Patents by Inventor Reijiroh Shohji

Reijiroh Shohji has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 10403670
    Abstract: A semiconductor device is provided as a back-illuminated solid-state imaging device. The device is manufactured by bonding a first semiconductor wafer with a pixel array in a half-finished product state and a second semiconductor wafer with a logic circuit in a half-finished product state together, making the first semiconductor wafer into a thin film, electrically connecting the pixel array and the logic circuit, making the pixel array and the logic circuit into a finished product state, and dividing the first semiconductor wafer and the second semiconductor being bonded together into microchips.
    Type: Grant
    Filed: November 15, 2017
    Date of Patent: September 3, 2019
    Assignee: Sony Corporation
    Inventors: Taku Umebayashi, Hiroshi Takahashi, Reijiroh Shohji
  • Patent number: 10373934
    Abstract: There is provided a semiconductor device and an electronic apparatus that comprises a semiconductor device, the semiconductor device including a first chip, a second chip that is bonded onto a first surface side of the first chip, a through electrode that is formed to penetrate from a second surface side of the first chip to a second wiring layer on the second semiconductor base substrate, and an insulation layer that is disposed between the through electrode and a semiconductor base substrate in the first chip.
    Type: Grant
    Filed: February 2, 2018
    Date of Patent: August 6, 2019
    Assignee: Sony Corporation
    Inventors: Satoru Wakiyama, Masaki Okamoto, Yutaka Ooka, Reijiroh Shohji, Yoshifumi Zaizen, Kazunori Nagahata, Masaki Haneda
  • Publication number: 20190214425
    Abstract: A semiconductor device is provided as a back-illuminated solid-state imaging device. The device is manufactured by bonding a first semiconductor wafer with a pixel array in a half-finished product state and a second semiconductor wafer with a logic circuit in a half-finished product state together, making the first semiconductor wafer into a thin film, electrically connecting the pixel array and the logic circuit, making the pixel array and the logic circuit into a finished product state, and dividing the first semiconductor wafer and the second semiconductor being bonded together into microchips.
    Type: Application
    Filed: March 19, 2019
    Publication date: July 11, 2019
    Applicant: Sony Corporation
    Inventors: Taku Umebayashi, Hiroshi Takahashi, Reijiroh Shohji
  • Patent number: 10141361
    Abstract: A semiconductor device is provided as a back-illuminated solid-state imaging device. The device is manufactured by bonding a first semiconductor wafer with a pixel array in a half-finished product state and a second semiconductor wafer with a logic circuit in a half-finished product state together, making the first semiconductor wafer into a thin film, electrically connecting the pixel array and the logic circuit, making the pixel array and the logic circuit into a finished product state, and dividing the first semiconductor wafer and the second semiconductor being bonded together into microchips.
    Type: Grant
    Filed: September 22, 2017
    Date of Patent: November 27, 2018
    Assignee: Sony Corporation
    Inventors: Taku Umebayashi, Hiroshi Takahashi, Reijiroh Shohji
  • Publication number: 20180158803
    Abstract: There is provided a semiconductor device and an electronic apparatus that comprises a semiconductor device, the semiconductor device including a first chip, a second chip that is bonded onto a first surface side of the first chip, a through electrode that is formed to penetrate from a second surface side of the first chip to a second wiring layer on the second semiconductor base substrate, and an insulation layer that is disposed between the through electrode and a semiconductor base substrate in the first chip.
    Type: Application
    Filed: February 2, 2018
    Publication date: June 7, 2018
    Inventors: Satoru Wakiyama, Masaki Okamoto, Yutaka Ooka, Reijiroh Shohji, Yoshifumi Zaizen, Kazunori Nagahata, Masaki Haneda
  • Patent number: 9922961
    Abstract: There is provided a semiconductor device and an electronic apparatus that comprises a semiconductor device, the semiconductor device including a first chip, a second chip that is bonded onto a first surface side of the first chip, a through electrode that is formed to penetrate from a second surface side of the first chip to a second wiring layer on the second semiconductor base substrate, and an insulation layer that is disposed between the through electrode and a semiconductor base substrate in the first chip.
    Type: Grant
    Filed: November 17, 2016
    Date of Patent: March 20, 2018
    Assignee: Sony Corporation
    Inventors: Satoru Wakiyama, Masaki Okamoto, Yutaka Ooka, Reijiroh Shohji, Yoshifumi Zaizen, Kazunori Nagahata, Masaki Haneda
  • Publication number: 20180076249
    Abstract: A semiconductor device is provided as a back-illuminated solid-state imaging device. The device is manufactured by bonding a first semiconductor wafer with a pixel array in a half-finished product state and a second semiconductor wafer with a logic circuit in a half-finished product state together, making the first semiconductor wafer into a thin film, electrically connecting the pixel array and the logic circuit, making the pixel array and the logic circuit into a finished product state, and dividing the first semiconductor wafer and the second semiconductor being bonded together into microchips.
