Abstract: A fan heat exchanger. The heat exchanger includes a fan housing which defines a chamber as well as top and bottom closing surfaces for the chamber. A fan is mounted in the chamber and has a rotational axis substantially perpendicular to the bottom surface.

Abstract: A package for an integrated circuit (IC) comprises a lid attached to a base, with the IC being disposed in a space or cavity between the lid and the base. A thermoelectric module (TEM) having first and second primary surfaces is incorporated into a section of the lid. The first primary surface is thermally coupled to the IC such that application of power to the TEM causes heat to be transferred away from the IC.

Abstract: An airflow heat exchange apparatus. One embodiment includes a housing configured to removably mate with an electronic device. The housing has a vent on a substantially horizontal surface and a fan positioned to increase airflow through the electronic device when the electronic device is mated with the housing. An electronic connector is positioned to be electronically coupled to signal lines from the electronic device when the electronic device and housing are mated.

Abstract: A fan for a computing device. The fan inclides a motor and a blade portion having a plurality of blades; however, the blade portion is located apart from the motor. A blade driving mechanism connects the motor to the blade such that the blade rotates when the motor is operating.

Abstract: A computer system, such as a notebook computer, that includes a lid having integrated circuit components that require heat dissipation while protecting the screen display of the lid.

Abstract: A printed circuit board to support an integrated circuit and provide thermal dissipation. A layer of thermally conductive material is disposed between lower and upper dielectric layers. Above this structure is disposed another layer of thermally conductive material to be thermally coupled to an integrated circuit. A thermal via couples the two layers of thermally conductive material to each other.

Abstract: An apparatus and method for removing heat from a heat generating component located within a thin-profile consumer electronic or computer system enclosure is disclosed. In one embodiment the cooling system of the present invention includes an air duct comprising a thermally conductive housing having internal fins dispersed along the internal walls of the duct. An air flow generator produces an air flow that is directed from an inlet port located at or near the center of the air duct to first and second exit ports located at opposite ends of the duct. A low resistance thermal path, such as a heat pipe, transfers heat from the heat generating component to the air duct housing.

Abstract: An air flow heat exchanger for a computing device and a docking station. The heat exchanger includes a first heat exchange duct configured to thermally couple to an electronic component. The first heat exchange duct may be brought into and removed from a mated position with a forced air mechanism. When mated with the forced air mechanism, the forced air mechanism is positioned so as to increase airflow through the first heat exchange duct.

Abstract: A lid that provides thermal dissipation for an integrated circuit. The lid is designed to be fastened to a printed circuit board and includes a casing having thermally conductive upper and lower plates. Between the upper and lower plates, inside the casing, is a hollow interior region within which vaporizing fluid and two or more segments of wick reside.

Abstract: An integrated circuit cooling device in which a thermoelectric module (TEM) is built into a printed circuit board (PCB) so that the TEM converts heat generated by an integrated circuit on the PCB into DC power that is then supplied to a DC--DC regulator to drive a cooling fan. In one embodiment, the cooling fan is incorporated within a heat sink disposed on one side of the PCB so that the built-in TEM is between the heat sink and the integrated circuit being cooled. In an alternate embodiment, the cooling fan is located remotely from the heat sink.

Abstract: A heat exchange apparatus for a computing device. A heat dissipating cable connector for the computing device includes a heat dissipation mechanism. The heat dissipation mechanism in the heat dissipating cable connector is removably thermally coupled to a heat transfer element which is configured to transfer heat from an electronic component to the heat dissipation mechanism.

Abstract: A heat exchanger system for use in a hinged computing device is provided. The hinged computing device includes a base housing connected to a display housing by one or more hinges. A number of heat generating electronic components are located within the base housing, and a display screen is positioned in the display housing. The heat exchanger system includes a heat pipe located in the base and thermally coupled to both an electronic component and the hinge to allow heat transfer from the electronic component to the hinge. A flat plate heat pipe located in the display housing is mechanically and thermally coupled to the hinge to allow heat transfer from the hinge to the flat plate heat pipe for dissipation through the display housing.

Abstract: A heat pipe exchanger system for cooling a hinged computing device. The hinged computing device includes a first hinged member having a first edge and second hinged member having a second edge. The first and second hinged members are rotatably attached along the first and second edge. A heat exchange sheath is mounted substantially parallel to the first and second edges and defines a first opening and a second opening. A first heat pipe is thermally coupled to the integrated circuit and has a portion disposed within the first opening. A second heat pipe is coupled to the display housing and has a portion disposed within the second housing. Alternately, the first heat pipe is coupled to the first hinged member and has a first portion substantially parallel to the first edge and the second edge. In this case, the second heat pipe is coupled to the second hinged member and has a first portion substantially perpendicular to the first heat pipe as well as a second portion conformally engaging the first heat pipe.

Abstract: A heat pipe exchanger system for cooling a hinged computing device. The hinged computing device includes a first hinged member having a first edge and second hinged member having a second edge. The first and second hinged members are rotatably attached along the first and second edges. A heat exchange sheath is mounted substantially parallel to the first and second edges and defines a first opening and a second opening. A first heat pipe is thermally coupled to the integrated circuit and has a portion disposed within the first opening. A second heat pipe is coupled to the display housing and has a portion disposed within the second opening. Alternately, the first heat pipe is coupled to the first hinged member and has a first portion substantially parallel to the first edge and the second edge. In this case, the second heat pipe is coupled to the second hinged member and has a first portion substantially perpendicular to the first heat pipe as well as a second portion conformally engaging the first heat pipe.