Patents by Inventor Rehan Khan

Rehan Khan has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20200093602
    Abstract: The present disclosure provides intramedullary mandibular implants for the temporomandibular joint. The mandibular implants include a stem portion, a collar portion and a head portion. The stem, collar and head portions may be integral. The stem portion may define an inferior end and the head portion may define a superior end of the implants. The head portion may be arcuate in the sagittal plane to provide an articulating surface with a fossa or a fossa component. The collar portion may be intermediate of the head and stem portions and form a channel between an interior surface of the collar portion and an exterior surface of the stem portion. In use, the stem portion may be implanted within a condyle of a mandible such that an end portion of the condyle is situated within the channel of the implant and the head portion articulates with the fossa or fossa component.
    Type: Application
    Filed: November 26, 2019
    Publication date: March 26, 2020
    Applicant: The Research Foundation for the State University of New York
    Inventors: Martin PENDOLA, Gaia SALVADORE, Rehan KHAN
  • Patent number: 10485666
    Abstract: The present disclosure provides intramedullary mandibular implants for the temporomandibular joint. The mandibular implants include a stem portion, a collar portion and a head portion. The stem, collar and head portions may be integral. The stem portion may define an inferior end and the head portion may define a superior end of the implants. The head portion may be arcuate in the sagittal plane to provide an articulating surface with a fossa or a fossa component. The collar portion may be intermediate of the head and stem portions and form a channel between an interior surface of the collar portion and an exterior surface of the stem portion. In use, the stem portion may be implanted within a condyle of a mandible such that an end portion of the condyle is situated within the channel of the implant and the head portion articulates with the fossa or fossa component.
    Type: Grant
    Filed: December 22, 2016
    Date of Patent: November 26, 2019
    Assignee: The Research Foundation for the State University of New York
    Inventors: Martin Pendola, Gaia Salvadore, Rehan Khan
  • Patent number: 10305204
    Abstract: A cable bypass assembly is disclosed for use in providing a high frequency transmission line that connect a chip package on a circuit board to connector spaced apart from the chip package. The bypass cable assembly has a structure that allows for low loss between the chip package and the connector. Multiple cables can be used to provide a number of differentially coupled channels.
    Type: Grant
    Filed: July 19, 2018
    Date of Patent: May 28, 2019
    Assignee: Molex, LLC
    Inventors: Christopher D. Wanha, Brian Keith Lloyd, Ebrahim Abunasrah, Rehan Khan, Javier Resendez, Michael Rost
  • Publication number: 20180323525
    Abstract: A cable bypass assembly is disclosed for use in providing a high frequency transmission line that connect a chip package on a circuit board to connector spaced apart from the chip package. The bypass cable assembly has a structure that allows for low loss between the chip package and the connector. Multiple cables can be used to provide a number of differentially coupled channels.
    Type: Application
    Filed: July 19, 2018
    Publication date: November 8, 2018
    Applicant: Molex, LLC
    Inventors: Christopher D. Wanha, Brian Keith Lloyd, Ebrahim Abunasrah, Rehan Khan, Javier Resendez, Michael Rost
  • Patent number: 10069225
    Abstract: A cable bypass assembly is disclosed for use in providing a high frequency transmission line that connect a chip package on a circuit board to connector spaced apart from the chip package. The bypass cable assembly has a structure that allows for low loss between the chip package and the connector. Multiple cables can be used to provide a number of differentially coupled channels.
    Type: Grant
    Filed: February 15, 2017
    Date of Patent: September 4, 2018
    Assignee: Molex, LLC
    Inventors: Christopher D. Wanha, Brian Keith Lloyd, Ebrahim Abunasrah, Rehan Khan, Javier Resendez, Michael Rost
  • Patent number: 10056706
    Abstract: A cable bypass assembly is disclosed for use in providing a high frequency transmission line that connect a chip package on a circuit board to connector spaced apart from the chip package. The bypass cable assembly has a structure that allows for low loss between the chip package and the connector. Multiple cables can be used to provide a number of differentially coupled channels.
    Type: Grant
    Filed: July 5, 2017
    Date of Patent: August 21, 2018
    Assignee: Molex, LLC
    Inventors: Christopher D. Wanha, Brian Keith Lloyd, Ebrahim Abunasrah, Rehan Khan, Javier Resendez, Michael Rost
  • Patent number: 9985367
    Abstract: A cable bypass assembly is disclosed for use in providing a high frequency transmission line that connect a chip package on a circuit board to connector spaced apart from the chip package. The bypass cable assembly has a structure that allows for low loss between the chip package and the connector. Multiple cables can be used to provide a number of differentially coupled channels.
