Abstract: A method of selecting fault candidates based on the physical layout of an Integrated Circuit (IC) layout, that includes, identifying failing observation points in an IC layout, determining the failing observation points proximity geometry in the IC circuit layout, determining if a proximity criteria for the failing observation points is met, and identifying faults associated with the failing observation points that meet the proximity criteria; and including the identified faults in a fault candidate set.

Abstract: A method of testing an integrated circuit. The method includes selecting a set of physical features of nets and devices of the integrated circuit, the integrated circuit having pattern input points and pattern observation points connected by the nets, each of the nets defined by an input point and all fan out paths to (i) input points of other nets of the nets or (ii) to the pattern observation points; selecting a measurement unit for each feature of the set of features; assigning a weight to each segment of each fan out path based on a number of the measurement units of the feature in each segment of each fan out path of each of the nets; and generating a set of test patterns optimized for test-coverage and cost based on the weights assigned to each segment of each of the nets of the integrated circuit.

Abstract: A method of testing an integrated circuit. The method includes selecting a set of physical features of nets and devices of the integrated circuit, the integrated circuit having pattern input points and pattern observation points connected by the nets, each of the nets defined by an input point and all fan out paths to (i) input points of other nets of the nets or (ii) to the pattern observation points; selecting a measurement unit for each feature of the set of features; assigning a weight to each segment of each fan out path based on a number of the measurement units of the feature in each segment of each fan out path of each of the nets; and generating a set of test patterns optimized for test-coverage and cost based on the weights assigned to each segment of each of the nets of the integrated circuit.

Abstract: A method of testing an integrated circuit. The method includes selecting a set of physical features of nets and devices of the integrated circuit, the integrated circuit having pattern input points and pattern observation points connected by the nets, each of the nets defined by an input point and all fan out paths to (i) input points of other nets of the nets or (ii) to the pattern observation points; selecting a measurement unit for each feature of the set of features; assigning a weight to each segment of each fan out path based on a number of the measurement units of the feature in each segment of each fan out path of each of the nets; and generating a set of test patterns optimized for test-coverage and cost based on the weights assigned to each segment of each of the nets of the integrated circuit.

Abstract: A method of selecting fault candidates based on the physical layout of an Integrated Circuit (IC) layout, that includes, identifying failing observation points in an IC layout, determining the failing observation points proximity geometry in the IC circuit layout, determining if a proximity criteria for the failing observation points is met, and identifying faults associated with the failing observation points that meet the proximity criteria; and including the identified faults in a fault candidate set.

Abstract: A method for testing an integrated circuit and analyzing test data. The method includes: defining a set of signal path selection criteria; selecting a subset of signal paths of an integrated circuit design, the selecting signal paths meeting the selection criteria; identifying pattern observation points for each signal path of the subset of signal paths; selecting a set of features associated with the integrated circuit design; applying a set of test patterns to one or more integrated circuit chips; determining failing signal paths of the subset of signal paths for each integrated circuit chip; mapping failing signal paths of the subset of signal paths to the set of features to generate a correspondence between the failing signal paths and the features; and analyzing the correspondence and identifying suspect features of the set of features based on the analyzing.

Abstract: Disclosed are embodiments of a system, method and service for detecting and analyzing systematic conditions occurring in manufactured devices. Each embodiment comprises generating a unique signature for each of multiple tested devices. The signatures are generated based on an initial set of signature definitions and the values for those signature definitions that are derived at least in part from selected testing data. A systematic condition is detected based on commonalities between the signatures. The systematic condition is then analyzed, alone or in conjunction with additional information, in order to develop a list of underlying similarities between the devices. The analysis results can be used to refine the systematic condition detection and analysis processes by revising the signature definitions set and/or by modifying data selection.

Abstract: A method and apparatus are disclosed in which defect behavior in an integrated circuit is discovered and modeled rather than assuming defect behavior in the form of a fault. A plurality of tests are performed on an integrated circuit to produce passing and failing responses. The failing responses are examined in conjunction with circuit description data to identify fault locations. For at least certain of the fault locations, the logic-level conditions at neighboring locations which describe the behavior of a failing response are identified. Those logic level conditions are combined into a macrofault for that location. The macrofault is then validated and can be then used to identify more tests for further refining the diagnosis. Because of the rules governing abstracts, this abstract should not be used to construe the claims.

Abstract: A method for identifying potentially defective integrated circuit chips and excluding them from future testing as wafers move through a manufacturing line The method includes data-collecting steps, tagging the chips on wafers identified as potentially bad chips based on information collected as the wafer moves down the fabrication line, evaluating test cost savings by eliminating any further tests on the tagged chips preferably using a test cost database. Considering all the future tests to be preformed, the tagged chips are skipped if it is determined that the test cost saving is significant. Tagging bad chips is based on various criteria and models which are dynamically adjusted by performing the wafer final test on samples of the tagged chips and feeding-back the final test results. The dynamic adaptive adjustment method preferably includes a feedback loop or iterative process to evaluate financial tradeoffs when assessing the profit of salvaging chips against the additional test costs.

Abstract: A method for identifying potentially defective integrated circuit chips and excluding them from future testing as wafers move through a manufacturing line The method includes data-collecting steps, tagging the chips on wafers identified as potentially bad chips based on information collected as the wafer moves down the fabrication line, evaluating test cost savings by eliminating any further tests on the tagged chips preferably using a test cost database. Considering all the future tests to be preformed, the tagged chips are skipped if it is determined that the test cost saving is significant. Tagging bad chips is based on various criteria and models which are dynamically adjusted by performing the wafer final test on samples of the tagged chips and feeding-back the final test results. The dynamic adaptive adjustment method preferably includes a feedback loop or iterative process to evaluate financial tradeoffs when assessing the profit of salvaging chips against the additional test costs.

Abstract: A method of testing an integrated circuit. The method includes selecting a set of physical features of nets and devices of the integrated circuit, the integrated circuit having pattern input points and pattern observation points connected by the nets, each of the nets defined by an input point and all fan out paths to (i) input points of other nets of the nets or (ii) to the pattern observation points; selecting a measurement unit for each feature of the set of features; assigning a weight to each segment of each fan out path based on a number of the measurement units of the feature in each segment of each fan out path of each of the nets; and generating a set of test patterns optimized for test-coverage and cost based on the weights assigned to each segment of each of the nets of the integrated circuit.

Abstract: A method for testing an integrated circuit and analyzing test data. The method includes: defining a set of signal path selection criteria; selecting a subset of signal paths of an integrated circuit design, the selecting signal paths meeting the selection criteria; identifying pattern observation points for each signal path of the subset of signal paths; selecting a set of features associated with the integrated circuit design; applying a set of test patterns to one or more integrated circuit chips; determining failing signal paths of the subset of signal paths for each integrated circuit chip; mapping failing signal paths of the subset of signal paths to the set of features to generate a correspondence between the failing signal paths and the features; and analyzing the correspondence and identifying suspect features of the set of features based on the analyzing.

Abstract: Disclosed are embodiments of a system, method and service for detecting and analyzing systematic conditions occurring in manufactured devices. Each embodiment comprises generating a unique signature for each of multiple tested devices. The signatures are generated based on an initial set of signature definitions and the values for those signature definitions that are derived at least in part from selected testing data. A systematic condition is detected based on commonalities between the signatures. The systematic condition is then analyzed, alone or in conjunction with additional information, in order to develop a list of underlying similarities between the devices. The analysis results can be used to refine the systematic condition detection and analysis processes by revising the signature definitions set and/or by modifying data selection.