Abstract: A mouse pad is provided, including a glass substrate and a surface layer made from a ceramic material and formed on the glass substrate, wherein the ceramic surface layer has many pores with a surface roughness of 1˜20 ?m, such that the ceramic surface layer has a strong resistance to abrasion and deformity. Therefore, the sensitivity of the mouse is maintained and the mouse pad is more durable.

Abstract: The present invention discloses a taste-sensing mixture, a taste sensor and a taste-sensing system using the same, which measures the conductivity of a solution and analyzes the measuring result by the principle component analysis to differentiate the taste of the solution. The taste-sensing mixture comprises a carrier and a dispersant dispersed in the carrier. Preferably, the carrier is selected from the group consisting of conductive polymer, salt compound and alkene polymer, while the dispersant is selected from the group consisting of alcohol and gel. The alkene polymer is selected from the group consisting of polyvinyl alcohol, polyethylene oxide and polystyrene, the alcohol is selected from the group consisting of glycerol, methanol and ethanol, the conductive polymer can be polypyrrole or polyaniline, the salt compound can be sodium chloride or sodium potassium, and the gel can be agar.

Abstract: A screw-rotor machine having a male rotor and a female rotor formed by a number of helical lobs or ribs and a like number of intervening helical grooves; the profiles of male rotor and female rotor are generated by a rack profile; wherein the rack profile is constructed by a plurality of line segments (or curves). Such that the screw-rotor machine is high in efficiency and the torque distribution can be adjusted.

Abstract: A humidity sensor element, a humidity sensor device and a method for manufacturing thereof are provided. The humidity sensor element includes a substrate having a nanocomposite film as sensing material, wherein said nanocomposite film consists of carbon nanotube/perfluorinated polymer with acid functional groups in weight ratio of 0.01-20; and at least a pair of electrodes, which contact with the sensing material at one or both side(s). The nanocomposite film increases the sensitivity of humidity sensor element such that even an infinitesimal amount of moisture can be detected with minimum detection limit of 15.

Abstract: A method and system for selecting feedback rules for an online auction. An exemplary method may comprise controlling feedback by customizing feedback rules for an online auction substantially no earlier than entry of auction rules into an auction program by an end-user, storing the customized feedback rules for future use by the auction program, and conducting the online auction by the auction program using the feedback rules.

Abstract: A non-volatile lubricious coating composition is provided for use with medical devices, such as hypodermic needles, catheters, and the like. The coating composition includes a first siloxane polymer having a very low viscosity less than about 50 centistokes, a second siloxane polymer having a high viscosity greater than about 1,000 centistokes, a reactive silicone polymer which is capable of crosslinking upon exposure to radiation, such as a UV curable silicone acrylate, and a photoinitiator to accelerate cross-linking of the reactive silicone polymer. The coating composition may further include an aminofunctional siloxane polymer to promote adhesion to metal surfaces when used with needles. The coating composition provides flowability without the need for any volatile organic solvent, and is capable of curing to provide adhesion and lubricity.

Abstract: The present invention relates to a nanostructured metal powder and a method of fabricating the same. A twin-wire electric arc process is performed to melt the wire tips, and metal melt is formed. Simultaneously, the metal melt is broken up into melt droplets by an atomizing device. The operating temperature of the electric arc process is controlled between melting point and boiling point of the wire, to avoid vaporization of the melt droplets. Then, a fast cooling is performed to quench the melt droplets. Thus, melt droplets are solidified to &mgr;m-scaled, spherical and dense powders comprising nano-grains (d<100 nm).

