Abstract: A method including punching a first hole in a parent sheet metal, such that a substantially round section with a first diameter is removed from the hole, forming a second hole by inserting a mandrel into the first hole, causing a portion of the parent sheet metal to deform in a downward direction and increase the diameter of the first hole to a second diameter, the deformed portion of the parent sheet metal is substantially perpendicular to the parent sheet metal, forming a thread into an interior sidewall of the second hole, and forming the parent sheet metal into a water tight manifold.

Abstract: A method including punching a first hole in a parent sheet metal, such that a substantially round section with a first diameter is removed from the hole, forming a second hole by inserting a mandrel into the first hole, causing a portion of the parent sheet metal to deform in a downward direction and increase the diameter of the first hole to a second diameter, the deformed portion of the parent sheet metal is substantially perpendicular to the parent sheet metal, forming a thread into an interior sidewall of the second hole, and forming the parent sheet metal into a water tight manifold.

Abstract: A cooling system is provided which includes, for instance, a coolant circulation loop, one or more primary coolant pumps, and a fill and drain pump. The primary coolant pump(s) is coupled to facilitate circulating coolant through the coolant circulation loop, and the fill and drain pump facilitates selective filling of the cooling system with the coolant, or draining of the coolant from the cooling system. The fill and drain pump is integrated with the cooling system as a backup coolant pump to the primary coolant pump(s), and circulates the coolant through the coolant circulation loop responsive to an error in the primary coolant pump(s). The primary coolant pump(s) and fill and drain pumps may be different types of pumps, and the cooling system further includes a control system for automatically activating the fill and drain pump upon detection of an error in the primary coolant pump(s).

Abstract: A cooling system is provided which includes, for instance, a coolant circulation loop, one or more primary coolant pumps, and a fill and drain pump. The primary coolant pump(s) is coupled to facilitate circulating coolant through the coolant circulation loop, and the fill and drain pump facilitates selective filling of the cooling system with the coolant, or draining of the coolant from the cooling system. The fill and drain pump is integrated with the cooling system as a backup coolant pump to the primary coolant pump(s), and circulates the coolant through the coolant circulation loop responsive to an error in the primary coolant pump(s). The primary coolant pump(s) and fill and drain pumps may be different types of pumps, and the cooling system further includes a control system for automatically activating the fill and drain pump upon detection of an error in the primary coolant pump(s).

Abstract: A cooling system is provided which includes, for instance, a coolant supply manifold, a multifunction coolant manifold structure, and multiple cooling structures. The multifunction coolant manifold structure includes a coolant-commoning manifold and an auxiliary coolant reservoir above and in fluid communication with the coolant-commoning manifold. The multiple cooling structures are coupled in parallel fluid communication between the coolant supply and coolant-commoning manifolds to receive coolant from the supply, and exhaust coolant to the coolant-commoning manifold. The coolant-commoning manifold is sized to slow therein a flow rate of coolant exhausting from the multiple cooling structures to allow gas within the exhausting coolant to escape the coolant within the coolant-commoning manifold. The escaping gas rises to the auxiliary coolant reservoir and is replaced within the coolant-commoning manifold by coolant from the auxiliary coolant reservoir.

Abstract: A cooling system is provided which includes, for instance, a coolant supply manifold, a multifunction coolant manifold structure, and multiple cooling structures. The multifunction coolant manifold structure includes a coolant-commoning manifold and an auxiliary coolant reservoir above and in fluid communication with the coolant-commoning manifold. The multiple cooling structures are coupled in parallel fluid communication between the coolant supply and coolant-commoning manifolds to receive coolant from the supply, and exhaust coolant to the coolant-commoning manifold. The coolant-commoning manifold is sized to slow therein a flow rate of coolant exhausting from the multiple cooling structures to allow gas within the exhausting coolant to escape the coolant within the coolant-commoning manifold. The escaping gas rises to the auxiliary coolant reservoir and is replaced within the coolant-commoning manifold by coolant from the auxiliary coolant reservoir.

