Abstract: A process is described for forming a common input-output (I/O) site that is suitable for both wire-bond and solder bump flip chip connections, such as controlled-collapse chip connections (C4). The present invention is particularly suited to semiconductor chips that use copper as the interconnection material, in which the soft dielectrics used in manufacturing such chips are susceptible to damage due to bonding forces. The present invention reduces the risk of damage by providing site having a noble metal on the top surface of the pad, while providing a diffusion barrier to maintain the high conductivity of the metal interconnects. Process steps for forming an I/O site within a substrate are reduced by providing a method for selectively depositing metal layers in a feature formed in the substrate. Since the I/O sites of the present invention may be used for either wire-bond or solder bump connections, this provides increased flexibility for chip interconnection options, while also reducing process costs.

Abstract: A process is described for forming a common input-output (I/O) site that is suitable for both wire-bond and solder bump flip chip connections, such as controlled-collapse chip connections (C4). The present invention is particularly suited to semiconductor chips that use copper as the interconnection material, in which the soft dielectrics used in manufacturing such chips are susceptible to damage due to bonding forces. The present invention reduces the risk of damage by providing site having a noble metal on the top surface of the pad, while providing a diffusion barrier to maintain the high conductivity of the metal interconnects. Process steps for forming an I/O site within a substrate are reduced by providing a method for selectively depositing metal layers in a feature formed in the substrate. Since the I/O sites of the present invention may be used for either wire-bond or solder bump connections, this provides increased flexibility for chip interconnection options, while also reducing process costs.

Abstract: A process is described for forming a common input-output (I/O) site that is suitable for both wire-bond and solder bump flip chip connections, such as controlled-collapse chip connections (C4). The present invention is particularly suited to semiconductor chips that use copper as the interconnection material, in which the soft dielectrics used in manufacturing such chips are susceptible to damage due to bonding forces. The present invention reduces the risk of damage by providing site having a noble metal on the top surface of the pad, while providing a diffusion barrier to maintain the high conductivity of the metal interconnects. Process steps for forming an I/O site within a substrate are reduced by providing a method for selectively depositing metal layers in a feature formed in the substrate. Since the I/O sites of the present invention may be used for either wire-bond or solder bump connections, this provides increased flexibility for chip interconnection options, while also reducing process costs.

Abstract: A castellated nozzle for connecting a plurality of microelectronic leads to an associated plurality of contact pads and method of using the same. The castellated nozzle includes a body having a plurality of castellations protruding therefrom, with each of the castellations having a contact surface thereon. A channel is formed adjacent to at least one castellation of the plurality of castellations. An opening extends through the body for introducing a heated gas therein. The contact surfaces of the plurality of castellations are aligned to a respective plurality of leads. Typically, the castellated nozzle includes a first plurality of castellations forming a first row and a second plurality of castellations forming a second row.

Abstract: A castellated nozzle for connecting a plurality of microelectronic leads to an associated plurality of contact pads and method of using the same. The castellated nozzle includes a body having a plurality of castellations protruding therefrom, with each of the castellations having a contact surface thereon. A channel is formed adjacent to at least one castellation of the plurality of castellations. An opening extends through the body for introducing a heated gas therein. The contact surfaces of the plurality of castellations are aligned to a respective plurality of leads. Typically, the castellated nozzle includes a first plurality of castellations forming a first row and a second plurality of castellations forming a second row. A channel is formed adjacent to at least one castellation.

Abstract: A soldering tip overcomes the gravitational effects on molten solder and supplies a large molten solder sphere for contact with a surface to which solder is to be applied. A conical or cylindrical spiral or helix of solder-wettable material, preferably in the form of a compressional spring is attached to the soldering tip with the central axis of the helix aligned with the axis of the soldering tip, preferably by welding. Solder supplied to the soldering tip flows between the coils of the helix and forms a meniscus at the lower end of the helix so that only the molten solder meniscus touches the surface during application of solder. The increased surface tension acts to overcome gravitational effects and assures a more even flow of solder to the surface.

Abstract: A conductor attachment wherein each conductor is mounted on a dielectric tape and has an attachment portion that is supported by the tape to an adjacent location a uniform distance from the bonding location and that contacts on a level with the plane of the underside of the tape. One conductor supporting tape has portions of the tape that extend into a central contacting area opening to contact locations at contacting pads in rows remote from the edge. Another supporting tape has window openings at the contacting locations. The conductor ends are brought into the level of the underside of the tape by a manufacturing rolling operation between an elastomer surface roller and a solid backing roller.

Abstract: A method and apparatus for removing wires bonded between chip contact pads and substrate contact pads using an alternating fluid flow is described. The fluid flow is preferably air. A nozzle having a plurality of air jets within a chip accommodating cavity is disposed over the chip to enclose the chip contact pads, the substrate contact pads and the wires bonded therebetween. Air is forced through the plurality of jets to cause an alternating clockwise and counter clockwise air flow which bends the plurality of wires back and forth until they fatigue at the contact points to the chip contact pads in a substrate contact pads which results in the wires being substantially simultaneously severed therefrom. The nozzle has an aperture out through which the air escapes carrying the severed wires therewith for collection in a filter.

