Patents by Inventor Reijiroh Shohji

Reijiroh Shohji has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20200152685
    Abstract: A semiconductor device is provided as a back-illuminated solid-state imaging device. The device is manufactured by bonding a first semiconductor wafer with a pixel array in a half-finished product state and a second semiconductor wafer with a logic circuit in a half-finished product state together, making the first semiconductor wafer into a thin film, electrically connecting the pixel array and the logic circuit, making the pixel array and the logic circuit into a finished product state, and dividing the first semiconductor wafer and the second semiconductor being bonded together into microchips.
    Type: Application
    Filed: January 17, 2020
    Publication date: May 14, 2020
    Inventors: Taku Umebayashi, Hitoshi Takahashi, Reijiroh Shohji
  • Publication number: 20200105814
    Abstract: A solid-state imaging device including: a first substrate having a pixel unit, and a first semiconductor substrate and a first wiring layer; a second substrate with a circuit, and a second semiconductor substrate and a second wiring layer; and a third substrate with a circuit, and a third semiconductor substrate and a third wiring layer. The first and second substrates are bonded together such that the first wiring layer and the second semiconductor substrate are opposed to each other. The device includes a first coupling structure for electrically coupling a circuit of the first substrate and the circuit of the second substrate. The first coupling structure includes a via in which electrically-conductive materials are embedded in a first through hole that exposes a wiring line in the first wiring layer and in a second through hole that exposes a wiring line in the second wiring layer or a film-formed structure.
    Type: Application
    Filed: March 23, 2018
    Publication date: April 2, 2020
    Applicant: SONY SEMICONDUCTOR SOLUTIONS CORPORATION
    Inventors: Hideto HASHIGUCHI, Reijiroh SHOHJI, Hiroshi HORIKOSHI, Ikue MITSUHASHI, Tadashi IIJIMA, Takatoshi KAMESHIMA, Minoru ISHIDA, Masaki HANEDA
  • Publication number: 20200105813
    Abstract: [Object] To provide a solid-state imaging device and an electronic apparatus with further improved performance. [Solution] A solid-state imaging device including: a first substrate on which a pixel unit is formed, and a first semiconductor substrate and a first multi-layered wiring layer are stacked; a second substrate on which a circuit having a predetermined function is formed, and a second semiconductor substrate and a second multi-layered wiring layer are stacked; and a third substrate on which a circuit having a predetermined function is formed, and a third semiconductor substrate and a third multi-layered wiring layer are stacked. The first substrate, the second substrate, and the third substrate are stacked in this order. The pixel unit has pixels arranged thereon. The first substrate and the second substrate are bonded together in a manner that the first multi-layered wiring layer and the second semiconductor substrate are opposed to each other.
    Type: Application
    Filed: March 23, 2018
    Publication date: April 2, 2020
    Inventors: HIDETO HASHIGUCHI, REIJIROH SHOHJI, HIROSHI HORIKOSHI, IKUE MITSUHASHI, TADASHI IIJIMA, TAKATOSHI KAMESHIMA, MINORU ISHIDA, MASAKI HANEDA
  • Publication number: 20200098815
    Abstract: [Object] To further improve performance of a solid-state imaging device.
    Type: Application
    Filed: March 23, 2018
    Publication date: March 26, 2020
    Inventors: TAKATOSHI KAMESHIMA, HIDETO HASHIGUCHI, IKUE MITSUHASHI, HIROSHI HORIKOSHI, REIJIROH SHOHJI, MINORU ISHIDA, TADASHI IIJIMA, MASAKI HANEDA
  • Publication number: 20200091217
    Abstract: [Object] To provide a solid-state imaging device and an electronic apparatus with further improved performance. [Solution] A solid-state imaging device including: a first substrate on which a pixel unit is formed, and a first semiconductor substrate and a first multi-layered wiring layer are stacked; a second substrate on which a circuit having a predetermined function is formed, and a second semiconductor substrate and a second multi-layered wiring layer are stacked; and a third substrate on which a circuit having a predetermined function is formed, and a third semiconductor substrate and a third multi-layered wiring layer are stacked. The first substrate, the second substrate, and the third substrate are stacked in this order. The pixel unit has pixels arranged thereon. The first substrate and the second substrate are bonded together with the first multi-layered wiring layer and the second semiconductor substrate opposed to each other.
