substrate of the adjacent substrates to electrically connect the electronic components of each upper substrate to the redistribution layer.

Abstract: A method of providing Wi-Fi access point (AP) information in a user equipment (UE) is disclosed. The method comprises performing a scan by a Wi-Fi radio of the UE to obtain scan results of APs operating adjacent to the UE while the UE operates in a sleep mode with one or more processors of the UE operating in the sleep mode. Sending one or more of the scan results of the APs from the Wi-Fi radio to an always on processor (AOP) of the UE. Storing the scan results in an always on database (AON DB). And accessing the AON DB by the one or more processors of the UE when the UE is not operating in the sleep mode to enable the UE to display information for the one or more of the scan results stored in the AON DB.

Abstract: A power switch, including: a PFET including a gate, a source coupled to a source voltage, and a drain for outputting a supply voltage; and a level shifter, wherein the level shifter includes: an input node for receiving an input voltage, wherein the input voltage includes first and second voltage levels; a supply node for receiving the supply voltage, wherein the supply voltage includes third and fourth voltage levels; and an output node for outputting an output voltage, wherein the output node is coupled to the gate of the PFET; wherein, when the input voltage is at the first voltage level, the output voltage is at the first voltage level and the PFET is in a conducting state; and wherein a voltage between the gate and drain of the PFET and a voltage between the gate and source of the FET do not exceed a maximum voltage of the PFET.

Abstract: A package comprising a substrate, an integrated device coupled to a first surface of the substrate through at least a first plurality of solder interconnects; and an antenna device coupled to a second surface of the substrate through at least a second plurality of solder interconnects. The antenna device comprises an antenna device dielectric layer; at least one antenna located on a first surface of the antenna device dielectric layer; a shield located on at least one lateral surface of the antenna device; and a slot opening on the first surface of the antenna device.

Abstract: A server for detecting anomalies associated with users accessing a network is caused to receive a dataset including static data and dynamic data. The static data includes location data of resources associated with the network and user data, and the dynamic data includes user access events. The server is further caused to detect, with a plurality of unsupervised machine learning models, an anomaly associated with a user accessing the network based on the static data and the dynamic data, determine whether the detected anomaly is critical, and in response to determining the detected anomaly is critical, generate and transmit a security alert specific to the detected anomaly to a security operation center. Other example servers, systems, apparatuses, methods, and non-transitory computer readable medium for detecting anomalies associated with users accessing a network are also disclosed.

Abstract: A package comprising a metallization portion; an integrated device coupled to the metallization portion; a substrate; a plurality of wire bonds coupled to the substrate and the metallization portion; and an encapsulation layer coupled to the metallization portion, wherein the encapsulation layer at least partially encapsulates the integrated device, the plurality of wire bonds and the substrate.

Abstract: A package comprising a first substrate; an integrated device coupled to the substrate; a second substrate coupled to the first substrate through at least a plurality of solder interconnects, wherein the second substrate is located over a portion of the integrated device; and a heat sink coupled to a back side of the integrated device through a thermal interface material, wherein the heat sink is located over another portion of the integrated device, wherein the heat sink is located laterally to the second substrate.

Abstract: A device includes a first integrated device coupled to a first substrate and a second integrated device coupled to a second substrate. The first substrate is disposed between the first integrated device and the second integrated device. The first integrated device is electrically connected to the second integrated device. The device also includes a heat slug defining protrusions. The protrusions are thermally coupled, via contacts of the first substrate, to the second integrated device.

Abstract: A wireless device may use a 5 GHz frequency band to support both Wi-Fi and Bluetooth. The 5 GHz frequency band may be divided into two portions (e.g., high sub-band and low sub-band). A Wi-Fi module of the wireless device may perform a roam scan on a first sub-band to determine attempt to find a candidate channel that meets a target criteria. When the candidate channel that meets the target criteria is found on the first sub-band, the Wi-Fi module may join the candidate channel. If no acceptable candidate channel is found, the wireless device may perform a band switch protocol to allow the Wi-Fi module to preform a roam scan on a second sub-band.

Abstract: In an aspect, a die-first metallization structure and substrate interposer hybrid package comprises a substrate interposer having a plurality of electrical connections from electrical contacts on the bottom surface of the substrate interposer to a plurality of vertical conductors mounted on the top surface of the substrate interposer. A semiconductor die is mounted to the top surface of the substrate interposer in a pins-up position and embedded, along with the vertical conductors, in a molding compound. A first metallization structure is disposed above, and electrically connected to, the die and the vertical conductors, and provides an electrical connection to a second set of electrical contacts on a top surface of the first metallization structure. In some aspects, the substrate may be a printed circuit board or similar structure, and the first metallization structure may be a redistribution layer (RDL) or similar structure.