Abstract: A conductor attachment wherein each conductor is mounted on a dielectric tape and has an attachment portion that is supported by the tape to an adjacent location a uniform distance from the bonding location and that contacts on a level with the plane of the underside of the tape. One conductor supporting tape has portions of the tape that extend into a central contacting area opening to contact locations at contacting pads in rows remote from the edge. Another supporting tape has window openings at the contacting locations. The conductor ends are brought into the level of the underside of the tape by a manufacturing rolling operation between an elastomer surface roller and a solid backing roller.

Abstract: A method for bonding conductors to semiconductor chip contact pads wherein each conductor is mounted on a dielectric tape and has an attachment portion that is supported by the tape to an adjacent location a uniform distance from the bonding location and that contacts on a level with the plane of the underside of the tape. One conductor supporting tape has portions of the tape that extend into a central contacting area opening to contact locations at contacting pads in rows remote from the edge. Another supporting tape has window openings at the contacting locations. The conductor ends are brought into the level of the underside of the tape by a manufacturing rolling operation between an elastomer surface roller and a solid backing roller.

Abstract: Method and apparatus for fluxlessly solder bonding a solder mound to a solder wettable surface. A heated gas, preferably a reducing or non-reactive gas, is directed at a solid solder mound. Gas is heated to a temperature sufficient to melt solder mound. The heated gas is directed at the molten solder mound at a momentum sufficient to disperse an oxide layer at the surface of the molten solder mound. Dispersing the oxide layer permits the molten solder to wet the solder wettable surface. The molten solder is cooled to form a solder bond.

Abstract: An interconnecting and mounting technology involving the use of elastomeric properties. A mounting member grips, in a notch, the edge of a device supporting planar member with the device conductors brought to that edge. Conductors are provided at the surface of the mounting member, contacting the device conductors in the notch, and connecting with external wiring conductors on an external wiring planar member. The external wiring to device conductor interconnecting conductors can be on flex tape including elastomeric contact adaptation. Retention force for mounting member compression and mounting member to external wiring planar member retention is provided.

Abstract: A conductor attachment wherein each conductor is mounted on a dielectric tape and has an attachment portion that is supported by the tape to an adjacent location a uniform distance from the bonding location and that contacts on a level with the plane of the underside of the tape. One conductor supporting tape has portions of the tape that extend into a central contacting area opening to contact locations at contacting pads in rows remote from the edge. Another supporting tape has window openings at the contacting locations. The conductor ends are brought into the level of the underside of the tape by a manufacturing rolling operation between an elastomer surface roller and a solid backing roller.

Abstract: The present invention comprises the use of a copper/nickel containing alloy composition or application of a protective nickel alloy coating to copper current-carrying leads to prevent electrolytic migration between tape automated bonding (TAB) package leads.

Abstract: A hitch feeder for a TAB tape is described which comprises: a stationary jas assembly having opposing jaws for gripping edges of the tape when closed, and not gripping the edges when open; a movable gripping assembly which includes a lower movable gripper positioned below the tape and an upper movable gripper positioned above the tape. The lower and upper movable grippers may be moved both towards and away from the tape, each said movable gripper gripping the tape when moved towards it and releasing the tape when moved away from it. Both grippers are physically clear of any features on the tape when moved away from it. A tape feeder is provided for reciprocally moving the movable gripper assembly along the tape length, both towards and away from the stationary jaw assembly.

Abstract: The present invention comprises the use of a copper/nickel containing alloy composition or application of a protective nickel alloy coating to copper current-carrying leads to prevent electrolytic migration between tape automated bonding (TAB) package leads.

Abstract: A three dimensional chip package comprising a plurality of semiconductor substrates, each having at least one semiconductor electronic device mounted thereon; wherein at least a subset of said plurality substrates are physically joined to form an enclosure within which each substrate has at least one electrical contact location to another substrate; and further wherein at least one cooling channel is provided within said enclosure into which a cooling fluid may be introduced.

Abstract: Method and apparatus for fluxlessly solder bonding a solder mound to a solder wettable surface. A heated gas, preferably a reducing or non-reactive gas, is directed at a solid solder mound. Gas is heated to a temperature sufficient to melt solder mound. The heated gas is directed at the molten solder mound at a momentum sufficient to disperse an oxide layer at the surface of the molten solder mound. Dispersing the oxide layer permits the molten solder to wet the solder wettable surface. The molten solder is cooled to form a solder bond.

Abstract: Apparatus for automatically adjusting the orientation of a first surface of a first body to be against a second surface of a second body when said first surface is pressed against said second surface. The apparatus includes a means for movably mounting the first body to a support which permits rotation of the first surface so that when the first surface is pressed against the second surface, the first surface rotates with respect to the support resulting in the first surface being against the second surface.