    Type: Grant
    Filed: August 11, 2017
    Date of Patent: May 29, 2018
    Assignee: Molex, LLC
    Inventors: Christopher D. Wanha, Brian Keith Lloyd, Ebrahim Abunasrah, Rehan Khan, Javier Resendez, Michael Rost
  • Publication number: 20170365943
    Abstract: A cable bypass assembly is disclosed for use in providing a high frequency transmission line that connect a chip package on a circuit board to connector spaced apart from the chip package. The bypass cable assembly has a structure that allows for low loss between the chip package and the connector. Multiple cables can be used to provide a number of differentially coupled channels.
    Type: Application
    Filed: August 11, 2017
    Publication date: December 21, 2017
    Applicant: Molex, LLC
    Inventors: Christopher D. Wanha, Brian Keith Lloyd, Ebrahim Abunasrah, Rehan Khan, Javier Resendez, Michael Rost
  • Publication number: 20170302011
    Abstract: A cable bypass assembly is disclosed for use in providing a high frequency transmission line that connect a chip package on a circuit board to connector spaced apart from the chip package. The bypass cable assembly has a structure that allows for low loss between the chip package and the connector. Multiple cables can be used to provide a number of differentially coupled channels.
    Type: Application
    Filed: July 5, 2017
    Publication date: October 19, 2017
    Applicant: Molex, LLC
    Inventors: Christopher D. Wanha, Brian Keith LLOYD, Ebrahim ABUNASRAH, Rehan KHAN, Javier RESENDEZ, Michael ROST
  • Publication number: 20170249391
    Abstract: A query stem is received via a search engine query input field of a user interface presented on a client device. Before receiving an input submitting the query stem as a query to the search engine, list of general queries based on the query stem and a list of local queries based the query stem and related to a location of the client device are obtained. At least one general query is selected from the list of general queries and at least one local query is selected from the list of local queries for inclusion in a blended list of queries. A presentation order of the blended list of queries is determined, so that a local query that is a more specific version of a general query is placed immediately next to the general query. The selected queries are presented via the user interface, in accordance with the determined order.
    Type: Application
    Filed: May 15, 2017
    Publication date: August 31, 2017
    Applicant: GOOGLE INC.
    Inventors: Scott Huffman, Rehan Khan, Uri Bernstein, Natalia Marmasse
  • Publication number: 20170162960
    Abstract: A cable bypass assembly is disclosed for use in providing a high frequency transmission line that connect a chip package on a circuit board to connector spaced apart from the chip package. The bypass cable assembly has a structure that allows for low loss between the chip package and the connector. Multiple cables can be used to provide a number of differentially coupled channels.
    Type: Application
    Filed: February 15, 2017
    Publication date: June 8, 2017
    Applicant: Molex, LLC
    Inventors: Christopher D. Wanha, Brian Keith LLOYD, Ebrahim ABUNASRAH, Rehan KHAN, Javier RESENDEZ, Michael ROST
  • Patent number: 9652547
    Abstract: Methods, systems, and apparatus, including computer programs encoded on computer storage media, for presenting local query suggestions. In general, one aspect of the subject matter described in this specification can be embodied in methods that include the actions of determining a general location and a specific location for a client device. Methods also include while receiving a query stem, and before receiving an input submitting a query to the search engine, obtaining general queries containing the query stem, each general query having a first quality measure. Methods also include obtaining local queries containing the query stem, each local query having a second quality measure. Methods also include combining at least one of the general queries and at least one of the local queries into combined queries, the combined queries having a presentation order based on the respective quality measures of the queries. Methods also include presenting the queries.
    Type: Grant
    Filed: September 15, 2014
    Date of Patent: May 16, 2017
    Assignee: GOOGLE INC.
    Inventors: Scott Huffman, Rehan Khan, Uri Bernstein, Natalia Marmasse
  • Publication number: 20170125950
    Abstract: A cable bypass assembly is disclosed for use in providing a high speed transmission line for connecting a board mounted connector of an electronic device to a chip on the device board. The bypass cable assembly has a structure that permits it, where it is terminated to the board mounted connector and the chip member, or closely proximate thereto, to allow signals to be transmitted at greater than 10 GHz with substantially lower loss than a traditional FR4 circuit board.
    Type: Application
    Filed: January 12, 2017
    Publication date: May 4, 2017
    Applicant: Molex, LLC
    Inventors: Brian Keith Lloyd, Christopher David HIRSCHY, Munawar AHMAD, Eran J. JONES, Stephen W. HAMBLIN, Darian Ross SCHULZ, Todd David WARD, Gregory B. WALZ, Ebrahim ABUNASRAH, Rehan KHAN
  • Publication number: 20170100252
    Abstract: The present disclosure provides intramedullary mandibular implants for the temporomandibular joint. The mandibular implants include a stem portion, a collar portion and a head portion. The stem, collar and head portions may be integral. The stem portion may define an inferior end and the head portion may define a superior end of the implants. The head portion may be arcuate in the sagittal plane to provide an articulating surface with a fossa or a fossa component. The collar portion may be intermediate of the head and stem portions and form a channel between an interior surface of the collar portion and an exterior surface of the stem portion. In use, the stem portion may be implanted within a condyle of a mandible such that an end portion of the condyle is situated within the channel of the implant and the head portion articulates with the fossa or fossa component.
