Abstract: An apparatus and method for handling and/or pre-processing microelectronic workpieces. In one embodiment, the apparatus includes an input/output station configured to removably receive a plurality of microelectronic workpieces at an input/output location, a transfer station, and a first transfer device that moves the microelectronic workpieces directly between the input/output location and the transfer station. A second transfer device moves the microelectronic workpieces directly from the transfer station to at least one process station. The transfer station can include a pre-process station configured to identify and/or align the microelectronic workpieces. The apparatus can further include a storage station configured to support a plurality of microelectronic workpieces and can be positioned to at least partially overlap the pre-process station.

Abstract: A lift and rotate assembly for use in a workpiece processing station. The lift and rotate assembly includes a body having a slim profile and pins located on opposite sides for mounting the assembly onto a tool frame. The lift and rotate assembly is removably and pivotally mounted to an exposed outer surface of the frame. The lift and rotate assembly has a body, a process head movably connected to the body, and control components mounted within the body and configured to move the process head relative to the body. The lift and rotate assembly in one embodiment is positionable in a forward, operating position with the body adjacent to the frame, and in a tilted, service position with the body tilted away from the frame.

Abstract: A method and apparatus for manually and automatically processing microelectronic workpieces. The apparatus can include a tool having a plurality of processing stations, all of which are manually accessible to a user, and an input/output station configured to support at least one microelectronic workpiece for automatic transfer to and from the processing stations. A transfer device is positioned proximate to the input/output station and the processing stations and is configured to automatically transfer microelectronic workpieces between the input/output station and the processing stations. The apparatus can be used for both manual and automatic processing of microelectronic workpieces, either sequentially or simultaneously. The processing stations can be configured to perform on the microelectronic workpiece functions such as material application, material removal, seed layer enhancement, rinsing, drying, annealing, baking, and metrology.

Abstract: A method and apparatus for manually and automatically processing microelectronic workpieces. The apparatus can include a tool having a plurality of processing stations, all of which are manually accessible to a user, and an input/output station configured to support at least one microelectronic workpiece for automatic transfer to and from the processing stations. A transfer device is positioned proximate to the input/output station and the processing stations and is configured to automatically transfer microelectronic workpieces between the input/output station and the processing stations. The apparatus can be used for both manual and automatic processing of microelectronic workpieces, either sequentially or simultaneously.

Abstract: A system and method are provided for monitoring information delivered through an electronic delivery system. One method for monitoring electronically delivering documents is provided which includes the steps of: creating log files for storing selected data related to selected electronic document preparation events; forwarding the log files to a central database for storage; and providing access to the log files for retrieval and analysis.

Abstract: A system and method are provided for reliable and customer-friendly delivery of documents. One method of the present invention include the steps of: producing document data for printing documents; accepting requests to print selected documents; determining whether a selected document is accepted for electronic delivery or for non-electronic delivery; printing documents accepted for non-electronic delivery; and electronically delivering documents accepted for electronic delivery.

Abstract: A process system for processing semiconductor wafers includes a stocker module, and immersion module, and a process module. A process robot moves on a lateral rail to transfer wavers between the modules. The immersion module is separated from the other modules, to avoid transmission of vibration. Immersion tanks are radially positioned within the immersion module, to provide a compact design. An immersion robot moves batches of wafers on an end effector between the immersion tanks. The end effector may be detachable from the immersion robot, so that the immersion robot can move a second batch of wafers, while the first batch of wafers undergoes an immersion process.

Abstract: End-effectors may be used to grasp microelectronic workpieces for handling by automated transport devices. One such end-effector includes a plurality of abutments and a detector adapted to detect engagement of the edge of the workpiece by at least one of the abutments.

Abstract: End-effectors may be used to grasp microelectronic workpieces for handling by automated transport devices. One such end-effector includes a plurality of end-effectors and a detector adapted to detect engagement of the edge of the workpiece by at least one of the abutments. An alternative end-effector includes at least three abutments, at least one of which is resiliently connected to an actuator for movement between a retracted position and a deployed position wherein it engages a workpiece.

Abstract: An apparatus and method for handling microelectronic workpieces initially positioned in a container. The container can be changeable from a first configuration where the microelectronic workpiece is generally inaccessible within the container to a second configuration where the microelectronic workpiece is accessible for removal from the container. The apparatus can include a container access device positionable proximate to an aperture of an enclosure that at least partially encloses a region for handling a microelectronic workpiece. The container access device can be movably positioned proximate to the aperture to change the configuration of the container from the first configuration to the second configuration. A container support can be positioned proximate to the aperture and can be configured to move the container to a fixed, stationary position relative to the aperture when the container is in the second configuration.

Abstract: A process system for processing semiconductor wafers includes a stocker module, and immersion module, and a process module. A process robot moves on a lateral rail to transfer wavers between the modules. The immersion module is separated from the other modules, to avoid transmission of vibration. Immersion tanks are radially positioned within the immersion module, to provide a compact design. An immersion robot moves batches of wafers on an end effector between the immersion tanks. The end effector may be detachable from the immersion robot, so that the immersion robot can move a second batch of wafers, while the first batch of wafers undergoes an immersion process.

