Abstract: An antenna-in-package (AiP) module is described. The AiP module includes an antenna sub-module. The antenna sub-module is composed of a first package substrate including an antenna side surface having a first group of antennas placed along a first portion of the antenna side surface and a second group of antennas placed along a second portion of the antenna side surface. The first package substrate is composed of a non-linear portion between the first group of antennas and the second group of antennas. The AiP module includes an active circuit sub-module placed on an active side surface of the first package substrate opposite the first group of antennas or the second group of antennas on the antenna side surface of the first package substrate.

Abstract: In general, the disclosure describes techniques for adaptively determining one or more parameters of a service level agreement of an application. For instance, a network device may monitor round-trip times of a plurality of packets of a data flow of an application being transmitted over a link between an application server and a client device. The network device may determine an amount of retransmission of packets occurring during transmission of the plurality of packets of the data flow. The network device may predict, based at least in part on the round-trip times of the plurality of packets of the data flow and the amount of retransmission of packets occurring during transmission of the plurality of packets of the data flow, a round-trip time parameter for a service level agreement associated with the application.

Abstract: In general, the disclosure describes techniques for adaptively determining one or more parameters of a service level agreement of an application. For instance, a network device may monitor round-trip times of a plurality of packets of a data flow of an application being transmitted over a link between an application server and a client device. The network device may determine an amount of retransmission of packets occurring during transmission of the plurality of packets of the data flow. The network device may predict, based at least in part on the round-trip times of the plurality of packets of the data flow and the amount of retransmission of packets occurring during transmission of the plurality of packets of the data flow, a round-trip time parameter for a service level agreement associated with the application.

Abstract: Packages are configured to include an electromagnetic interference (EMI) shield. According to one example, a package includes a substrate, an electrical component, and an EMI shield. The substrate includes a first surface and a second surface. The electrical component may be coupled to the first side of the substrate. The EMI shield is formed with at least one passive device. The at least one passive device is coupled to the first surface of the substrate. The at least one passive device is located laterally to the at least one electrical component, and extends along at least a portion of the electrical component. Other aspects, embodiments, and features are also included.

Abstract: Systems for shielding bent signal lines provide ways to couple different antenna arrays for radio frequency (RF) integrated circuits (ICs) (RFICs) associated therewith where the antenna arrays are oriented in different directions. Because the antenna arrays are oriented in different directions, the antenna structures containing the antennas may be arranged in different planes, and signal lines extending therebetween may include a bend. To prevent electromagnetic interference (EMI) or electromagnetic crosstalk (EMC) from negatively impacting signals on the signal lines, the signal lines may be shielded. The shields may further include vias connecting the mesh ground planes and positioned exteriorly of the signal lines. The density of the vias may be varied to provide a desired rigidity in planes containing the antenna arrays while providing a desired flexibility at a desired bending location in the signal lines to help bending process accuracy.

Abstract: Certain aspects of the present disclosure provide apparatus and techniques for partially molding packages for integrated circuits. A packaged assembly for integrated circuits includes: a substrate having at least one mold barrier between a first region on a first surface of the substrate and a second region on the first surface; a die attached to the substrate; one or more components attached to the substrate in the first region; and a first encapsulant over the one or more components in the first region, wherein the at least one mold barrier is configured to block a portion of the first encapsulant from moving from the first region of the substrate to the second region of the substrate during an application of the first encapsulant.

Abstract: An antenna-in-package (AiP) module is described. The AiP module includes an antenna sub-module. The antenna sub-module is composed of a first package substrate including an antenna side surface having a first group of antennas placed along a first portion of the antenna side surface and a second group of antennas placed along a second portion of the antenna side surface. The first package substrate is composed of a non-linear portion between the first group of antennas and the second group of antennas. The AiP module includes an active circuit sub-module placed on an active side surface of the first package substrate opposite the first group of antennas or the second group of antennas on the antenna side surface of the first package substrate.

Abstract: Radio-frequency (RF) integrated circuit (IC) (RFIC) packages employing a substrate sidewall partial shield for electro-magnetic interference (EMI) shielding. A RFIC package includes an IC die layer that includes a RFIC die(s) mounted on a substrate that includes substrate metallization layers, a substrate core, and substrate antenna layers. The RFIC package includes an EMI shield surrounding the IC die layer and extending down shared sidewalls of the IC die layer and the substrate. The EMI shield extends down the sidewalls of the IC die layer and substrate metallization layers of the substrate to at least the interface between the substrate metallization layers and the substrate core, and without extending adjacent to the sidewall of the substrate antenna layers. In this manner, antenna performance of the antenna module may not be degraded, because extending the EMI shield down sidewalls of the substrate antenna layers can create a resonance cavity in the substrate.

Abstract: Some embodiments include an apparatus and method for a mobile access point (AP) station that operates in an always-on soft AP mode where a station is associated with the mobile AP station, and switch back to operate as a station in an infrastructure mode with an AP. For example, in an always-on soft AP mode, the mobile AP station may implement a target wake time (TWT) responder power save mode feature. The mobile AP station may maintain a wake window after a beacon to enable unassociated devices to associate; establish a broadcast TWT schedule for unassociated TWT-capable devices to associate; schedule TWT for associated devices; go to sleep outside of the scheduled TWT of the associated devices; and switch back to infrastructure mode to perform as a station and maintain a connection with an AP.

Abstract: An interface circuit in a recipient electronic device (such as a cellular telephone) may provide preference-indication information for an electronic device (such as an access point). Notably, the recipient electronic device may compute preference-indication information associated with the recipient electronic device, where the preference-indication information indicates whether the recipient electronic device prefers that the electronic device use downlink (DL) multi-user (MU) MIMO transmissions when communicating with the recipient electronic device. Then, the recipient electronic device may provide the preference-indication information in a packet or a frame associated with the electronic device. In some embodiments, the recipient electronic device determines a trigger event (such as measuring a motion indication), and the computing may be selectively performed based at least in part on the trigger event.

