Patents by Inventor Randolph S. Hahn

Randolph S. Hahn has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 8896985
    Abstract: A capacitor with an anode, a dielectric on the anode and a cathode on the dielectric. A blocking layer is on the cathode. A metal filled layer is on said blocking layer and a plated layer is on the metal filled layer.
    Type: Grant
    Filed: April 16, 2013
    Date of Patent: November 25, 2014
    Assignee: Kemet Electronics Corporation
    Inventors: Antony P. Chacko, Randolph S. Hahn
  • Publication number: 20140301022
    Abstract: A process for preparing a solid electrolytic capacitor comprising application of a non-ionic polyol prior to application of a conducting polymer layer.
    Type: Application
    Filed: May 29, 2014
    Publication date: October 9, 2014
    Inventors: Qingping Chen, Hong Zhang, Antony P. Chacko, Philip M. Lessner, Randolph S. Hahn, Yongjian Qiu, Keith R. Brenneman
  • Publication number: 20140233157
    Abstract: An improved capacitor is provided wherein the improved capacitor has improved ESR. The capacitor has a fluted anode and an anode wire extending from the fluted anode. A dielectric is on the fluted anode. A conformal cathode is on the dielectric and a plated metal layer is on the carbon layer.
    Type: Application
    Filed: February 19, 2014
    Publication date: August 21, 2014
    Inventors: Randolph S. Hahn, Jeffrey Poltorak, Brandon Summey, Antony P. Chacko, John T. Kinard, Philip M. Lessner
  • Patent number: 8808403
    Abstract: A process for forming a solid electrolytic capacitor and an electrolytic capacitor formed by the process. The process includes: providing an anode wherein the anode comprises a porous body and an anode wire extending from the porous body; apply a thin polymer layer onto the dielectric, and forming a dielectric on the porous body to form an anodized anode; applying a first slurry to the anodized anode to form a blocking layer wherein the first slurry comprises a first conducting polymer with an median particle size of at least 0.05 ?m forming a layer of crosslinker on the blocking layer; and applying a layer of a second conducting polymer on the layer of crosslinker.
    Type: Grant
    Filed: September 14, 2011
    Date of Patent: August 19, 2014
    Assignee: Kemet Electronics Corporation
    Inventors: Yongjian Qiu, Randolph S. Hahn, Kristen Key, Qingping Chen
  • Patent number: 8771381
    Abstract: A process for preparing a solid electrolytic capacitor comprising application of a non-ionic polyol prior to application of a conducting polymer layer.
    Type: Grant
    Filed: February 15, 2012
    Date of Patent: July 8, 2014
    Assignee: Kemet Electronics Corporation
    Inventors: Qingping Chen, Hong Zhang, Antony P. Chacko, Philip M. Lessner, Randolph S. Hahn, Yongjian Qiu, Keith R. Brenneman
  • Publication number: 20140055913
    Abstract: A solid electrolytic capacitor and method for forming a solid electrolytic capacitor with high temperature leakage stability is described. The solid electrolytic capacitor has improved leakage current and is especially well suited for high temperature environments such as down-hole applications.
    Type: Application
    Filed: October 25, 2013
    Publication date: February 27, 2014
    Applicant: Kemet Electronics Corporation
    Inventors: Antony P. Chacko, Randolph S. Hahn, Pablo Antonio Ruiz
  • Publication number: 20130314845
    Abstract: A solid electrolytic capacitor is described which comprises an anode, a dielectric on the anode and a cathode on the dielectric. A conductive coating is on the cathode wherein the conductive layer comprises an exterior surface of a first high melting point metal. An adjacent layer is provided comprising a second high melting point metal, wherein the first high melting point metal and the second high melting point metal are metallurgically bonded with a low melting point metal.
