Patents by Inventor Ravi Verma
Ravi Verma has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Publication number: 20200331203Abstract: A tool head assembly for a solid state additive manufacturing apparatus includes a tool head having a material passage configured to receive a material therein. The tool head is configured to deposit the material from the material passage onto a substrate of the solid state additive manufacturing apparatus to form at least one layer of the material on the substrate. The tool head includes a shoulder configured to contact the material such that rotation of the tool head frictionally stirs the material. The tool head assembly includes a barrier configured to extend along a side surface of the at least one layer as the at least one layer is deposited onto the substrate such that the barrier is configured to constrain the material from extruding past an edge of the shoulder.Type: ApplicationFiled: April 22, 2019Publication date: October 22, 2020Inventor: Ravi Verma
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Publication number: 20200199699Abstract: A high-pressure-torsion apparatus (100), comprising a working axis (102), a first anvil (110), a second anvil (120), and an annular body (130). The annular body (130) comprises a first total-loss convective chiller (140), a second total-loss convective chiller (150), and a heater (160). Each of the first total-loss convective chiller (140) and the second total-loss convective chiller (150) is translatable between the first anvil (110) and the second anvil (120) along the working axis (102), is configured to be thermally convectively coupled with a workpiece (190), and is configured to selectively cool the workpiece (190). The heater (160) is positioned between the first total-loss convective chiller (140) and the second total-loss convective chiller (150) along the working axis (102), is translatable between the first anvil (110) and the second anvil (120) along the working axis (102), and is configured to selectively heat the workpiece (190).Type: ApplicationFiled: December 20, 2018Publication date: June 25, 2020Applicant: The Boeing CompanyInventor: Ravi Verma
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Publication number: 20200199701Abstract: A high-pressure-torsion apparatus (100) comprises a working axis (102), a first anvil (110), a second anvil (120), and an annular body (130). The annular body (130) comprises a first conductive chiller (140), a second conductive chiller (150), and a heater (160). Each of the first conductive chiller (140) and the second conductive chiller (150) is translatable between the first anvil (110) and the second anvil (120) along the working axis (102), is configured to be thermally conductively coupled with a workpiece (190), and is configured to selectively cool the workpiece (190). The heater (160) is positioned between the first conductive chiller (140) and the second conductive chiller (150) along the working axis (102), is translatable between the first anvil (110) and the second anvil (120) along the working axis (102), and is configured to selectively heat the workpiece (190).Type: ApplicationFiled: December 20, 2018Publication date: June 25, 2020Applicant: The Boeing CompanyInventor: Ravi Verma
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Publication number: 20200199700Abstract: A high-pressure-torsion apparatus (100) comprises a working axis (102), a first anvil (110), a second anvil (120), and an annular body (130). The annular body (130) comprises a a first recirculating convective chiller (140), a second recirculating convective chiller (150), and a heater (160). Each of the first recirculating convective chiller (140) and the second recirculating convective chiller (150) is translatable between the first anvil (110) and the second anvil (120) along the working axis (102), is configured to be thermally convectively coupled with a workpiece (190), and is configured to selectively cool the workpiece (190). The heater (160) is positioned between the first recirculating convective chiller (140) and the second recirculating convective chiller (150) along the working axis (102), is translatable between the first anvil (110) and the second anvil (120) along the working axis (102), and is configured to selectively heat the workpiece (190).Type: ApplicationFiled: December 20, 2018Publication date: June 25, 2020Applicant: The Boeing CompanyInventor: Ravi Verma
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Publication number: 20200171711Abstract: Systems and methods are provided for creating precursors for consolidating composite parts. One embodiment is a method for forming a metallic structure. The method includes forming a precursor for a pressure membrane that includes a contour having a linearized length corresponding with a linearized length of a surface of a forming tool. The method also includes affixing a perimeter of the precursor to a perimeter of a base member, leaving a volume between the base member and the precursor, altering a shape of the precursor at a superplastic temperature by forcing the precursor into complementary contact with the surface of the forming tool, and setting the shape of the precursor while the precursor is held in complementary contact.Type: ApplicationFiled: November 29, 2018Publication date: June 4, 2020Inventors: Marc R. Matsen, Lee Charles Firth, Randall D. Wilkerson, Julie F. Murphy, Ravi Verma
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Publication number: 20200121763Abstract: A non-covalent complex of an albumin molecule and a hydrophobic ligand, compositions containing the same, and methods of use thereof are provided. The present complex may find use in delivering the hydrophobic ligand to microorganisms that have albumin-binding outer surfaces, such as a cell wall.Type: ApplicationFiled: May 24, 2019Publication date: April 23, 2020Inventors: Ravi Verma, Changjun Yu
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Patent number: 10342855Abstract: A non-covalent complex of an albumin molecule and a hydrophobic ligand, compositions containing the same, and methods of use thereof are provided. The present complex may find use in delivering the hydrophobic ligand to microorganisms that have albumin-binding outer surfaces, such as a cell wall.Type: GrantFiled: August 6, 2018Date of Patent: July 9, 2019Assignee: Spectral Platforms, Inc.Inventors: Ravi Verma, Changjun Yu