Abstract: A cooling method is provided to remove heat generated by one or more electronic systems. The method includes providing a coolant-based cooling apparatus, redundant pumping units, redundant backup blowers, and multiple separate controllers. The cooling apparatus includes one or more heat exchange assemblies discharging heat from coolant of the cooling apparatus, and the redundant pumping units, which are coupled in parallel fluid communication, separately facilitate pumping of the coolant. The redundant backup blowers are disposed to provide, when activated, backup airflow across the electronic system(s). The multiple controllers control operation of the redundant pumping units and redundant backup blowers based, at least in part, on one or more sensed parameters.

Abstract: A cooling system is provided to remove heat generated by one or more electronic systems. The cooling system includes a coolant-based cooling apparatus, redundant pumping units, redundant backup blowers, and multiple separate controllers. The cooling apparatus includes one or more heat exchange assemblies discharging heat from coolant of the cooling apparatus, and the redundant pumping units, which are coupled in parallel fluid communication, separately facilitate pumping of the coolant. The redundant backup blowers are disposed to provide, when activated, backup airflow across the electronic system(s). The multiple controllers control operation of the redundant pumping units and redundant backup blowers based, at least in part, on one or more sensed parameters.

Abstract: Field-replaceable, modular pumping units are provided, configured to facilitate pumping coolant through a cooling apparatus assisting in removal of heat generated by one or more electronic systems. The cooling apparatus includes one or more heat exchange assemblies, and the modular pumping units are coupled in parallel fluid communication to the cooling apparatus. The modular pumping unit includes a housing, a coolant inlet to the housing, a coolant reservoir tank disposed within the housing, a coolant pump, and a coolant outlet of the housing. The coolant reservoir tank and coolant pump are disposed within the housing in fluid communication, and the coolant pump pumps coolant from the coolant reservoir tank to the coolant outlet of the housing. A modular pumping unit controller is associated with the modular pumping unit, and automatically adjusts operation of the coolant pump based upon one or more sensed parameters.

Abstract: A cooling method is provided to remove heat generated by one or more electronic systems. The method includes providing a coolant-based cooling apparatus, redundant pumping units, redundant backup blowers, and multiple separate controllers. The cooling apparatus includes one or more heat exchange assemblies discharging heat from coolant of the cooling apparatus, and the redundant pumping units, which are coupled in parallel fluid communication, separately facilitate pumping of the coolant. The redundant backup blowers are disposed to provide, when activated, backup airflow across the electronic system(s). The multiple controllers control operation of the redundant pumping units and redundant backup blowers based, at least in part, on one or more sensed parameters.

Abstract: A cooling system is provided to remove heat generated by one or more electronic systems. The cooling system includes a coolant-based cooling apparatus, redundant pumping units, redundant backup blowers, and multiple separate controllers. The cooling apparatus includes one or more heat exchange assemblies discharging heat from coolant of the cooling apparatus, and the redundant pumping units, which are coupled in parallel fluid communication, separately facilitate pumping of the coolant. The redundant backup blowers are disposed to provide, when activated, backup airflow across the electronic system(s). The multiple controllers control operation of the redundant pumping units and redundant backup blowers based, at least in part, on one or more sensed parameters.

Abstract: Apparatuses are provided to facilitate sensing fluid within a fluid system, such as a coolant-based cooling apparatus for removing heat generated by one or more electronic components. The apparatus includes a plug configured to couple to a wall of the fluid system at an opening in the wall and to form a fluid-tight seal about the opening. The plug includes a fluid a fluid-sensor-receiving space configured to receive a fluid sensor, and when the plug is coupled to the wall at the opening, to position the fluid sensor at the opening in a manner to facilitate sensing of fluid within the system. The fluid sensor is removable from the plug without requiring uncoupling of the plug from the wall. In one implementation, the fluid sensor is a proximity sensor, and the plug is fabricated of a non-conductive material, and the wall a conductive material.