Abstract: A unidirectional braking structure of a ratchet wrench comprises: a circoid surface with ratchet teeth disposed on the surrounding wall of an accommodating space at the working end of the wrench; a work piece wheel disposed in the accommodating space of said wheel; a plurality of restricting grooves, equidistantly disposed on the work piece wheel corresponding to the circoid surface with ratchet teeth; a plurality of direction restricting members disposed in the restricting grooves one by one, having a wheel teeth latching end to be engaged with the circoid surface with ratchet end; a plurality of springs disposed between the bottom of the restricting groove and the direction restricting member; such structure enables the present invention to enhance the torque of the wrench, reduce the loading of direction restricting member and the probability of damage, and have the merits of facilitating the manufacturing and assembling.

Abstract: An on-line system allows remotely located human subjects to participate in sessions that simulate activities within an economics environment. The system includes an Internet-based interface, which may be web-enabled to allow the presentation of information using a graphical user interface compatible with the World Wide Web. The system simultaneously hosts multiple sessions in which business models are simulated. Information acquired during the sessions may be evaluated to enable informed decisions to be made regarding actual business variables.

Abstract: A helmet includes a main body, a chin protecting member, and a face shield. The main body has a front opening, a bottom passage, and two opposing connecting portions sticking forwards from two lateral portions; the connecting portions each has a front opening in communication with an inner space thereof. The chin protecting member is pivoted to the lateral portions of the main body from two lateral portions thereof such that a front portion of the chin member can be positioned at a lower part of the opening of the main body so as to protect a chin of a wearer when the chin member is pivoted to an in-use position; the chin member is provided with a lock member for securing the same to the connecting portions of the main body when the chin member is moved to the in-use position. The face shield is pivotally connected to the chin member for covering the front opening.

Abstract: One embodiment of the present invention provides a method and system that computes the optimal level of the reserve price for an auction, with respect to a multiplicity of possible evaluation criteria that the end user of the system may specify. In one embodiment, structural elements characterizing the auction situation are estimated from bid data available on past auctions. The estimated structural elements are then used in the formulation of the user's expected payoff as a function of the reserve price. This objective function is then optimized to obtain the best level of the reserve price. In one embodiment, this method is implemented by a process executed on a computer system, under the control of software and firmware directing the operation of its processors and components. In one embodiment, a computer readable medium causes a computer system to execute the steps in a process for implementing the method.

Abstract: A self-aligned fabricating process and a structure of ETOX flash memory. A plurality of parallel lines for device isolation is formed in a substrate, and then forming a plurality of parallel stacked gates above the substrate. The device isolation lines and the stacked gates are perpendicular to each other. A plurality of first insulation layers is formed such that an insulation layer is formed over each stacked gate. Spacers are also formed over the sidewalls of each stacked gate. A plurality of source arrays and drain arrays are formed in the substrate between neighboring stacked gates. The source and drain arrays are parallel to the stacked gates, with a source array and a drain array formed in alternating positions between the stacked gates. Each source array comprises a plurality of source-doped regions located between the device isolation lines respectively. Similarly, each drain array has a plurality of drain-doped regions located between the device isolation lines.

Abstract: A computer-implemented automated decision support system for designing an auction for a given item includes a structure extractor that estimates unknown elements of market structure of the auction based on auction characteristics data extracted from historical auctions for similar items and a bidding model matching the extracted auction characteristics data. The decision support system also includes a bidding behavior predictor that predicts bidding behaviors of bidders in the auction based on the estimated unknown elements of market structure and characteristics of the auction. In addition, the system includes an optimizer that employs an evaluation criterion to generate an evaluation of the auction based on (1) the estimated unknown elements of market structure and (2) the predicted bidding behavior of bidders. A method of providing an automated auction analysis is also described.

Abstract: A method is used to form a borderless via in a semiconductor device. A conductive layer, a borophosphosilicate glass (BPSG) layer and a patterned first mask layer are formed on a dielectric layer in sequence. The BPSG layer is patterned into a BPSG plug while using the patterned first mask layer as a mask. A second mask layer is formed to cover the patterned first mask layer and the metal layer. The conductive layer is defined to form a conductive line beneath the BPSG plug and the second mask layer. The first and second photoresist mask layers are removed. An inter-metal dielectric layer is formed around the BPSG plug and the conductive line. A via is formed in the inter-metal dielectric layer by removing the BPSG plug. A barrier layer and a metal layer fill the via to form a metal plug.