    Type: Application
    Filed: November 15, 2017
    Publication date: March 15, 2018
    Inventors: Taku Umebayashi, Hiroshi Takahashi, Reijiroh Shohji
  • Publication number: 20180012924
    Abstract: A semiconductor device is provided as a back-illuminated solid-state imaging device. The device is manufactured by bonding a first semiconductor wafer with a pixel array in a half-finished product state and a second semiconductor wafer with a logic circuit in a half-finished product state together, making the first semiconductor wafer into a thin film, electrically connecting the pixel array and the logic circuit, making the pixel array and the logic circuit into a finished product state, and dividing the first semiconductor wafer and the second semiconductor being bonded together into microchips.
    Type: Application
    Filed: September 22, 2017
    Publication date: January 11, 2018
    Inventors: Taku Umebayashi, Hiroshi Takahashi, Reijiroh Shohji
  • Patent number: 9799695
    Abstract: A semiconductor device is provided as a back-illuminated solid-state imaging device. The device is manufactured by bonding a first semiconductor wafer with a pixel array in a half-finished product state and a second semiconductor wafer with a logic circuit in a half-finished product state together, making the first semiconductor wafer into a thin film, electrically connecting the pixel array and the logic circuit, making the pixel array and the logic circuit into a finished product state, and dividing the first semiconductor wafer and the second semiconductor being bonded together into microchips.
    Type: Grant
    Filed: December 9, 2016
    Date of Patent: October 24, 2017
    Assignee: Sony Corporation
    Inventors: Taku Umebayashi, Hiroshi Takahashi, Reijiroh Shohji
  • Publication number: 20170092681
    Abstract: A semiconductor device is provided as a back-illuminated solid-state imaging device. The device is manufactured by bonding a first semiconductor wafer with a pixel array in a half-finished product state and a second semiconductor wafer with a logic circuit in a half-finished product state together, making the first semiconductor wafer into a thin film, electrically connecting the pixel array and the logic circuit, making the pixel array and the logic circuit into a finished product state, and dividing the first semiconductor wafer and the second semiconductor being bonded together into microchips.
    Type: Application
    Filed: December 9, 2016
    Publication date: March 30, 2017
    Inventors: Taku Umebayashi, Hiroshi Takahashi, Reijiroh Shohji
  • Publication number: 20170069604
    Abstract: There is provided a semiconductor device and an electronic apparatus that comprises a semiconductor device, the semiconductor device including a first chip, a second chip that is bonded onto a first surface side of the first chip, a through electrode that is formed to penetrate from a second surface side of the first chip to a second wiring layer on the second semiconductor base substrate, and an insulation layer that is disposed between the through electrode and a semiconductor base substrate in the first chip.
    Type: Application
    Filed: November 17, 2016
    Publication date: March 9, 2017
    Inventors: Satoru Wakiyama, Masaki Okamoto, Yutaka Ooka, Reijiroh Shohji, Yoshifumi Zaizen, Kazunori Nagahata, Masaki Haneda
  • Patent number: 9530812
    Abstract: A semiconductor device is provided as a back-illuminated solid-state imaging device. The device is manufactured by bonding a first semiconductor wafer with a pixel array in a half-finished product state and a second semiconductor wafer with a logic circuit in a half-finished product state together, making the first semiconductor wafer into a thin film, electrically connecting the pixel array and the logic circuit, making the pixel array and the logic circuit into a finished product state, and dividing the first semiconductor wafer and the second semiconductor being bonded together into microchips.
    Type: Grant
    Filed: March 31, 2016
    Date of Patent: December 27, 2016
    Assignee: Sony Corporation
    Inventors: Taku Umebayashi, Hiroshi Takahashi, Reijiroh Shohji
  • Patent number: 9524925
    Abstract: There is provided a method for manufacturing a semiconductor device including a first semiconductor base substrate, a second semiconductor base substrate that is bonded onto a first surface side of the first semiconductor base substrate, a through electrode that is formed to penetrate from a second surface side of the first semiconductor base substrate to a wiring layer on the second semiconductor base substrate, and an insulation layer that surrounds a circumference of the through electrode formed inside the first semiconductor base substrate.
    Type: Grant
    Filed: April 12, 2016
    Date of Patent: December 20, 2016
    Assignee: Sony Corporation
    Inventors: Satoru Wakiyama, Masaki Okamoto, Yutaka Ooka, Reijiroh Shohji, Yoshifumi Zaizen, Kazunori Nagahata, Masaki Haneda
  • Patent number: 9451131
    Abstract: A semiconductor device is provided as a back-illuminated solid-state imaging device. The device is manufactured by bonding a first semiconductor wafer with a pixel array in a half-finished product state and a second semiconductor wafer with a logic circuit in a half-finished product state together, making the first semiconductor wafer into a thin film, electrically connecting the pixel array and the logic circuit, making the pixel array and the logic circuit into a finished product state, and dividing the first semiconductor wafer and the second semiconductor being bonded together into microchips.