    Type: Application
    Filed: August 6, 2013
    Publication date: November 28, 2013
    Applicant: Kemet Electronics Corporation
    Inventors: Antony P. Chacko, John E. McConnell, Robert Ramsbottom, Philip M. Lessner, Randolph S. Hahn, John Bultitude
  • Publication number: 20130250486
    Abstract: An improved solid electrolytic capacitor and method of forming a solid electrolytic capacitor is described. The method includes forming an anode comprising a valve metal or conductive oxide of a valve metal wherein an anode lead extension protrudes from the anode. A dielectric is formed on the anode and a cathode layer is formed on the dielectric. The anode, dielectric, and cathode layer are encased in a non-conducting material and the anode lead extension is exposed outside of the encasement at a side surface. A conductive metal layer is adhered to the anode lead extension which allows termination preferably by electrically connecting a preformed solid metal terminal, most preferably an L shaped terminal, to the conductive metal layer at the side surface.
    Type: Application
    Filed: May 15, 2013
    Publication date: September 26, 2013
    Applicant: Kemet Electronics Corporation
    Inventors: Brandon Summey, Jeffrey Poltorak, Philip M. Lessner, Yongjian Qiu, Randolph S. Hahn, David Jacobs, Keith R. Brenneman, Albert K. Harrington, Chris Stolarski
  • Publication number: 20130251891
    Abstract: A capacitor with an anode, a dielectric on the anode and a cathode on the dielectric. A blocking layer is on the cathode. A metal filled layer is on said blocking layer and a plated layer is on the metal filled layer.
    Type: Application
    Filed: April 16, 2013
    Publication date: September 26, 2013
    Applicant: Kemet Electronics Corporation
    Inventors: Antony P. Chacko, Randolph S. Hahn
  • Patent number: 8520366
    Abstract: An improved solid electrolytic capacitor and method of forming a solid electrolytic capacitor is described. The method includes forming an anode comprising a valve metal or conductive oxide of a valve metal wherein an anode lead extension protrudes from the anode. A dielectric is formed on the anode and a cathode layer is formed on the dielectric. The anode, dielectric, and cathode layer are encased in a non-conducting material and the anode lead extension is exposed outside of the encasement at a side surface. A conductive metal layer is adhered to the anode lead extension which allows termination preferably by electrically connecting a preformed solid metal terminal, most preferably an L shaped terminal, to the conductive metal layer at the side surface.
    Type: Grant
    Filed: December 22, 2010
    Date of Patent: August 27, 2013
    Assignee: Kemet Electronics Corporation
    Inventors: Brandon Summey, Jeffrey Poltorak, Philip M. Lessner, Yongjian Qiu, Randolph S. Hahn, David Jacobs, Keith R. Brenneman, Albert Harrington, Chris Stolarski
  • Patent number: 8325465
    Abstract: A capacitor is described with an NbO anode. The capacitor has an NbO anode and an NbO anode lead extending from the NbO anode. A dielectric is on the NbO anode and a conductor is on the dielectric.
    Type: Grant
    Filed: July 8, 2008
    Date of Patent: December 4, 2012
    Assignee: Kemet Electronics Corporation
    Inventors: Yuri Freeman, Philip M. Lessner, Jeffrey Poltorak, Randolph S. Hahn
  • Patent number: 8262745
    Abstract: The capacitor has a monolithic anode and at least one anode lead wire extending from the anode. At least one sacrificial lead wire extends from the anode. A dielectric layer is on said anode and a cathode layer is on the dielectric layer. The anode lead wire is in electrical contact with the anode and a cathode lead is in electrical contact with the cathode.
    Type: Grant
    Filed: July 21, 2010
    Date of Patent: September 11, 2012
    Assignee: Kemet Electronics Corporation
    Inventors: Erik Reed, David Jacobs, Randolph S. Hahn
  • Publication number: 20120206860
    Abstract: A process for preparing a solid electrolytic capacitor comprising application of a non-ionic polyol prior to application of a conducting polymer layer.
    Type: Application
    Filed: February 15, 2012
    Publication date: August 16, 2012
    Inventors: Qingping Chen, Hong Zhang, Antony P. Chacko, Phillip M. Lessner, Randolph S. Hahn, Yongjian Qiu, Keith R. Brenneman
  • Publication number: 20120206859
    Abstract: A process for preparing a solid electrolytic capacitor comprising application of coverage enhancing catalyst followed by application of a conducting polymer layer. Coverage enhancing catalyst is removed after coating and curing.
