Abstract: A cooling system includes a primary heat sink including a primary top base plate, a primary bottom base plate and a primary fin pack including a plurality of fins, where the primary fin pack is disposed between the primary top base plate and the primary bottom base plate. The cooling system further includes secondary heat sink including a secondary top base plate, a secondary bottom base plate and a secondary fin pack including a plurality of fins, where the secondary fin pack is disposed between the secondary top base plate and the secondary bottom base plate. A heat pipe extends between the primary top base plate and the primary bottom base plate, where the heat pipe further extends from the primary heat sink and couples with the secondary heat sink.

Abstract: A hybrid cooling server assembly can have a printed circuit board (PCB) with a processor socket disposed thereon and a hybrid cooling plate can be operably coupled with the processor socket. A radiator can having a working fluid received therein and be in fluidic communication with the radiator and the hybrid cooling plate by one or more tubular members. One or more cooling fans can be proximal to the radiator. The working fluid can be operable to receive heat from the cooling plate and reject heat at the radiator and the one or more cooling fans can be operable to produce an airflow across the hybrid cooling plate, thereby allowing the hybrid cooling plate transfer thermal energy to the airflow.

Abstract: A cooling system includes a primary heat sink including a primary top base plate, a primary bottom base plate and a primary fin pack including a plurality of fins, where the primary fin pack is disposed between the primary top base plate and the primary bottom base plate. The cooling system further includes secondary heat sink including a secondary top base plate, a secondary bottom base plate and a secondary fin pack including a plurality of fins, where the secondary fin pack is disposed between the secondary top base plate and the secondary bottom base plate. A heat pipe extends between the primary top base plate and the primary bottom base plate, where the heat pipe further extends from the primary heat sink and couples with the secondary heat sink.

Abstract: A hybrid cooling server assembly can have a printed circuit board (PCB) with a processor socket disposed thereon and a hybrid cooling plate can be operably coupled with the processor socket. A radiator can having a working fluid received therein and be in fluidic communication with the radiator and the hybrid cooling plate by one or more tubular members. One or more cooling fans can be proximal to the radiator. The working fluid can be operable to receive heat from the cooling plate and reject heat at the radiator and the one or more cooling fans can be operable to produce an airflow across the hybrid cooling plate, thereby allowing the hybrid cooling plate transfer thermal energy to the airflow.

Abstract: In one embodiment, a heat sink includes a lower base, an upper base, a set of fins interposed between the lower base and the upper base, and a plurality of heat pipes running between the lower base and the upper base on opposite sides of the heat sink and in-line with an airflow direction through the set of fins. An apparatus comprising a plurality of the heat sinks is also disclosed herein.

Abstract: A hybrid cooling server assembly can have a printed circuit board (PCB) with a processor socket disposed thereon and a hybrid cooling plate can be operably coupled with the processor socket. A radiator can having a working fluid received therein and be in fluidic communication with the radiator and the hybrid cooling plate by one or more tubular members. One or more cooling fans can be proximal to the radiator. The working fluid can be operable to receive heat from the cooling plate and reject heat at the radiator and the one or more cooling fans can be operable to produce an airflow across the hybrid cooling plate, thereby allowing the hybrid cooling plate transfer thermal energy to the airflow.

Abstract: Predictive monitoring of computer cooling systems includes generating, at a computer system, a model representative of at least a relationship between a rotational speed of one or more fans configured to cool computing components and a duty cycle of the pulse-width modulation of electrical current supplied to the one or more fans. The computer system determines a first effective range for the rotational speed of the one or more fans as a function of the duty cycle based on the model and monitors data representative of the rotational speed of the one or more fans and data representative of the duty cycle. The computer system generates a predictive failure alert when the data representative of the rotational speed indicates that the rotational speed is outside of the first effective range for a particular value of the duty cycle.

Abstract: An apparatus includes a housing, one or more storage drives, one or more fans, and one or more acoustic barriers. The housing includes a bottom side bounded by a front side, a back side, a first side, and a second side opposite the first side. The housing may further include a top cover removably attached to the housing. The storage drives may be disposed within the housing at a first location. The fans may be disposed within the housing at a second location spaced from the first location. The fans may generate a flow of air through the housing, while simultaneously generating sound waves that travel throughout the housing. The acoustic barriers may be disposed between the storage drives and the fans, and configured to attenuate the sounds waves prior to the sound waves reaching the storage drives in order to reduce the throughput performance degradation of the drives.

