Abstract: Adaptive electrostatic discharge (ESD) protection of a device interface has very good ESD robustness when it is handled or when installed into or removed from a system. And has robust immunity to DPI, electromagnetic interference (EMI) and the like, when it is operational in a system. There is a significant capacitive coupling between the drain and gate of a ESD protection metal oxide semiconductor (MOS) device to enhance ESD protection and lower snap back voltage thereof whenever there is no (or a low level) DPI on the external connection to be protected. Whereupon when a significant DPI/EMI signal is detected on the external connection, the capacitive coupling between the drain and gate of the MOS ESD protection device is disconnected, bypassed or attenuated so that DPI/EMI immunity of the device is enhanced.

Abstract: A constant current output sink or source eliminates a current limiting series resistor for a light emitting diode (LED) and maintains a constant light intensity from the LED for all operating and manufacturing variables of a digital device since the current through the LED is maintained at a constant value. The constant current output sink or source may be programmable for selection of a constant current value from a plurality of constant current values available.

Abstract: A remote keyless entry (RKE) transponder has a programmable selective wake-up filter for determining whether the RKE transponder should wake-up to process a received signal. The wake-up filter correlates the timing of an input signal's carrier amplitude on and off time periods to a predefined programmable time period profile for a desired signal which has a certain carrier on time (time period on) and a certain carrier off time (time period off) arranged into a coded “header.” When a received signal matches the predefined time period profile, then the RKE transponder will wake-up to process the incoming signal data. The predefined time period profile may be programmable and may be stored in a header configuration register. Each RKE transponder has unique predefined time period on and time period off profiles.

Abstract: Adaptive electrostatic discharge (ESD) protection of a device interface has very good ESD robustness when it is handled or when installed into or removed from a system. And has robust immunity to DPI, electromagnetic interference (EMI) and the like, when it is operational in a system. There is a significant capacitive coupling between the drain and gate of a ESD protection metal oxide semiconductor (MOS) device to enhance ESD protection and lower snap back voltage thereof whenever there is no (or a low level) DPI on the external connection to be protected. Whereupon when a significant DPI/EMI signal is detected on the external connection, the capa citive coupling between the drain and gate of the MOS ESD protection device is disconnected, bypassed or attenuated so that DPI/EMI immunity of the device is enhanced.

Abstract: Adaptive electrostatic discharge (ESD) protection of a device interface has very good ESD robustness when it is handled or when installed into or removed from a system. And has robust immunity to DPI, electromagnetic interference (EMI) and the like, when it is operational in a system. There is a significant capacitive coupling between the drain and gate of a ESD protection metal oxide semiconductor (MOS) device to enhance ESD protection and lower snap back voltage thereof whenever there is no (or a low level) DPI on the external connection to be protected. Whereupon when a significant DPI/EMI signal is detected on the external connection, the capa citive coupling between the drain and gate of the MOS ESD protection device is disconnected, bypassed or attenuated so that DPI/EMI immunity of the device is enhanced.

Abstract: A method for monitoring a semiconductor fabrication process creates a wafer of semiconductor chips. Each chip has a one or more diodes. Each diode is addressable as part of an array, corresponds to a physical location of the chip, and is connected in series to a stack. The stack is composed of one ore more vertical interconnects and metal contacts. The diode and associated stack of vertical interconnects is addressed, and the current through each of the stacks of vertical interconnects in an array is measured.

Abstract: An array of N-channel memory cells may be separated into independently programmable memory segments by creating multiple, electrically isolated P-wells upon which the memory segments are fabricated. The multiple, electrically isolated P-wells may be created, for example, by p-n junction isolation or dielectric isolation.

Abstract: An integrated circuit digital processor is coupled to either a main program memory or a secondary program memory, wherein the secondary program memory may be low power, high reliability, non-volatile and/or fast memory that may store a limited number of critical program instructions and data for execution by the digital processor. A program memory switch may couple the digital processor to either the main program memory or the secondary program memory. This is particularly advantageous in that the secondary program memory may have attributes not economically feasible with the main program memory. A program memory controller may handle the selection of which of these memories that the digital processor is using to obtain its program instructions, and necessary control signals for switching and operation thereof.

Abstract: A microcontroller apparatus is provided with an instruction set for manipulating the behavior of the microcontroller. The apparatus and system is provided that enables a linearized address space that makes modular emulation possible. Direct or indirect addressing is possible through register files or data memory. Special function registers, including the Program Counter (PC) and Working Register (W), are mapped in the data memory. An orthogonal (symmetrical) instruction set makes possible any operation on any register using any addressing mode. Consequently, two file registers to be used in some two operand instructions. This allows data to be moved directly between two registers without going through the W register. Thus increasing performances and decreasing program memory usage.

Abstract: A microcontroller apparatus is provided with an instruction set for manipulating the behavior of the microcontroller. The apparatus and system is provided that enables a linearized address space that makes modular emulation possible. Direct or indirect addressing is possible through register files or data memory. Special function registers, including the Program Counter (PC) and Working Register (W), are mapped in the data memory. An orthogonal (symmetrical) instruction set makes possible any operation on any register using any addressing mode. Consequently, two file registers to be used to some two operand instructions. This allows data to be moved directly between two registers without going through the W register. Thus, increasing performance and decreasing program memory usage.

Abstract: An electrostatic discharge (ESD) structure having increased voltage withstand at an output terminal of an integrated circuit device has a thin gate oxide layer metal oxide semiconductor (MOS) device coupled in series with a thicker gate oxide layer MOS device. The thin gate oxide layer MOS device may be controlled by a low voltage control circuit of the integrated circuit. The thicker gate oxide layer MOS device may be coupled to an output of the integrated circuit device or a bipolar transistor may be coupled between the output of the integrated circuit device and the thicker gate oxide layer MOS device. The thin gate oxide layer and thicker gate oxide layer MOS devices may be coupled in series.