    Type: Grant
    Filed: March 11, 2010
    Date of Patent: September 20, 2016
    Assignee: Sony Corporation
    Inventors: Taku Umebayashi, Hiroshi Takahashi, Reijiroh Shohji
  • Publication number: 20160247746
    Abstract: There is provided a method for manufacturing a semiconductor device including a first semiconductor base substrate, a second semiconductor base substrate that is bonded onto a first surface side of the first semiconductor base substrate, a through electrode that is formed to penetrate from a second surface side of the first semiconductor base substrate to a wiring layer on the second semiconductor base substrate, and an insulation layer that surrounds a circumference of the through electrode formed inside the first semiconductor base substrate.
    Type: Application
    Filed: April 12, 2016
    Publication date: August 25, 2016
    Inventors: Satoru Wakiyama, Masaki Okamoto, Yutaka Ooka, Reijiroh Shohji, Yoshifumi Zaizen, Kazunori Nagahata, Masaki Haneda
  • Publication number: 20160218134
    Abstract: A semiconductor device is provided as a back-illuminated solid-state imaging device. The device is manufactured by bonding a first semiconductor wafer with a pixel array in a half-finished product state and a second semiconductor wafer with a logic circuit in a half-finished product state together, making the first semiconductor wafer into a thin film, electrically connecting the pixel array and the logic circuit, making the pixel array and the logic circuit into a finished product state, and dividing the first semiconductor wafer and the second semiconductor being bonded together into microchips.
    Type: Application
    Filed: March 31, 2016
    Publication date: July 28, 2016
    Inventors: Taku Umebayashi, Hiroshi Takahashi, Reijiroh Shohji
  • Patent number: 9343392
    Abstract: There is provided a semiconductor device including a first semiconductor base substrate, a second semiconductor base substrate that is bonded onto a first surface side of the first semiconductor base substrate, a through electrode that is formed to penetrate from a second surface side of the first semiconductor base substrate to a wiring layer on the second semiconductor base substrate, and an insulation layer that surrounds a circumference of the through electrode formed inside the first semiconductor base substrate.
    Type: Grant
    Filed: June 19, 2013
    Date of Patent: May 17, 2016
    Assignee: Sony Corporation
    Inventors: Satoru Wakiyama, Masaki Okamoto, Yutaka Ooka, Reijiroh Shohji, Yoshifumi Zaizen, Kazunori Nagahata, Masaki Haneda
  • Patent number: 9319569
    Abstract: A semiconductor device is provided as a back-illuminated solid-state imaging device. The device is manufactured by bonding a first semiconductor wafer with a pixel array in a half-finished product state and a second semiconductor wafer with a logic circuit in a half-finished product state together, making the first semiconductor wafer into a thin film, electrically connecting the pixel array and the logic circuit, making the pixel array and the logic circuit into a finished product state, and dividing the first semiconductor wafer and the second semiconductor being bonded together into microchips.
    Type: Grant
    Filed: August 24, 2015
    Date of Patent: April 19, 2016
    Assignee: Sony Corporation
    Inventors: Taku Umebayashi, Hiroshi Takahashi, Reijiroh Shohji
  • Publication number: 20150365567
    Abstract: A semiconductor device is provided as a back-illuminated solid-state imaging device. The device is manufactured by bonding a first semiconductor wafer with a pixel array in a half-finished product state and a second semiconductor wafer with a logic circuit in a half-finished product state together, making the first semiconductor wafer into a thin film, electrically connecting the pixel array and the logic circuit, making the pixel array and the logic circuit into a finished product state, and dividing the first semiconductor wafer and the second semiconductor being bonded together into microchips.
    Type: Application
    Filed: August 24, 2015
    Publication date: December 17, 2015
    Inventors: Taku Umebayashi, Hiroshi Takahashi, Reijiroh Shohji
  • Publication number: 20150179546
    Abstract: There is provided a semiconductor device including a first semiconductor base substrate, a second semiconductor base substrate that is bonded onto a first surface side of the first semiconductor base substrate, a through electrode that is formed to penetrate from a second surface side of the first semiconductor base substrate to a wiring layer on the second semiconductor base substrate, and an insulation layer that surrounds a circumference of the through electrode formed inside the first semiconductor base substrate.
    Type: Application
    Filed: June 19, 2013
    Publication date: June 25, 2015
    Inventors: Satoru Wakiyama, Masaki Okamoto, Yutaka Ooka, Reijiroh Shohji, Yoshifumi Zaizen, Kazunori Nagahata, Masaki Haneda