Abstract: A new method and package is provided for the packaging of semiconductor devices. The method and package starts with a semiconductor substrate, the substrate is pre-baked. In the first embodiment of the invention, a copper foil is attached to the substrate, in the second embodiment of the invention a adhesive film is attached to the substrate. Processing then continues by attaching the die to the copper foil under the first embodiment of the invention and to the film under the second embodiment of the invention. After this the processing continues identically for the two embodiments of the invention with steps of curing, plasma cleaning, wire bonding, optical inspection, plasma cleaning and providing a molding around the die and the wires connected to the die. For the second embodiment of the invention, the film is now detached and replaced with a copper foil.

Abstract: A method and apparatus for handling small semiconductor devices in the testing of these devices. Multiple devices are mounted within a device strip carrier and are positioned in the testing position. This positioning of the device strip carriers is performed using device strip carrier alignment tools; the device strip carrier can readily be repositioned with respect to the test head/probe card for testing of multiple devices contained within the device strip carrier.

Abstract: A method and apparatus for handling small semiconductor devices in the testing of these devices. Multiple devices are mounted within a device strip carrier and are positioned in the testing position. This positioning of the device strip carriers is performed using device strip carrier alignment tools; the device strip carrier can readily be repositioned with respect to the test head/probe card for testing of multiple devices contained within the device strip carrier.

Abstract: A method and apparatus for handling small semiconductor devices in the testing of these devices. Multiple devices are mounted within a device strip carrier and are positioned in the testing position. This positioning of the device strip carriers is performed using device strip carrier alignment tools; the device strip carrier can readily be repositioned with respect to the test head/probe card for testing of multiple devices contained within the device strip carrier.

Abstract: A molded flexible circuit assembly and method of forming a molded flexible circuit assembly which use a molded stiffener, and do not require any additional type of stiffener, are described. A molded stiffener is formed on a flexible tape at the same time molded encapsulation units are formed to encapsulate circuit die which are attached to the flexible tape. The molded stiffeners provide adequate rigidity for processing of the molded flexible circuit assembly. When the stiffeners are no longer needed they are removed at the same time the mold runners are removed. No additional processing steps are required for either the formation or removal of the molded stiffeners.

Abstract: A molded flexible circuit assembly and method of forming a molded flexible circuit assembly which use a molded stiffener, and do not require any additional type of stiffener, are described. A molded stiffener is formed on a flexible tape at the same time molded encapsulation units are formed to encapsulate circuit die which are attached to the flexible tape. The molded stiffeners provide adequate rigidity for processing of the molded flexible circuit assembly. When the stiffeners are no longer needed they are removed at the same time the mold runners are removed. No additional processing steps are required for either the formation or removal of the molded stiffeners.

Abstract: A molded electronic circuit package is described to which stabilizing tape can be attached using automatic or semi-automatic means. The stabilizing tape stabilizes the assembly for further processing operations such as dicing or attachment to a higher level package. The assembly comprises a substrate to which devices are attached. Molded caps are formed over the devices. Molded tape supports are formed at the same time as the molded caps and are located adjacent to opposite sides of the molded cap. The molded tape supports have the same height as the molded cap. The stabilizing tape can then be attached to the tops of the molded tape supports and the molded caps using automatic or semi-automatic means.