Abstract: A high voltage ESD-protection structure is used to protect delicate transistor circuits connected to an input or output of an integrated circuit bond pad from destructive high voltage ESD events by conducting at a controlled breakdown voltage that is less than a voltage that may cause destructive breakdown of the input and/or output circuits. The ESD-protection structure is able to absorb high current from these ESD events without snapback that would compromise operation of the higher voltage inputs and/or outputs of the integrated circuit. The ESD-protection structure will conduct when an ESD event occurs at a voltage above a controlled breakdown voltage of an electronic device, e.g., diode, in the ESD protection structure. Conduction of current from an ESD event having a voltage above the electronic device controlled breakdown voltage may be through another electronic device, e.g.

Abstract: A high voltage ESD-protection structure is used to protect delicate transistor circuits connected to an input or output of an integrated circuit bond pad from destructive high voltage ESD events by conducting at a controlled breakdown voltage that is less than a voltage that may cause destructive breakdown of the input and/or output circuits. The ESD-protection structure is able to absorb high current from these ESD events without snapback that would compromise operation of the higher voltage inputs and/or outputs of the integrated circuit. The ESD-protection structure will conduct when an ESD event occurs at a voltage above a controlled breakdown voltage of an electronic device, e.g., diode, in the ESD protection structure. Conduction of current from an ESD event having a voltage above the electronic device controlled breakdown voltage may be through another electronic device, e.g.

Abstract: A remote keyless entry (RKE) transponder has a programmable selective wake-up filter for determining whether the RKE transponder should wake-up to process a received signal. The wake-up filter correlates the timing of an input signal's carrier amplitude on and off time periods to a predefined programmable time period profile for a desired signal which has a certain carrier on time (time period on) and a certain carrier off time (time period off) arranged into a coded “header.” When a received signal matches the predefined time period profile, then the RKE transponder will wake-up to process the incoming signal data. The predefined time period profile may be programmable and may be stored in a header configuration register. Each RKE transponder has unique predefined time period on and time period off profiles.

Abstract: A high voltage ESD-protection structure is used to protect delicate transistor circuits connected to an input or output of an integrated circuit bond pad from destructive high voltage ESD events by conducting at a controlled breakdown voltage that is less than a voltage that may cause destructive breakdown of the input and/or output circuits. The ESD-protection structure is able to absorb high current from these ESD events without snapback that would compromise operation of the higher voltage inputs and/or outputs of the integrated circuit. The ESD-protection structure will conduct when an ESD event occurs at a voltage above a controlled breakdown voltage of an electronic device, e.g., diode, in the ESD protection structure. Conduction of current from an ESD event having a voltage above the electronic device controlled breakdown voltage may be through another electronic device, e.g.

Abstract: A filter register bank, for example, for a CAN module provides parallel and serial access. The filter bank comprises a plurality of memory cells arranged in a matrix of columns and rows, wherein for parallel access all memory cells within a row are selectable and coupled with a first plurality of bus lines and for serial access all memory cells within a column are selectable and coupled with a second plurality of bus lines.

Abstract: An ESD-protection structure is located substantially under an integrated circuit bond pad. This ESD-protection structure is formed as a low capacitance structure by inserting a forward diode between the bond pad and the ESD clamp circuit. Placing the ESD-protection structure under the bond pad eliminates parasitic substrate capacitance and utilizes a parasitic PNP transistor formed from the inserted forward biased diode. The ESD-protection structure comprises adjacent alternating P+ and N+ diffusions located substantially under a bond pad to be ESD protected. The P+ diffusions are connected to the bond pad metal with metal vias through an insulating layer located between the bond pad and the P+ and N+ diffusions. The N+ diffusions are adjacent to the P+ diffusions. An N+ diffusion surrounds the N+ and P+ diffusions, and ties together the N+ diffusions so as to form a continuous N+ diffusion completely around each of the P+ diffusions. An N? well is located substantially under the N+ and P+ diffusions.

Abstract: A microcontroller apparatus is provided with an instruction set for manipulating the behavior of the microcontroller. The apparatus and system is provided that enables a linearized address space that makes modular emulation possible. Direct or indirect addressing is possible through register files or data memory. Special function registers, including the Program Counter (PC) and Working Register (W), are mapped in the data memory. An orthogonal (symmetrical) instruction set makes possible any operation on any register using any addressing mode. Consequently, two file registers to be used to some two operand instructions. This allows data to be moved directly between two registers without going through the W register. Thus, increasing performance and decreasing program memory usage.

Abstract: A microcontroller apparatus is provided with an instruction set for manipulating the behaviour of the microcontroller. The apparatus and system is provided that enables a linearized address space that makes modular emulation possible. Direct or indirect addressing is possible through register files or data memory. Special function registers, including the Program Counter (PC) and Working Register (W), are mapped in the data memory. An orthogonal (symmetrical) instruction set makes possible any operation on any register using any addressing mode. Consequently, two file registers to be used in some two operand instructions. This allows data to be moved directly between two registers without going through the W register. Thus increasing performances and decreasing program memory usage.

Abstract: A filter register bank, for example, for a CAN module provides parallel and serial access. The filter bank comprises a plurality of memory cells arranged in a matrix of columns and rows, wherein for parallel access all memory cells within a row are selectable and coupled with a first plurality of bus lines and for serial access all memory cells within a column are selectable and coupled with a second plurality of bus lines.