Abstract: An electronic assembly that may include an integrated circuit package that is mounted to a substrate. The assembly may have a thermally conductive phase change material that couples the integrated circuit package to a thermal element. The phase change material may be assembled in a liquid phase to fill any gap between the package and the thermal element. The phase change material may exist in a solid phase during normal operation of the assembly so that the material does not bleed from the package/thermal element interface.

Abstract: An electronic assembly that may include an integrated circuit package that is mounted to a substrate. The assembly may have a thermally conductive phase change material that couples the integrated circuit package to a thermal element. The phase change material may be assembled in a liquid phase to fill any gap between the package and the thermal element. The phase change material may exist in a solid phase during normal operation of the assembly so that the material does not bleed from the package/thermal element interface.

Abstract: The invention provides a computer with refrigeration. The computer has a housing, a processor, a refrigeration loop and a fan. The processor is located within the housing at a location distant from an air inlet into the housing. The refrigeration loop includes a compressor, a condenser, and expansion valve and an evaporator located in line one after the other. The evaporator is near the air inlet. The fan causes movement of air through the housing. The air passes over the evaporator to cool the air and the processor is primarily cooled by the air.

Abstract: A test socket having a heat slug for removing heat from an electronic device positioned within the socket. In one embodiment the test socket includes a burn-in board electrically coupled to a test unit that generates a series of test signals to test the performance of the electronic device. Examples of electronic devices that can be tested by the test socket are integrated circuit packages such as tape carrier packages (TCP), ball grid arrays (BGA), pin grid arrays (PGA), land grid arrays (LGA), and other packages. The integrated circuit package is positioned within the socket which electrically connects the package to a printed circuit board, such as a burn-in board. The test socket includes an opening in which a heat slug is disposed. The heat slug has a contact surface that contacts the integrated circuit device under test. In another embodiment, the socket includes a lid having a heat slug attached to the lid, which heat slug has a contact surface that contacts an integrated circuit device under test.

Abstract: A test contactor having a heat slug for removing heat from an electronic device engaging the contactor. The heat slug is positioned in the test contactor so that a thermally conductive surface of the heat slug will intimately contact a heat-radiating bottom surface of the electronic device when the electronic device is in position for testing by the test contactor. A separate heat slug may also be provided for contacting a heat-radiating top surface of the electronic device. Either or both of the heat slugs may be spring loaded or otherwise movably constrained to maximize surface contact with the electronic device by self-positioning when all elements are placed in proper test position. Improved thermal contact may also be achieved by the use of compliant material between the respective contact surfaces of the heat slug and electronic device.

Abstract: A pickup chuck having a heat slug for removing heat from a heat generating device that is held within the pickup chuck.

Abstract: An apparatus and method for controlling the temperature of a heat generating device. In one embodiment, a pickup chuck having a heat pipe is provided. The heat pipe includes a first end defining an evaporator portion and a second end defining a condenser portion. A thermally conductive member at the first end of the heat pipe is adapted to engage a surface of the heat generating device. Heat is transferred away from the heat generating device by engaging the thermally conductive member with a surface of the heat generating device.