Abstract: An interface circuit in an electronic device may contend for access to a shared communication channel on behalf of the electronic device and a recipient electronic device, where the access has a duration. Then, the electronic device may provide a schedule frame intended for the recipient electronic device that includes information that specifies one or more time slots during the duration that are associated with the recipient electronic device and one or more communication functions of the recipient electronic device in the one or more time slots. Moreover, the electronic device may provide a data frame with data intended for the recipient electronic device. In response, the electronic device may receive a response frame associated with the recipient electronic device, where the response frame is received during at least one of the one or more time slots.

Abstract: An integrated circuit (IC) package that is to be incorporated into a computing device may include a metallization structure with circuits and/or other elements such as capacitors or inductors thereon. Pads for input/output (I/O) (or other) purposes may also be present at different locations on the metallization structure. Exemplary aspects of the present disclosure allow mold material to be placed over the circuits and/or other elements in readily-customizable configurations so as to allow placement of the I/O pads in any desired location on the metallization structure. Specifically, before the mold material is applied to the metallization structure, a mask material such as tape may be applied to portions of the metallization structure that contain I/O pads or otherwise have reasons to not have mold material thereon. The mold material is applied, and the mask material is removed, taking unwanted mold material with the mask material.

Abstract: A device that includes a flexible printed circuit board (PCB), a package coupled to the flexible PCB, a first antenna device coupled to the flexible PCB, and a second antenna device coupled to the flexible PCB. The first antenna device is configured to transmit and receive a first signal having a first frequency. The second antenna device is configured to transmit and receive a second signal having a second frequency. The first antenna device may be coupled to a second surface of the flexible PCB, and the second antenna device is coupled to the second surface of the flexible PCB. The first antenna device may be coupled to a second surface of the flexible PCB, and the second antenna device is coupled to a first surface of the flexible PCB.

Abstract: An interface circuit in an electronic device (such as an access point) may request a channel status in order to specify a subset of one or more frequency sub-bands. During operation, the interface circuit may provide at least a frame to the recipient electronic device, where the frame requests the channel status for the one or more frequency sub-bands. Then, the electronic device may receive one or more measurement results from the recipient electronic device that specify the subset of the one or more frequency sub-bands (such as one or more RUs) that are not to be used when communicating with the recipient electronic device.

Abstract: A hydraulic system (40) for a work machine comprising a priority circuit (41) including at least a first priority actuator (47, 48) and a priority control valve (58) for controlling the supply of hydraulic fluid to the first priority actuator (47, 48) and for providing a load sense signal indicative of the load acting on the first priority actuator (47, 48); an auxiliary circuit (42) including at least a first auxiliary actuator (51) and at least a first auxiliary control valve (80) for controlling the supply of hydraulic fluid to the first auxiliary actuator (51); at least a first pump (46) for producing a flow of hydraulic fluid; and a priority valve (74) for distributing the flow from the pump (46) to the priority circuit (41) and auxiliary circuit (42) for operating the respective actuators thereof, with priority being given to the priority circuit (41) as a function of the load sense signal.

Abstract: A package that includes a substrate having a routing region and a non-routing region along a periphery of the substrate. The non-routing region includes a plurality of vias configured as a shield. The package includes an integrated device coupled to the substrate, and an encapsulation layer located over the substrate such that the encapsulation layer encapsulates the integrated device.

Abstract: This disclosure describes techniques that include adding information to a network service header in packets being processed by a set of compute nodes in a service chain. The information added to the network service header can be used during selection of the next hop in a service chain, and may be used to help ensure that service level agreements (SLA) are met with respect to one or more metrics. In one example, this disclosure describes a method that includes receiving, by a service complex having a plurality of service nodes, a packet associated with a service chain representing a series of services to be performed on the packet by one or more of the plurality of service nodes; identifying, by the service complex, one or more service chain constraints associated with the service chain; and modifying the packet, by the service complex, to include information about the service chain constraints.

Abstract: A device that includes a first substrate comprising a first antenna, an integrated device coupled to the first substrate, an encapsulation layer located over the first substrate and the integrated device, a second substrate comprising a second antenna, and a flexible connection coupled to the first substrate and the second substrate. The device includes a shield formed over a surface of the encapsulation layer and a surface of the first substrate. The shield includes an electromagnetic interference (EMI) shield.

Abstract: An integrated vehicle health management (IVHM) system to resolve equipment-fault related anomalies detected by cyber intrusion detection system (IDS). A benefit of the present system is that it can result in fewer alerts that need manual analysis. A combination of cyber and monitoring with integrated vehicle health management (IVHM) may be a high value differentiator. As a solution gets more mature through a learning loop, it may be customized for different customers in a cost effective manner, something that might be expensive to develop on their own for most original equipment manufacturers (OEMs). An IVHM symptom pattern recognition matrix may link a pattern of reported symptoms (e.g., anomalies) to known equipment failures (electrical connections, sensors, controllers, known cyber-attacks, and so on). This matrix may be initialized from the vehicle design data but its entries may get updated by a learning loop that improves a correlation by incorporating results of investigations.

Abstract: A package that includes a substrate having a routing region and a non-routing region along a periphery of the substrate. The non-routing region includes a plurality of vias configured as a shield. The package includes an integrated device coupled to the substrate, and an encapsulation layer located over the substrate such that the encapsulation layer encapsulates the integrated device.