Abstract: A server for detecting anomalies associated with users accessing a network is caused to receive a dataset including static data and dynamic data. The static data includes location data of resources associated with the network and user data, and the dynamic data includes user access events. The server is further caused to detect, with a plurality of unsupervised machine learning models, an anomaly associated with a user accessing the network based on the static data and the dynamic data, determine whether the detected anomaly is critical, and in response to determining the detected anomaly is critical, generate and transmit a security alert specific to the detected anomaly to a security operation center. Other example servers, systems, apparatuses, methods, and non-transitory computer readable medium for detecting anomalies associated with users accessing a network are also disclosed.

Abstract: A device comprising a board; a first package coupled to the board through a plurality of solder interconnects, wherein the first package comprises: a first substrate; a first integrated device coupled to the first substrate; a heat pipe coupled to the first integrated device through a thermal interface material; a second package coupled to the first substrate through a through a plurality of inter substrate interconnects; and an encapsulation layer located between the first substrate and the second package.

Abstract: Some embodiments include an apparatus and method for a mobile access point (AP) station that operates in an always-on soft AP mode where a station is associated with the mobile AP station, and switch back to operate as a station in an infrastructure mode with an AP. For example, in an always-on soft AP mode, the mobile AP station may implement a target wake time (TWT) responder power save mode feature. The mobile AP station may maintain a wake window after a beacon to enable unassociated devices to associate; establish a broadcast TWT schedule for unassociated TWT-capable devices to associate; schedule TWT for associated devices; go to sleep outside of the scheduled TWT of the associated devices; and switch back to infrastructure mode to perform as a station and maintain a connection with an AP.

Abstract: A package comprising a substrate comprising a first surface and a second surface, wherein the substrate comprises a plurality of interconnects; a first antenna device coupled to the first surface of the substrate, through a first plurality of solder interconnects, wherein a portion of the first antenna device overhangs over the substrate such that a portion of the first antenna device does not vertically overlap with any portion of the substrate; a second antenna device coupled to the first surface of the substrate, through a second plurality of solder interconnects; an integrated device coupled to the second surface of the substrate; an encapsulation layer coupled to the second surface of the substrate, wherein a vertical surface of the encapsulation layer is coplanar with a vertical surface of the substrate, and wherein the encapsulation layer at least partially encapsulates the integrated device; and a shield coupled to a surface of the encapsulation layer.

Abstract: A power switch, including: a PFET including a gate, a source coupled to a source voltage, and a drain for outputting a supply voltage; and a level shifter, wherein the level shifter includes: an input node for receiving an input voltage, wherein the input voltage includes first and second voltage levels; a supply node for receiving the supply voltage, wherein the supply voltage includes third and fourth voltage levels; and an output node for outputting an output voltage, wherein the output node is coupled to the gate of the PFET; wherein, when the input voltage is at the first voltage level, the output voltage is at the first voltage level and the PFET is in a conducting state; and wherein a voltage between the gate and drain of the PFET and a voltage between the gate and source of the FET do not exceed a maximum voltage of the PFET.

Abstract: An antenna module is described. The antenna module include a ground plane in a multilayer substrate. The antenna module also includes a mold on the multilayer substrate. The antenna module further includes a conductive wall separating a first portion of the mold from a second portion of the mold. The conductive wall is electrically coupled to the ground plane. A conformal shield may be placed on a surface of the second portion of the mold. The conformal shield is electrically coupled to the ground plane.

Abstract: In some aspects, a method includes storing a configuration database at a media platform. The configuration database includes base customization data associated with the media platform and manufacturer customization data associated with a plurality of manufacturers of television devices. The method includes receiving a configuration request from a television device, where the configuration request includes a location and/or a device identifier of the television device. The method includes selecting a portion of the manufacturer customization data that correspond to the location and/or the device identifier of the television device, generating server-based customization data for the television device based on the portion of the manufacturer customization data and the base customization data, and transmitting the server-based customization data to the television device, where the server-based customization data is configured to be used by the television device to customize a user interface of the media platform.

Abstract: A package comprising a substrate, a first antenna device, and an integrated device. The substrate comprising a first surface and a second surface, where the substrate comprises a plurality of interconnects. The first antenna device is coupled to the first surface of the substrate, through a first plurality of solder interconnects. The integrated device is coupled to the second surface of the substrate. The package may include an encapsulation layer located over the second surface of the substrate, where the encapsulation layer encapsulates the integrated device. The package may include a shield formed over a surface of the encapsulation layer, where the shield includes an electromagnetic interference (EMI) shield.