    Type: Application
    Filed: February 15, 2012
    Publication date: August 16, 2012
    Inventors: Antony P. Chacko, Qingping Chen, Jin Yang, Phillip M. Lessner, Randolph S. Hahn, Yongjian Qiu, Keith R. Brenneman
  • Publication number: 20120063063
    Abstract: A process for forming a solid electrolytic capacitor and an electrolytic capacitor formed by the process. The process includes: providing an anode wherein the anode comprises a porous body and an anode wire extending from the porous body; apply a thin polymer layer onto the dielectric, and forming a dielectric on the porous body to form an anodized anode; applying a first slurry to the anodized anode to form a blocking layer wherein the first slurry comprises a first conducting polymer with an median particle size of at least 0.05 ?m forming a layer of crosslinker on the blocking layer; and applying a layer of a second conducting polymer on the layer of crosslinker.
    Type: Application
    Filed: September 14, 2011
    Publication date: March 15, 2012
    Applicant: Kemet Electronics Corporation
    Inventors: Yongjian Qiu, Randolph S. Hahn, Kristen Key, Qingping Chen
  • Publication number: 20110292572
    Abstract: A solid electrolytic capacitor with an anode and a dielectric on the anode. A cathode is on the dielectric and a conductive coating on said dielectric. A cathode lead is electrically connected to the conductive coating by an adhesive selected from the group consisting of a transient liquid phase sinterable material and polymer solder.
    Type: Application
    Filed: May 24, 2011
    Publication date: December 1, 2011
    Applicant: Kemet Electronics Corporation
    Inventors: Antony P. Chacko, John E. McConnell, Philip M. Lessner, Randolph S. Hahn, John Bultitude
  • Publication number: 20110265299
    Abstract: The capacitor has a monolithic anode and at least one anode lead wire extending from the anode. At least one sacrificial lead wire extends from the anode. A dielectric layer is on said anode and a cathode layer is on the dielectric layer. The anode lead wire is in electrical contact with the anode and a cathode lead is in electrical contact with the cathode.
    Type: Application
    Filed: July 21, 2010
    Publication date: November 3, 2011
    Applicant: Kemet Electronics Corporation
    Inventors: Erik Reed, David Jacobs, Randolph S. Hahn
  • Publication number: 20110149477
    Abstract: An improved solid electrolytic capacitor and method of forming a solid electrolytic capacitor is described. The method includes forming an anode comprising a valve metal or conductive oxide of a valve metal wherein an anode lead extension protrudes from the anode. A dielectric is formed on the anode and a cathode layer is formed on the dielectric. The anode, dielectric, and cathode layer are encased in a non-conducting material and the anode lead extension is exposed outside of the encasement at a side surface. A conductive metal layer is adhered to the anode lead extension which allows termination preferably by electrically connecting a preformed solid metal terminal, most preferably an L shaped terminal, to the conductive metal layer at the side surface.
    Type: Application
    Filed: December 22, 2010
    Publication date: June 23, 2011
    Inventors: Brandon Summey, Jeffrey Poltorak, Philip M. Lessner, Yongjian Qiu, Randolph S. Hahn, David Jacobs, Keith R. Brenneman, Albert Harrington, Chris Stolarski
  • Patent number: 7929274
    Abstract: The capacitor has a monolithic anode and at least one anode lead wire extending from the anode. At least one sacrificial lead wire extends from the anode. A dielectric layer is on said anode and a cathode layer is on the dielectric layer. The anode lead wire is in electrical contact with the anode and a cathode lead is in electrical contact with the cathode.
    Type: Grant
    Filed: April 3, 2008
    Date of Patent: April 19, 2011
    Assignee: Kemet Electronics Corporation
    Inventors: Erik Reed, David Jacobs, Randolph S. Hahn
  • Publication number: 20090251847
    Abstract: The capacitor has a monolithic anode and at least one anode lead wire extending from the anode. At least one sacrificial lead wire extends from the anode. A dielectric layer is on said anode and a cathode layer is on the dielectric layer. The anode lead wire is in electrical contact with the anode and a cathode lead is in electrical contact with the cathode.
    Type: Application
    Filed: April 3, 2008
    Publication date: October 8, 2009
    Inventors: Erik Reed, David Jacobs, Randolph S. Hahn