Abstract: Methods, apparatus, systems, and articles of manufacture are disclosed for socket interconnect structures and related methods. An example socket interconnect apparatus includes a housing defining a plurality of first openings and a plurality of second openings and a ground structure coupled to the housing. The ground structure defines a plurality of third openings. The third openings of the ground structure align with the second openings of the housing when the ground structure is coupled to the housing. A plurality of ground pins are located in respective ones of the second openings and third openings. The ground structure is to electrically couple the ground pins. A plurality of signal pins are located in respective ones of the first openings of the housing. The signal pins are electrically isolated from the ground structure.

Abstract: In one embodiment, a package substrate or main circuit board includes electrical connectors arranged in a compressed array pattern, wherein a distance between a connector and its neighboring connectors in a direction of compression is less than a distance between the connector and its neighboring connectors in other directions. The array pattern may be hexagonal or rectangular, and differential pairs of the electrical connectors may be arranged in the direction of compression.

Abstract: Microstrip routing circuits with dielectric films are disclosed. A disclosed example apparatus includes a substrate, the substrate having a first side and a second side opposite the first side, the first side and the second side defining a height of the substrate, traces on the first side of the substrate, and a dielectric film positioned on the first side to cover at least a portion of the traces.

Abstract: Microelectronic assemblies, as well as related structures, devices, and methods, are disclosed herein. For example, in some embodiments, a microelectronic assembly may include a microelectronic device having a hexagonal node configuration, wherein the hexagonal node configuration may include a differential signal node pair; a power node; and a plurality of ground nodes; and wherein the differential signal node pair, the power node, and the plurality of ground nodes are arranged in a hexagonal parallelogon pattern, wherein the differential signal node pair includes a first differential signal node adjacent to a second differential signal node, and wherein the power node is adjacent and symmetric to the differential signal node pair; and a microelectronic substrate electrically coupled to the microelectronic device.

Abstract: An apparatus includes a terminal, a first device coupled to the terminal via a first node, the first device to drive a signal on the terminal via the first node, and a second device coupled to the terminal via a second node, wherein the second device comprises a dynamic on-die termination (ODT) circuit coupled to the second node. The dynamic ODT circuit includes: a bus holder circuit to receive the signal from the first device at the second node and select a termination voltage based on the signal, a response delay circuit coupled to the bus holder circuit, the response delay circuit to delay application of the termination voltage to the second node, and a time blanking delay circuit coupled to the bus holder circuit and the response delay circuit to prevent the termination voltage from changing before a threshold period of time elapses.

Abstract: Apparatuses, systems and methods associated with electrical routing layout of printed circuit boards and integrated circuit substrates are disclosed herein. In embodiments, an apparatus includes a first electrically conductive path that extends through a region, wherein the first electrically conductive path includes a first pad located at a surface of the region, a first via that extends through the region, and a first trace that extends in a first direction. The apparatus further includes a second electrically conductive path that extends through the region, wherein the second electrically conductive path includes a second pad located at the surface and adjacent to the first pad, a second via that extends through the region, and a second trace that extends in a second direction. Other embodiments may be described and/or claimed.

Abstract: Techniques and mechanisms for facilitating connection between a packaged device and a substrate of another device. In an embodiment, a device—such as a printed circuit board—comprises a substrate and a hardware interface at a first side of the substrate, the hardware interface to couple the device to a package including integrated circuitry. The device is further configured to couple to a bridge device via contacts disposed at a second side of the substrate. An interconnect extends from the hardware interface to one of the contacts at the second side. In another embodiment, coupling the substrate to the bridge device interconnects two of the contacts at the second side to one another via the bridge device, where one or more contacts of the hardware interface (e.g., only a subset of all such contacts) are also interconnected with the bridge device via the second side.

Abstract: An apparatus includes a terminal, a first device coupled to the terminal via a first node, the first device to drive a signal on the terminal via the first node, and a second device coupled to the terminal via a second node, wherein the second device comprises a dynamic on-die termination (ODT) circuit coupled to the second node. The dynamic ODT circuit includes: a bus holder circuit to receive the signal from the first device at the second node and select a termination voltage based on the signal, a response delay circuit coupled to the bus holder circuit, the response delay circuit to delay application of the termination voltage to the second node, and a time blanking delay circuit coupled to the bus holder circuit and the response delay circuit to prevent the termination voltage from changing before a threshold period of time elapses.

Abstract: A system and apparatus can include a printed circuit board comprising a plurality of metal layers including a first set of metal layers and a set plurality of metal layers. A conductor extending through at least the first set of metal layers and the second set of metal layers, the conductor electrically connected to a metal trace, the conductor comprising a first conducting pad, and a first segment extending from the first conducting pad to the metal trace, and a second segment extending from the metal trace in a direction away from the first conducting pad. The PCB can include a first void separating the first segment of the conductor from the first set of metal layers; and a second void separating the second segment of the conductor from the second set of metal layers, the second void larger than the first void.

Abstract: Techniques and mechanisms to provide a compact arrangement of vias extending through at least a portion of a printed circuit board (PCB) or other substrate. In an embodiment, the substrate includes a dielectric material and a sidewall structure forming a hole region that extends at least partially through the dielectric material. The hole region adjoins each of a first via and a second via, and is also located between the first via and second via. In another embodiment, the first via is coupled to exchange a first signal of a differential signal pair, and the second via is coupled to exchange a second signal of the same differential signal pair.

