Abstract: Ionized metal cluster beam deposition of metal bumps on substrates such as multi-chip modules and integrated circuit chips is enhanced. The present invention discloses wet etching techniques for removing unwanted metal deposited on the substrate around bumps, and multiple sources for depositing alloyed (tin-lead) bumps with constant composition.

Abstract: A first laser beam and a second laser beam with a longer wavelength than the first laser beam are directed at a first metal member in contact with a second metal member. At the ambient temperature the first member has high absorption of energy from the first laser beam but low absorption of energy from the second laser beam. As the first member absorbs energy from the first laser beam the temperature of the first member increases and the reflectivity of the first member decreases so that the first member has high absorption of energy from the second laser beam. The first member then absorbs energy from the second laser beam, the temperature of the first member further increases and at least one of the members melts. After discontinuing the laser beams a solid bond forms between the members.

Abstract: A method of electrically testing an electrical component containing a plurality of networks with at least one node. The method uses segmented, charge limiting testing to charge the nodes and detect shorted or disconnected nodes while preventing accumulated charges in the networks from making uncharged nodes appear charged. The method is well suited for voltage contrast electron beam testing of unpopulated high density multichip modules and interconnect substrates.

Abstract: A method of making bonding bumps on the pads of an electrical chip including depositing a layer of metallic adhesion material over the surface, depositing metallic bumps on the metallic adhesion material over each of the pad areas using a focused liquid metal ion source, and chemically etching the layer of metallic adhesion material off the surface outside of the deposited bumps.

Abstract: Metal electrical members bonded by coupling to at least one member a frequency doubled pulsed Nd:YAG laser comprising 533 and 1064 nm wavelengths is described. Frequency doubling is accomplished by directing a 1064 nm wavelength pulsed Nd:YAG laser at an intracavity nonlinear crystal such as potassium titanyl phosphate between a highly reflective mirror and a partially reflective mirror to produce frequency doubling. An infrared reflector outside the cavity can reduce the 1064 nm wavelength thereby increasing the percentage of 533 nm wavelength. Alternatively the laser beam can be split and the separate wavelengths directed to separate attenuators to allow the percentage of both 533 nm and 1064 nm wavelengths to be adjusted. A gold bump on an integrated circuit can be bonded to a gold plated copper TAB tape lead.