    Type: Application
    Filed: March 23, 2018
    Publication date: March 19, 2020
    Inventors: HIROSHI HORIKOSHI, MINORU ISHIDA, REIJIROH SHOHJI, TADASHI IIJIMA, TAKATOSHI KAMESHIMA, HIDETO HASHIGUCHI, IKUE MITSUHASHI, MASAKI HANEDA
  • Publication number: 20200044181
    Abstract: To provide a light emitting element, a display device, and an electronic apparatus, less influenced by light emitted outside a light emitting region. A light emitting element includes: a light emitting region formed on a plane; a transparent electrode formed in a planar region that is larger than the light emitting region and internally includes the light emitting region; a reflector disposed under the transparent electrode and formed in the planar region inside the light emitting region; an organic light emitting layer disposed on the transparent electrode and formed so as to extend to the outside of the light emitting region; and a counter electrode disposed on the organic light emitting layer and formed so as to extend to the outside of the light emitting region.
    Type: Application
    Filed: January 24, 2018
    Publication date: February 6, 2020
    Inventor: Reijiroh Shohji
  • Publication number: 20190348398
    Abstract: There is provided a semiconductor device a method for manufacturing a semiconductor device, and an electronic apparatus that comprises a semiconductor device, the semiconductor device including a first chip, a second chip that is bonded onto a first surface side of the first chip, a through electrode that is formed to penetrate from a second surface side of the first chip to a wiring layer on the second semiconductor base substrate, and an insulation layer that is disposed between the through electrode and a semiconductor base substrate in the first chip.
    Type: Application
    Filed: July 24, 2019
    Publication date: November 14, 2019
    Applicant: Sony Corporation
    Inventors: Satoru Wakiyama, Masaki Okamoto, Yutaka Ooka, Reijiroh Shohji, Yoshifumi Zaizen, Kazunori Nagahata, Masaki Haneda
  • Patent number: 10403670
    Abstract: A semiconductor device is provided as a back-illuminated solid-state imaging device. The device is manufactured by bonding a first semiconductor wafer with a pixel array in a half-finished product state and a second semiconductor wafer with a logic circuit in a half-finished product state together, making the first semiconductor wafer into a thin film, electrically connecting the pixel array and the logic circuit, making the pixel array and the logic circuit into a finished product state, and dividing the first semiconductor wafer and the second semiconductor being bonded together into microchips.
    Type: Grant
    Filed: November 15, 2017
    Date of Patent: September 3, 2019
    Assignee: Sony Corporation
    Inventors: Taku Umebayashi, Hiroshi Takahashi, Reijiroh Shohji
  • Patent number: 10373934
    Abstract: There is provided a semiconductor device and an electronic apparatus that comprises a semiconductor device, the semiconductor device including a first chip, a second chip that is bonded onto a first surface side of the first chip, a through electrode that is formed to penetrate from a second surface side of the first chip to a second wiring layer on the second semiconductor base substrate, and an insulation layer that is disposed between the through electrode and a semiconductor base substrate in the first chip.
    Type: Grant
    Filed: February 2, 2018
    Date of Patent: August 6, 2019
    Assignee: Sony Corporation
    Inventors: Satoru Wakiyama, Masaki Okamoto, Yutaka Ooka, Reijiroh Shohji, Yoshifumi Zaizen, Kazunori Nagahata, Masaki Haneda
  • Publication number: 20190214425
    Abstract: A semiconductor device is provided as a back-illuminated solid-state imaging device. The device is manufactured by bonding a first semiconductor wafer with a pixel array in a half-finished product state and a second semiconductor wafer with a logic circuit in a half-finished product state together, making the first semiconductor wafer into a thin film, electrically connecting the pixel array and the logic circuit, making the pixel array and the logic circuit into a finished product state, and dividing the first semiconductor wafer and the second semiconductor being bonded together into microchips.