Abstract: Field-replaceable, modular pumping units are provided, configured to facilitate pumping coolant through a cooling apparatus assisting in removal of heat generated by one or more electronic systems. The cooling apparatus includes one or more heat exchange assemblies, and the modular pumping units are coupled in parallel fluid communication to the cooling apparatus. The modular pumping unit includes a housing, a coolant inlet to the housing, a coolant reservoir tank disposed within the housing, a coolant pump, and a coolant outlet of the housing. The coolant reservoir tank and coolant pump are disposed within the housing in fluid communication, and the coolant pump pumps coolant from the coolant reservoir tank to the coolant outlet of the housing. A modular pumping unit controller is associated with the modular pumping unit, and automatically adjusts operation of the coolant pump based upon one or more sensed parameters.

Abstract: A method and incorporated hybrid air and liquid cooled heat sink that is provided for cooling electronic components. The heat sink comprises a finned structure having fins positioned for air to pass easily through them. The finned structure is flanked by a heat source plate on one side (closer to direction of heat flowing from electronic components) and a second plate on its opposing side such that both of the plates are in thermal communication with fin tips and fin base of the finned structure. The heat source plate itself is composed of two complementary halves with fins on each half. When brought together, the two halves form a unitary, fluid sealed plate while allowing passage of fluids through it by allowing the fins on each half to create and interleaving structure. A fluid re-circulator is also disposed at least partially in the plates for circulating fluids though the plates and the finned structure such that both fin tips and fin base are cooled.

Abstract: A multiport expansion device for vapor compression refrigeration systems is provided having improved reliability by preventing orifice fouling by virtue of its mechanical design. Furthermore, multiple arrays of ports of two or more similar or differently sized port holes is contemplated which allows further reliability based on redundant orifices and pin combinations.

Abstract: Apparatus, systems and methods for coordinated detecting condensation utilizing a wet bulb and dry bulb temperature differential are disclosed. According to exemplary embodiments, a condensation detector may include; a first temperature sensor which generates a first temperature signal corresponding to a temperature measured at the first temperature sensor, a second temperature sensor which generates a second temperature signal corresponding to a temperature measured at the second temperature sensor, a connector having a first end connected to the first temperature sensor, and a detector which receives the first and the second temperature signals and determines the presence of condensation at a second end of the connector based on differences between the first and second temperature signals.

Abstract: Apparatus, systems and methods for coordinated detecting condensation utilizing a wet bulb and dry bulb temperature differential are disclosed. According to exemplary embodiments, a condensation detector may include; a first temperature sensor which generates a first temperature signal corresponding to a temperature measured at the first temperature sensor, a second temperature sensor which generates a second temperature signal corresponding to a temperature measured at the second temperature sensor, a connector having a first end connected to the first temperature sensor, and a detector which receives the first and the second temperature signals and determines the presence of condensation at a second end of the connector based on differences between the first and second temperature signals.

Abstract: A method and incorporated heat sink that is cooled both thorough air flow and liquid circulation is provided. The heat sink is disposed close to electronic components and used for their cooling. It comprises a finned structure positioned such that air can easily pass though it; a heat source plate disposed thermally in direction of heat flow to one side of the finned structure such that the heat source plate is in thermal communication with the finned structure fin base and fin tips, and a second plate also disposed at an opposing end of the finned structure in thermal communication both with finned structure fin base and fin tips. The heat sink also includes fluid re-circulator disposed at least partially in the plates for circulating fluids though the plates and around said finned structure such that both fin tips and fin base is cooled.

Abstract: A multiport expansion device for vapor compression refrigeration systems is provided having improved reliability by preventing orifice fouling by virtue of its mechanical design. Furthermore, multiple arrays of ports of two or more similar or differently sized port holes is contemplated which allows further reliability based on redundant orifices and pin combinations.

Abstract: Method, system and program product are provided for facilitating operation of a cooling system designed to provide system coolant to one or more electronics subsystems of a computing environment. The technique includes automatically checking at least one coolant loop of the cooling system for a leak. The automatically checking includes isolating the at least one coolant loop from coolant flow through the cooling system and checking for drop in coolant pressure within the at least one coolant loop. Upon detection of a drop in coolant pressure, isolation of the coolant loop is retained thereby allowing operation of the cooling system to continue notwithstanding detection of a leak in the at least one coolant loop.