Abstract: Predictive monitoring of computer cooling systems includes generating, at a computer system, a model representative of at least a relationship between a rotational speed of one or more fans configured to cool computing components and a duty cycle of the pulse-width modulation of electrical current supplied to the one or more fans. The computer system determines a first effective range for the rotational speed of the one or more fans as a function of the duty cycle based on the model and monitors data representative of the rotational speed of the one or more fans and data representative of the duty cycle. The computer system generates a predictive failure alert when the data representative of the rotational speed indicates that the rotational speed is outside of the first effective range for a particular value of the duty cycle.

Abstract: An apparatus for cooling a heat generating component located within a portable computer system enclosure. In one embodiment a flat heat pipe is attached to the bottom surface of the portable computer keyboard support plate. The flat heat pipe is thermally coupled to one or more heat generating components housed within the computer system enclosure.

Abstract: In various embodiments, heat from a computer component may be absorbed into a medium, moved to a remote heat dispersal unit and dissipated into the surrounding air. In some embodiments, the heat dispersal unit may include a heat sink. In some embodiments, the medium may include a liquid metal. In various embodiments, a vapor compression system may include an evaporator, a compressor, a condenser, and an expansion valve. In some embodiments a separate heat pipe may be placed between the computer component and the evaporator. In various embodiments, a thermo conductive plate may be used to thermally couple the heat pipe to various components including the computer component, evaporator, condenser, and/or heat sink. In some embodiments, a thermo electric module (TEM) may be coupled to various parts of the system.

Abstract: A method for cooling electronic components includes disposing a first cooling structure associated with a first processor in a chassis, disposing a second cooling structure associated with a second processor in the chassis, and configuring the first cooling structure and the second cooling structure such that air propagating through the chassis includes air that passes through the first cooling structure and the second cooling structure, and air that passes only through the second cooling structure.

Abstract: A system for cooling electronic assemblies includes an equipment enclosure configured to receive a plurality of electronic assemblies in a plurality of mounting locations. The system also includes a cooling manifold that is mounted to the equipment enclosure and positioned to distribute chilled air to each of the electronic assemblies through a plurality of orifices.

Abstract: A heat dissipating element (e.g., a heat sink) is held in an initial position closer to a heat generating structure (e.g., a microprocessor) and in a subsequent position farther from the microprocessor. A thermal interface material (e.g., a thermal grease) spans the gap, but is not held under compression, between the heat sink and the microprocessor.

Abstract: A heat exchanger. The heat exchanger includes a first heat dissipation mechanism having a first heat dissipation capacity and a second heat dissipation having a second heat dissipation capacity. At least one heat transfer mechanism thermally couples the first heat dissipation mechanism and the second heat dissipation mechanism to a heat generating component. The heat transfer mechanism has a limited conductivity portion in the thermal path to either the first or the second heat dissipation mechanism.

Abstract: A heat sink comprises a side including a structural member defining a distance between a heat generating structure and the second side of the heat sink.

Abstract: A heat sink comprises a side including a structural member defining a distance between a heat generating structure and the second side of the heat sink.

Abstract: A heat sink comprises a side including a structural member defining a distance between a heat generating structure and the second side of the heat sink.

Abstract: A system including a component (e.g., a processor) with a clock and a thermal management controller that monitors a temperature in the system. The thermal management controller varies the component between different performance states (e.g., cycles the processor between a high and a low performance state) when an over-temperature condition is detected. The thermal management controller further throttles the clock of the component while in the low performance state until the over-temperature condition is removed.

Abstract: A heat dissipating element (e.g., a heat sink) is held in an initial position closer to a heat generating structure (e.g., a microprocessor) and in a subsequent position farther from the microprocessor. A thermal interface material (e.g., a thermal grease) spans the gap, but is not held under compression, between the heat sink and the microprocessor.