    Type: Application
    Filed: March 19, 2019
    Publication date: July 11, 2019
    Applicant: Sony Corporation
    Inventors: Taku Umebayashi, Hiroshi Takahashi, Reijiroh Shohji
  • Patent number: 10141361
    Abstract: A semiconductor device is provided as a back-illuminated solid-state imaging device. The device is manufactured by bonding a first semiconductor wafer with a pixel array in a half-finished product state and a second semiconductor wafer with a logic circuit in a half-finished product state together, making the first semiconductor wafer into a thin film, electrically connecting the pixel array and the logic circuit, making the pixel array and the logic circuit into a finished product state, and dividing the first semiconductor wafer and the second semiconductor being bonded together into microchips.
    Type: Grant
    Filed: September 22, 2017
    Date of Patent: November 27, 2018
    Assignee: Sony Corporation
    Inventors: Taku Umebayashi, Hiroshi Takahashi, Reijiroh Shohji
  • Publication number: 20180158803
    Abstract: There is provided a semiconductor device and an electronic apparatus that comprises a semiconductor device, the semiconductor device including a first chip, a second chip that is bonded onto a first surface side of the first chip, a through electrode that is formed to penetrate from a second surface side of the first chip to a second wiring layer on the second semiconductor base substrate, and an insulation layer that is disposed between the through electrode and a semiconductor base substrate in the first chip.
    Type: Application
    Filed: February 2, 2018
    Publication date: June 7, 2018
    Inventors: Satoru Wakiyama, Masaki Okamoto, Yutaka Ooka, Reijiroh Shohji, Yoshifumi Zaizen, Kazunori Nagahata, Masaki Haneda
  • Patent number: 9922961
    Abstract: There is provided a semiconductor device and an electronic apparatus that comprises a semiconductor device, the semiconductor device including a first chip, a second chip that is bonded onto a first surface side of the first chip, a through electrode that is formed to penetrate from a second surface side of the first chip to a second wiring layer on the second semiconductor base substrate, and an insulation layer that is disposed between the through electrode and a semiconductor base substrate in the first chip.
    Type: Grant
    Filed: November 17, 2016
    Date of Patent: March 20, 2018
    Assignee: Sony Corporation
    Inventors: Satoru Wakiyama, Masaki Okamoto, Yutaka Ooka, Reijiroh Shohji, Yoshifumi Zaizen, Kazunori Nagahata, Masaki Haneda
  • Publication number: 20180076249
    Abstract: A semiconductor device is provided as a back-illuminated solid-state imaging device. The device is manufactured by bonding a first semiconductor wafer with a pixel array in a half-finished product state and a second semiconductor wafer with a logic circuit in a half-finished product state together, making the first semiconductor wafer into a thin film, electrically connecting the pixel array and the logic circuit, making the pixel array and the logic circuit into a finished product state, and dividing the first semiconductor wafer and the second semiconductor being bonded together into microchips.
    Type: Application
    Filed: November 15, 2017
    Publication date: March 15, 2018
    Inventors: Taku Umebayashi, Hiroshi Takahashi, Reijiroh Shohji
  • Publication number: 20180012924
    Abstract: A semiconductor device is provided as a back-illuminated solid-state imaging device. The device is manufactured by bonding a first semiconductor wafer with a pixel array in a half-finished product state and a second semiconductor wafer with a logic circuit in a half-finished product state together, making the first semiconductor wafer into a thin film, electrically connecting the pixel array and the logic circuit, making the pixel array and the logic circuit into a finished product state, and dividing the first semiconductor wafer and the second semiconductor being bonded together into microchips.