    Type: Application
    Filed: December 22, 2016
    Publication date: April 13, 2017
    Applicant: The Research Foundation for the State University of New York
    Inventors: MARTIN PENDOLA, GAIA SALVADORE, REHAN KHAN
  • Patent number: 9608348
    Abstract: A cable bypass assembly is disclosed for use in providing a high speed transmission line that connect a chip, processor or circuitry mounted on a circuit board to other similar components. The bypass cable assembly has a structure that allows for low loss between a first body and a connector that includes a second body. The connector includes a plurality of conductive terminals arranged in a manner that allows the impedance and other electrical characteristics of the cable to be maintained in a desirable manner through the cable bypass assembly.
    Type: Grant
    Filed: October 11, 2016
    Date of Patent: March 28, 2017
    Assignee: Molex, LLC
    Inventors: Christopher D. Wanha, Brian Keith Lloyd, Ebrahim Abunasrah, Rehan Khan, Javier Resendez, Michael Rost
  • Publication number: 20170033478
    Abstract: A cable bypass assembly is disclosed for use in providing a high speed transmission line that connect a chip, processor or circuitry mounted on a circuit board to other similar components. The bypass cable assembly has a structure that allows for low loss between a first body and a connector that includes a second body. The connector includes a plurality of conductive terminals arranged in a manner that allows the impedance and other electrical characteristics of the cable to be maintained in a desirable manner through the cable bypass assembly.
    Type: Application
    Filed: October 11, 2016
    Publication date: February 2, 2017
    Applicant: Molex, LLC
    Inventors: Christopher D. Wanha, Brian Keith LLOYD, Ebrahim ABUNASRAH, Rehan KHAN, Javier RESENDEZ, Michael ROST
  • Patent number: 9552430
    Abstract: Methods, systems, and apparatus, including computer programs encoded on a computer storage medium, for identifying resource locations. In one aspect, a method includes determining a resource location for a resource from user locations associated with users who performed actions identified as having represented user interest in the resource.
    Type: Grant
    Filed: December 28, 2010
    Date of Patent: January 24, 2017
    Assignee: GOOGLE INC.
    Inventor: Rehan Khan
  • Patent number: 9490558
    Abstract: A connection system is disclosed for use in providing a high speed transmission line for connecting a chip mounted on a circuit board to a connector. The system has a structure that allows for high data rates from the connector to the chip. The connector includes a plurality of conductive terminals and a ground terminal arranged so that the impedance and other electrical characteristics may be maintained from the connector to the chip while reducing signal loss.
    Type: Grant
    Filed: May 23, 2016
    Date of Patent: November 8, 2016
    Assignee: Molex, LLC
    Inventors: Christopher D. Wanha, Brian Keith Lloyd, Ebrahim Abunasrah, Rehan Khan, Javier Resendez, Michael Rost
  • Publication number: 20160268714
    Abstract: A connection system is disclosed for use in providing a high speed transmission line for connecting a chip mounted on a circuit board to a connector. The system has a structure that allows for high data rates from the connector to the chip. The connector includes a plurality of conductive terminals and a ground terminal arranged so that the impedance and other electrical characteristics may be maintained from the connector to the chip while reducing signal loss.
    Type: Application
    Filed: May 23, 2016
    Publication date: September 15, 2016
    Applicant: Molex, LLC
    Inventors: Christopher D. WANHA, Brian Keith LLOYD, Ebrahim ABUNASRAH, Rehan KHAN, Javier RESENDEZ, Michael ROST
  • Patent number: RE47342
    Abstract: A cable bypass assembly is disclosed for use in providing a high speed transmission line for connecting a board mounted connector of an electronic device to a chip on the device board. The bypass cable assembly has a structure that permits it, where it is terminated to the board mounted connector and the chip member, or closely proximate thereto to replicate closely the geometry of the cable. The connector terminals are arranged in alignment with the cable signal conductors and shield extensions are provided so that shielding can be provided up to and over the termination between the cable signal conductors and the board connector terminal tails. Likewise, a similar termination structure is provided at the opposite end of the cable where a pair of terminals are supported by a second connector body and enclosed in a shield collar. The shield collar has an extension that engages the second end of the cable.
    Type: Grant
    Filed: September 21, 2016
    Date of Patent: April 9, 2019
    Assignee: Molex, LLC
    Inventors: Brian Keith Lloyd, Christopher David Hirschy, Munawar Ahmad, Eran J. Jones, Stephen W. Hamblin, Darian Ross Schulz, Todd David Ward, Gregory B. Walz, Ebrahim Abunasrah, Rehan Khan