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Publication number: 20190196800Abstract: Provisioning for a cloud service is provided. An instance of a provisioning object is created and initialized, and a graphical user interface (GUI) is generated. The GUI includes a home window, a configure window, an orchestrate window and a deploy window. The provisioning parameters are received from the GUI. The provisioning parameters indicate whether to deploy the software application on a local network or a remote network. A location object and a deployment object are created and initialized based on the provisioning parameters. The location object includes an on-premises object for a local network deployment or a cloud object for a remote network deployment. A command to deploy the software application is received from the GUI, and the software application is deployed to a local network or a remote network using the provisioning object, the location object and the deployment object.Type: ApplicationFiled: December 26, 2017Publication date: June 27, 2019Inventors: Neeraj Shodhan, Pranay Bipin Shah, Darpan Korat, Hareshkumar Navadiya, Indraraj Abhesangbhai Chavda, Ravi Verma Vunikili
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Patent number: 10279423Abstract: A method for forming a metal matrix composite (MMC) structure includes forming an assembly including at least two blocks of a primary phase material sharing an interface at which a secondary phase material is disposed. The assembly has a length, a width, and a thickness. The method also includes clamping the assembly to at least one of urge the at least two blocks toward each other or maintain the at least two blocks at a predetermined position. Also, the method includes passing a rotating friction-stir pin along the interface from the front edge to the rear edge. The friction-stir pin has a mixing length extending at least the width of the assembly, and passing the friction-stir pin along the length of the assembly disperses the secondary phase material into the primary phase material and welds the at least two blocks together.Type: GrantFiled: August 17, 2016Date of Patent: May 7, 2019Assignee: THE BOEING COMPANYInventor: Ravi Verma
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Publication number: 20190030135Abstract: A non-covalent complex of an albumin molecule and a hydrophobic ligand, compositions containing the same, and methods of use thereof are provided. The present complex may find use in delivering the hydrophobic ligand to microorganisms that have albumin-binding outer surfaces, such as a cell wall.Type: ApplicationFiled: August 6, 2018Publication date: January 31, 2019Inventors: Ravi Verma, Changjun Yu
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Patent number: 10155281Abstract: Methods and process flows for diffusion bonding and forming metallic sheets are disclosed herein. The methods include stacking a first metallic sheet and a second metallic sheet to define a sheet stack. The methods further include creating a pneumatic seal between the first metallic sheet and the second metallic sheet to define a sealed sheet stack that defines a pneumatically isolated region. The methods also include increasing a surface area of the sealed sheet stack to define an expanded sheet stack. The methods further include compressing at least a portion of the expanded sheet stack to form a diffusion bond between a corresponding portion of the first metallic sheet and an opposed portion of the second metallic sheet thereby defining a diffusion bonded sheet stack.Type: GrantFiled: January 29, 2016Date of Patent: December 18, 2018Assignee: The Boeing CompanyInventor: Ravi Verma
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Patent number: 10142327Abstract: Techniques for providing enrollment services for various types of electronic devices in a communication network is disclosed. The electronic devices may include devices associated with a user and headless devices not associated with any user. In certain embodiments, a device enrollment system is disclosed that controls the authentication and enrollment of both user devices and headless devices within a communication network. The device enrollment system detects a particular device within a communication, identifies a type of enrollment policy to be applied to the device based on a type of the device, applies a set of enrollment rules to the device in accordance with the enrollment policy and enrolls the device if the device satisfies one or more criteria specified by the enrollment rules.Type: GrantFiled: October 19, 2017Date of Patent: November 27, 2018Assignee: Oracle International CorporationInventors: Mohamad Raja Gani Mohamad Abdul, Bhagavati Kumar Jayanti Venkata, Harsh Maheshwari, Nagaraj Pattar, Ravi Verma
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Publication number: 20180292324Abstract: Methods and systems for Resonant Raman spectroscopy are provided. Methods according to certain embodiments include irradiating a sample with a monochromatic light source at a first irradiation intensity and a second irradiation intensity, determining the intensity of one or more of the Resonant Raman scattering and fluorescence scattering at the first irradiation intensity and second irradiation intensity, calculating a rate of change of one or more of the intensity of Resonant Raman scattering and fluorescence in response to the change in irradiation intensity from the first irradiation intensity to the second irradiation intensity and comparing one or more of the rate of change in the intensity of Resonant Raman scattering and the rate of change in the intensity of fluorescence scattering with the rate of change in the irradiation intensity by the monochromatic light source to determine the Resonant Raman response of the sample.Type: ApplicationFiled: March 19, 2018Publication date: October 11, 2018Inventors: Ravi Verma, Changjun Yu
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Patent number: 10071141Abstract: A non-covalent complex of an albumin molecule and a hydrophobic ligand, compositions containing the same, and methods of use thereof are provided. The present complex may find use in delivering the hydrophobic ligand to microorganisms that have albumin-binding outer surfaces, such as a cell wall.Type: GrantFiled: May 6, 2016Date of Patent: September 11, 2018Assignee: Spectral Platforms, Inc.Inventors: Ravi Verma, Changjun Yu