Abstract: A bonding pad structure and its method of manufacture. The structure has a metallic bonding pad with a patterned surface, a first passivation layer having an opening above the metallic bonding pad and a second passivation layer over the first passivation layer also having an opening above the metallic bonding pad. The method of forming the bonding pad structure includes forming a metallic bonding pad over a substrate, and then forming a first passivation layer over the substrate and the bonding pad. The first passivation layer above the bonding pad is patterned. Using the first passivation layer as a mask, a portion of the exposed metal pad material is removed. A patterned second passivation layer is formed over the first passivation layer. The second passivation layer has an opening that exposes the bonding pad. Finally, residual material from the first passivation layer inside the bonding pad region is removed to expose the bonding pad surface.

Abstract: A method for fabricating a borderless via on a semiconductor device is described in which a substrate comprising a dielectric layer is provided. A conductive layer, a barrier layer and a metal layer are sequentially formed on the dielectric layer. A first photoresist pattern is further formed to cover the metal layer. A first etching step is then conducted using the barrier layer as an etching end point and the photoresist pattern as an etching mask. The tungsten metal layer is etched to form a tungsten metal plug in the first etching step. Thereafter, a second photoresist pattern is formed on the barrier layer, partially covering the first photoresist pattern and the barrier layer. A second etching is then conducted on the barrier layer and the metal layer to form a conductive line, using the first photoresist pattern and the second photoresist pattern as etching masks. The first and the second photoresist patterns are then removed.

Abstract: A bonding pad is described. A substrate having integrated circuits formed therein is provided. A dielectric layer having several trench structure formed therein is formed over the substrate, and each trench structure has several trenches radially arranged in the dielectric layer. A conductive layer is formed on the dielectric layer and fills the trenches, and the conductive layer is electrically coupled to the integrated circuits in the substrate through the trenches, respectively. By using the invention, the adhesion of the dielectric layers and the metal layers can be greatly improved and the compressive mechanical stress can be uniformly released to the substrate even if the wire width of the integrated circuit is reduced to the sub-micron level.

Abstract: A method of preparing a hearth roll with a coating, including: plating a metal on a ceramic powder by using electroless plating; mixing the metal-plated ceramic powder and a metal powder to form a cement powder; and thermally spraying the cement powder onto a hearth roll. Another method is: plating a metal on a ceramic powder by using electroless plating; mixing the metal-plated ceramic powder, a metal powder, and a binder to form a slurry, and subjecting the slurry to granulating and sintering to obtain a sintered powder; and thermally spraying the sintered powder onto a hearth roll.

Abstract: A new method is provided for the creation of spacers for the CMOS gate electrode. A layer of a spacer material is deposited over the gate structure; a layer of photoresist is deposited over the layer of spacer material. The layer of photoresist of the invention is partially stripped removing the photoresist from above the gate structure and providing a thinner layer of photoresist over the surrounding layer of spacer material. The layer of spacer material is partially etched whereby the layer of photoresist serves as a partial etch stop layer. The remainder of the photoresist is removed, the spacer material is further etched using a dry etch whereby a thin layer of spacer material (oxide) remains deposited over the surface of the substrate. As a final step the thin layer of spacer material (oxide) is removed from the surface of the substrate using a wet etch.

Abstract: A method of manufacturing mask read-only-memory. The method includes forming a plurality of first and second active regions in designated locations on a substrate. Each first and second active region has a channel region and a source/drain region on both side of the channel. Subsequently, shallow trench oxide are formed within the channel regions of the first active regions, and then source/drain terminals are formed in the respective source/drain regions of first and second active regions. Finally, a gate terminal is formed over the channel region.