    Type: Application
    Filed: September 22, 2017
    Publication date: January 11, 2018
    Inventors: Taku Umebayashi, Hiroshi Takahashi, Reijiroh Shohji
  • Patent number: 9799695
    Abstract: A semiconductor device is provided as a back-illuminated solid-state imaging device. The device is manufactured by bonding a first semiconductor wafer with a pixel array in a half-finished product state and a second semiconductor wafer with a logic circuit in a half-finished product state together, making the first semiconductor wafer into a thin film, electrically connecting the pixel array and the logic circuit, making the pixel array and the logic circuit into a finished product state, and dividing the first semiconductor wafer and the second semiconductor being bonded together into microchips.
    Type: Grant
    Filed: December 9, 2016
    Date of Patent: October 24, 2017
    Assignee: Sony Corporation
    Inventors: Taku Umebayashi, Hiroshi Takahashi, Reijiroh Shohji
  • Publication number: 20170092681
    Abstract: A semiconductor device is provided as a back-illuminated solid-state imaging device. The device is manufactured by bonding a first semiconductor wafer with a pixel array in a half-finished product state and a second semiconductor wafer with a logic circuit in a half-finished product state together, making the first semiconductor wafer into a thin film, electrically connecting the pixel array and the logic circuit, making the pixel array and the logic circuit into a finished product state, and dividing the first semiconductor wafer and the second semiconductor being bonded together into microchips.
    Type: Application
    Filed: December 9, 2016
    Publication date: March 30, 2017
    Inventors: Taku Umebayashi, Hiroshi Takahashi, Reijiroh Shohji
  • Publication number: 20170069604
    Abstract: There is provided a semiconductor device and an electronic apparatus that comprises a semiconductor device, the semiconductor device including a first chip, a second chip that is bonded onto a first surface side of the first chip, a through electrode that is formed to penetrate from a second surface side of the first chip to a second wiring layer on the second semiconductor base substrate, and an insulation layer that is disposed between the through electrode and a semiconductor base substrate in the first chip.
    Type: Application
    Filed: November 17, 2016
    Publication date: March 9, 2017
    Inventors: Satoru Wakiyama, Masaki Okamoto, Yutaka Ooka, Reijiroh Shohji, Yoshifumi Zaizen, Kazunori Nagahata, Masaki Haneda
  • Patent number: 9530812
    Abstract: A semiconductor device is provided as a back-illuminated solid-state imaging device. The device is manufactured by bonding a first semiconductor wafer with a pixel array in a half-finished product state and a second semiconductor wafer with a logic circuit in a half-finished product state together, making the first semiconductor wafer into a thin film, electrically connecting the pixel array and the logic circuit, making the pixel array and the logic circuit into a finished product state, and dividing the first semiconductor wafer and the second semiconductor being bonded together into microchips.
    Type: Grant
    Filed: March 31, 2016
    Date of Patent: December 27, 2016
    Assignee: Sony Corporation
    Inventors: Taku Umebayashi, Hiroshi Takahashi, Reijiroh Shohji
  • Patent number: 9524925
    Abstract: There is provided a method for manufacturing a semiconductor device including a first semiconductor base substrate, a second semiconductor base substrate that is bonded onto a first surface side of the first semiconductor base substrate, a through electrode that is formed to penetrate from a second surface side of the first semiconductor base substrate to a wiring layer on the second semiconductor base substrate, and an insulation layer that surrounds a circumference of the through electrode formed inside the first semiconductor base substrate.
    Type: Grant
    Filed: April 12, 2016
    Date of Patent: December 20, 2016
    Assignee: Sony Corporation
    Inventors: Satoru Wakiyama, Masaki Okamoto, Yutaka Ooka, Reijiroh Shohji, Yoshifumi Zaizen, Kazunori Nagahata, Masaki Haneda