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Publication number: 20180050420Abstract: A method for forming a metal matrix composite (MMC) structure includes forming an assembly including at least two blocks of a primary phase material sharing an interface at which a secondary phase material is disposed. The assembly has a length, a width, and a thickness. The method also includes clamping the assembly to at least one of urge the at least two blocks toward each other or maintain the at least two blocks at a predetermined position. Also, the method includes passing a rotating friction-stir pin along the interface from the front edge to the rear edge. The friction-stir pin has a mixing length extending at least the width of the assembly, and passing the friction-stir pin along the length of the assembly disperses the secondary phase material into the primary phase material and welds the at least two blocks together.Type: ApplicationFiled: August 17, 2016Publication date: February 22, 2018Applicant: The Boeing CompanyInventor: Ravi Verma
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Publication number: 20180034808Abstract: Techniques for providing enrollment services for various types of electronic devices in a communication network is disclosed. The electronic devices may include devices associated with a user and headless devices not associated with any user. In certain embodiments, a device enrollment system is disclosed that controls the authentication and enrollment of both user devices and headless devices within a communication network. The device enrollment system detects a particular device within a communication, identifies a type of enrollment policy to be applied to the device based on a type of the device, applies a set of enrollment rules to the device in accordance with the enrollment policy and enrolls the device if the device satisfies one or more criteria specified by the enrollment rules.Type: ApplicationFiled: October 19, 2017Publication date: February 1, 2018Applicant: Oracle International CorporationInventors: Mohamad Raja Gani Mohamad Abdul, Bhagavati Kumar Jayanti Venkata, Harsh Maheshwari, Nagaraj Pattar, Ravi Verma
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Patent number: 9813407Abstract: Techniques for providing enrollment services for various types of electronic devices in a communication network is disclosed. The electronic devices may include devices associated with a user and headless devices not associated with any user. In certain embodiments, a device enrollment system is disclosed that controls the authentication and enrollment of both user devices and headless devices within a communication network. The device enrollment system detects a particular device within a communication, identifies a type of enrollment policy to be applied to the device based on a type of the device, applies a set of enrollment rules to the device in accordance with the enrollment policy and enrolls the device if the device satisfies one or more criteria specified by the enrollment rules.Type: GrantFiled: November 9, 2016Date of Patent: November 7, 2017Assignee: Oracle International CorporationInventors: Mohamad Raja Gani Mohamad Abdul, Bhagavati Kumar Jayanti Venkata, Harsh Maheshwari, Nagaraj Pattar, Ravi Verma
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Patent number: 9781098Abstract: Methods, devices, and systems are described for enrolling a user's bring-your-own-device for secure connection to a company's enterprise computer network. From her mobile device, user clicks on a uniform resource locator (URL) to connect with the login web page on the enterprise network. After authentication, checks are performed to verify that the user has authorization to enroll the type of electronic device, and the profile is installed on the device. A notification is sent to the device by a server on the enterprise network, and a secure workspace application is pushed to the device along with configuration data that automatically links the workspace with the parent device enrollment. Once the user launches the secure workspace application the workspace access configuration data and initializes enrollment with the enterprise network, resulting in a linking of the secure workspace application with its parent device enrollment.Type: GrantFiled: April 17, 2015Date of Patent: October 3, 2017Assignee: Oracle International CorporationInventors: Mohamad Raja Gani Mohamad Abdul, Bhagavati Kumar Jayanti Venkata, Krithiga Gopalan, Harsh Maheshwari, Nagaraj Pattar, Ravi Verma
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Publication number: 20170216958Abstract: Methods and process flows for diffusion bonding and forming metallic sheets are disclosed herein. The methods include stacking a first metallic sheet and a second metallic sheet to define a sheet stack. The methods further include creating a pneumatic seal between the first metallic sheet and the second metallic sheet to define a sealed sheet stack that defines a pneumatically isolated region. The methods also include increasing a surface area of the sealed sheet stack to define an expanded sheet stack. The methods further include compressing at least a portion of the expanded sheet stack to form a diffusion bond between a corresponding portion of the first metallic sheet and an opposed portion of the second metallic sheet thereby defining a diffusion bonded sheet stack.Type: ApplicationFiled: January 29, 2016Publication date: August 3, 2017Inventor: Ravi Verma
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Publication number: 20170063846Abstract: Techniques for providing enrollment services for various types of electronic devices in a communication network is disclosed. The electronic devices may include devices associated with a user and headless devices not associated with any user. In certain embodiments, a device enrollment system is disclosed that controls the authentication and enrollment of both user devices and headless devices within a communication network. The device enrollment system detects a particular device within a communication , identifies a type of enrollment policy to be applied to the device based on a type of the device, applies a set of enrollment rules to the device in accordance with the enrollment policy and enrolls the device if the device satisfies one or more criteria specified by the enrollment rules.Type: ApplicationFiled: November 9, 2016Publication date: March 2, 2017Applicant: Oracle International CorporationInventors: Mohamad Raja Gani Mohamad Abdul, Bhagavati Kumar Jayanti Venkata, Harsh Maheshwari, Nagaraj Pattar, Ravi Verma