Abstract: Techniques and mechanisms for providing connectivity to an integrated circuit device via a hardware interface. In an embodiment, the hardware interface includes contacts forming an array of nodes. Some or all such nodes are arranged in cells, wherein the respective node types of each cell's nodes are according to the same cell pattern. The cell pattern includes eight B nodes for the exchange of data bits, four strobe S nodes for the exchange of strobe signals, and ground (G) nodes for the providing of one or more reference potentials. The cell pattern enables formation of a lattice structure including node-contiguous G nodes each of a respective one of the multiple cells. In another embodiment, a ratio of bi-level nodes (including all S nodes and all G nodes) of the cell pattern to a total number of G nodes of the cell pattern is 12:8 or more.

Abstract: In one embodiment, the apparatus comprises: a substrate having a first side and a second side, the second side being on an opposite side of the substrate from the first side, where the substrate has a first location on the first side at which an semiconductor package is to be coupled; and a cable coupled to the substrate on the second side of the substrate at a second location on the second side, the second location being at least partially below the first location.

Abstract: Apparatus and methods of arranging ground pins and signal pins in a card connector includes arranging a signal pins and ground pins in a card connector into at least six (6) columns divided between a primary side and a secondary side of the connector.

Abstract: Techniques and mechanisms for providing connectivity to an integrated circuit device via a hardware interface. In an embodiment, the hardware interface includes contacts forming an array of nodes. Some or all such nodes are arranged in cells, wherein the respective node types of each cell's nodes are according to the same cell pattern. The cell pattern includes eight B nodes for the exchange of data bits, four strobe S nodes for the exchange of strobe signals, and ground (G) nodes for the providing of one or more reference potentials. The cell pattern enables formation of a lattice structure including node-contiguous G nodes each of a respective one of the multiple cells. In another embodiment, a ratio of bi-level nodes (including all S nodes and all G nodes) of the cell pattern to a total number of G nodes of the cell pattern is 12:8 or more.

Abstract: Attachment techniques for printed circuit boards (PCBs) are described. According to some such techniques, an array of double-contact connectors may be used to attach first and second PCBs to each other. In various embodiments, each such double-contact connector may comprise respective first and second contact elements that establish and retain physical contact with the inner surfaces of vias in the first and second PCBs. In some embodiments, at least one of the double-contact connectors may provide electrical conductivity between a trace on the first PCB and a trace on the second PCB. In various embodiments, one of the two PCBs may comprise a main PCB, and the other may comprise a patch PCB arranged to relieve routing congestion in a region of the main PCB. Other embodiments are described and claimed.

Abstract: Techniques and mechanisms for facilitating connection between a packaged device and a substrate of another device. In an embodiment, a device—such as a printed circuit board—comprises a substrate and a hardware interface at a first side of the substrate, the hardware interface to couple the device to a package including integrated circuitry. The device is further configured to couple to a bridge device via contacts disposed at a second side of the substrate. An interconnect extends from the hardware interface to one of the contacts at the second side. In another embodiment, coupling the substrate to the bridge device interconnects two of the contacts at the second side to one another via the bridge device, where one or more contacts of the hardware interface (e.g., only a subset of all such contacts) are also interconnected with the bridge device via the second side.

Abstract: In one embodiment, first and second circuit boards may be coupled together. The first circuit board may include a first trace to electrically couple a first integrated circuit to a first via of the first circuit board. In turn, the second circuit board may include a second trace to electrically couple a first contact of a first memory socket adapted to the first circuit board and a first contact of a second memory socket adapted to the first circuit board. This second trace, when the circuit boards are coupled together, is to electrically couple to a first via of the second circuit board, to enable the first via of the second board to electrically couple to the first via of the first circuit board. Other embodiments are described and claimed.

Abstract: The present description relates to the field of fabricating microelectronic devices, wherein a microelectronic device may have a hexagonal confirmation for signal nodes and ground nodes which utilizes the cross-talk reduction by cancellation property of geometrically symmetry and orthogonality to reduce signal node to ground node ratio for increasing signaling density.

Abstract: Techniques and mechanisms to provide a compact arrangement of vias extending through at least a portion of a printed circuit board (PCB) or other substrate. In an embodiment, the substrate includes a dielectric material and a sidewall structure forming a hole region that extends at least partially through the dielectric material. The hole region adjoins each of a first via and a second via, and is also located between the first via and second via. In another embodiment, the first via is coupled to exchange a first signal of a differential signal pair, and the second via is coupled to exchange a second signal of the same differential signal pair.

Abstract: A bridge device is described herein. The bridge device may include a first via of a bridge device, the first via of the bridge device having a short via stub or no via stub, the first via of the bridge device to be communicatively coupled to a first via of a printed circuit board (PCB). The bridge device may include a second via of the bridge device, the second via of the bridge device having a short via stub or no via stub, the second via of the bridge device to be communicatively coupled to a second via of the PCB. A trace of the bridge device may communicatively couple the first via of the bridge device to the second via of the bridge device.