Abstract: A caulking gun and support device comprises a base member for providing stability to the device and for mounting over a surface. A supporting arm extends upwardly from the base member. A caulking gun for receiving a receptacle containing caulking material is mounted on the supporting arm. An adjustment mechanism for selectively positioning and securing the caulking gun is also provided.

Abstract: A caulking gun and support device comprises a base member for providing stability to the device and for mounting over a surface. A supporting arm extends upwardly from the base member. A caulking gun for receiving a receptacle containing caulking material is mounted on the supporting arm. An adjustment mechanism for selectively positioning and securing the caulking gun is also provided.

Abstract: A process system for processing semiconductor wafers includes a stocker module, and immersion module, and a process module. A process robot moves on a lateral rail to transfer wavers between the modules. The immersion module is separated from the other modules, to avoid transmission of vibration. Immersion tanks are radially positioned within the immersion module, to provide a compact design. An immersion robot moves batches of wafers on an end effector between the immersion tanks. The end effector may be detachable from the immersion robot, so that the immersion robot can move a second batch of wafers, while the first batch of wafers undergoes an immersion process.

Abstract: Microelectronic workpiece transfer devices and methods for using such transfer devices. One embodiment of a transfer device includes a transport unit configured to move along a linear track and a lift assembly carried by the transport unit. The transfer device can also include an arm assembly having an arm actuator carried by the lift assembly to move along a lift path and an arm carried by the arm actuator to rotate about the lift path. The arm can include an extension projecting from one side of the lift path. The arm actuator can rotate the arm about the lift path. The transfer device can also include a first end-effector and a second end-effector. The end-effectors are rotatably coupled to the extension of the arm and can rotate independently about a common axis, with the first and second end-effectors at different elevations relative to the arm.

Abstract: Processing tools, components of tools, and methods of making and using such devices for electrochemical processing of microelectronic workpieces. One aspect of the invention is directed toward reaction vessels for electrochemical processing of microelectronic workpieces, processing stations including such reaction vessels, and methods for using these devices. For example, one embodiment of a reaction vessel includes an outer container having an outer wall, a first outlet configured to introduce a primary fluid flow into the outer container, and at least one second outlet configured to introduce a secondary fluid flow into the outer container separate from the primary fluid flow. The reaction vessel can also include at least one electrode, and it can also have a field shaping unit.

Abstract: Transfer devices for handling microelectronic workpieces, apparatus for processing microelectronic workpieces, and methods for manufacturing and using such transfer devices. One embodiment of a transfer device includes a transport unit configured to move along a linear track and a lift assembly carried by the transport unit. The transfer device can also include an arm assembly having an arm actuator carried by the lift assembly to move along a lift path and an arm carried by the arm actuator to rotate about the lift path. The arm can include a first extension projecting from one side of the lift path and a second extension projecting from another side of the lift path. The arm actuator can rotate the arm about the lift path. The transfer device can also include a first end-effector and a second end-effector.

Abstract: An electrochemical processing chamber which can be modified for treating different workpieces and methods for so modifying electrochemical processing chambers. In one particular embodiment, an electrochemical processing chamber 200 includes a plurality of walls 510 defining a plurality of electrode compartments 520, each electrode compartment having at least one electrode 600 therein, and a virtual electrode unit 530 defining a plurality of flow conduits, with at least one of the flow conduits being in fluid communication with each of the electrode compartments. This first virtual electrode unit 530 may be exchanged for a second virtual electrode unit 540, without modification of any of the electrodes 600, to adapt the processing chamber 200 for treating a different workpiece.

Abstract: Transfer devices for handling microelectronic workpieces, apparatus for processing microelectronic workpieces, and methods for manufacturing and using such transfer devices. One embodiment of a transfer device includes a transport unit configured to move along a linear track and a lift assembly carried by the transport unit. The transfer device can also include an arm assembly having an arm actuator carried by the lift assembly to move along a lift path and an arm carried by the arm actuator to rotate about the lift path. The arm can include a first extension projecting from one side of the lift path and a second extension projecting from another side of the lift path. The arm actuator can rotate the arm about the lift path. The transfer device can also include a first end-effector and a second end-effector.

Abstract: A lift and rotate assembly for use in a workpiece processing station. The lift and rotate assembly includes a body having a slim profile and pins located on opposite sides for mounting the assembly onto a tool frame. The lift and rotate assembly is removably and pivotally mounted to an exposed outer surface of the frame. The lift and rotate assembly has a body, a process head movably connected to the body, and control components mounted within the body and configured to move the process head relative to the body. The lift and rotate assembly in one embodiment is positionable in a forward, operating position with the body adjacent to the frame, and in a tilted, service position with the body tilted away from the frame.