Patents by Inventor Ren Zhou

Ren Zhou has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 10711350
    Abstract: Implementations described herein generally relate to materials and coatings, and more specifically to materials and coatings for aluminum and aluminum-containing chamber components. In one implementation, a process is provided. The process comprises exposing an aluminum-containing component to a moisture thermal treatment process and exposing the aluminum-containing component to a thermal treatment process. The moisture thermal treatment process comprises exposing the aluminum-containing component to an environment having a moisture content from about 30% to about 100% at a first temperature from about 30 to about 100 degrees Celsius. The thermal treatment process comprises heating the aluminum-containing component to a second temperature from about 200 degrees Celsius to about 550 degrees Celsius to form an alumina layer on the at least one surface of the aluminum-containing component.
    Type: Grant
    Filed: February 20, 2017
    Date of Patent: July 14, 2020
    Assignee: APPLIED MATERICAL, INC.
    Inventors: Ren-Guan Duan, Jianhua Zhou, Juan Carlos Rocha-Alvarez
  • Publication number: 20200203197
    Abstract: The invention discloses a semiconductor multi-station processing chamber. Each of the multiple station includes a downward concave accommodation defined by walls and receives a pedestal therein. The pedestal and the walls define a first gap. A showerhead plate mounted on an upper lid above the pedestal to define a processing region. A second gap for supply swiping gas is defined between the showerhead plate and the upper lid. An isolation member is liftable between the downward concave accommodation and the showerhead plate to optionally encircle a processing region defined by the pedestal and the showerhead plate or to retract back into the downward concave accommodation. Such that, when the isolation member surrounds and encircles the processing region, the station is able to be structurally isolated from its neighboring one station.
    Type: Application
    Filed: December 12, 2019
    Publication date: June 25, 2020
    Inventors: HUAQIANG TAN, REN ZHOU, ZHUO WANG, DEZAN YANG, GIYOUL KIM, JING LI, JUNICHI ARAMI, ZHONGWU LIU, SI SHEN, BRIAN LU, SEAN CHANG, GREGORY SIU
  • Publication number: 20200176231
    Abstract: A method for temperature measurement used in an RF processing apparatus for semiconductor includes generating by electrodes an RF signal sequence having multiple discontinuous RF signals that are separated by a time interval; and generating a temperature sensing signal by a thermal sensor during the time interval.
    Type: Application
    Filed: November 29, 2019
    Publication date: June 4, 2020
    Inventors: JUNICHI ARAMI, REN ZHOU
  • Publication number: 20200161166
    Abstract: A plate for supporting wafer has a top for carrying a wafer and a bottom coupled to a pedestal. The plate includes multiple heating units embedded within the plate and at least one set of grooves formed between the top and the bottom of the plate at a radial location between two of neighboring heating units to thereby enhance heat insulation among the heating units.
    Type: Application
    Filed: April 5, 2019
    Publication date: May 21, 2020
    Inventors: Junichi Arami, Ren Zhou
  • Publication number: 20200054050
    Abstract: A method of preparing the instant whole wheat crisps includes: using whole wheat grains as raw materials, fully soaking the whole wheat grains to make the whole wheat grains absorb water until saturating, and then performing cooking, extruding, sheeting, and microwave vacuum drying to obtain the instant whole wheat crisps. In the present disclosure, no artificial additive is added in the processing process, and the wheat grains are extruded and dried at a low temperature, which conforms to the current trend of “clean label” foods. Moreover, the whole wheat grains are processed into crisps, which are unadulterated whole wheat foods and conforms to the current trend of whole grains.
    Type: Application
    Filed: August 12, 2019
    Publication date: February 20, 2020
    Applicant: Jiangnan University
    Inventors: Xing ZHOU, Wanglu BAO, Zhengyu JIN, Jianwei ZHAO, Jinpeng WANG, Tingting MENG, Ren WANG
  • Patent number: 10497591
    Abstract: Disclosed is a load lock chamber which includes a chamber body including: at least one pair of cavities, defined in a layer structure of the chamber body to carry one or more wafer substrates; at least one internal conduit, defined between and coupled with the paired cavities, such that the paired cavities are communicated with each other and capable of conducting gas refilling and exhaustion; and a plurality of wafer supports for carrying the wafer substrates, the plurality of wafer supports being securely received in the paired cavities and able to calibrate with a machine arm frontend finger, wherein the wafer support includes grooves defined thereon for calibrating the machine arm frontend finger.
    Type: Grant
    Filed: September 16, 2016
    Date of Patent: December 3, 2019
    Assignee: PIOTECH CO., LTD.
    Inventors: Ren Zhou, Xuyen Pham, Brian Lu, Sean Chang, Shicai Fang, Jie Lian, Enguo Men
  • Patent number: 10476746
    Abstract: A network management method, device, and system used for network management and pertains to the communications field, where the method includes detecting bandwidth required by a first data flow, determining whether the bandwidth required by the first data flow is greater than a preset bandwidth value when the bandwidth required by the first data flow becomes higher, and allocating bandwidth to the first data flow when the bandwidth required by the first data flow is greater than the preset bandwidth value. Hence, a problem that a controller has relatively low efficiency when performing network management is resolved, thereby improving efficiency of performing network management by the controller.
    Type: Grant
    Filed: July 27, 2017
    Date of Patent: November 12, 2019
    Inventors: Ren Zhu, Wei Zhou
  • Publication number: 20190341280
    Abstract: The present invention discloses a wafer pedestal including a plate, a heating assembly and a heat insulation assembly embedded in the plate at a radial position that divides the plate into a first heating zone and a second heating zone.
    Type: Application
    Filed: May 1, 2019
    Publication date: November 7, 2019
    Inventors: JUNICHI ARAMI, REN ZHOU
  • Patent number: 10410909
    Abstract: The invention discloses a support structure for a wafer pedestal; particularly the wafer pedestal has a wafer carrying surface defining holes for accommodation of the support structure. The support structure includes a first surface and extends therebetween. The first surface includes a rising portion for supporting wafer. A center of the first surface and a center of the second surface define an axis that is not parallel to the normal of the first surface. That is, the first surface extends oblique relatively to the second surface such that the support structure according to the invention can be received in the pedestal in an oblique way relative to the wafer carrying surface of the pedestal.
    Type: Grant
    Filed: September 17, 2018
    Date of Patent: September 10, 2019
    Assignee: PIOTECH CO., LTD.
    Inventors: Ren Zhou, Xuyen Pham, Shichai Fang
  • Patent number: 10403535
    Abstract: Embodiments of the present disclosure provide an electrostatic chuck for maintaining a flatness of a substrate being processed in a plasma reactor at high temperatures. In one embodiment, the electrostatic chuck comprises a chuck body coupled to a support stem, the chuck body having a substrate supporting surface, and the chuck body has a volume resistivity value of about 1×107 ohm-cm to about 1×1015 ohm-cm in a temperature of about 250° C. to about 700° C., and an electrode embedded in the body, the electrode is coupled to a power supply. In one example, the chuck body is composed of an aluminum nitride material which has been observed to be able to optimize chucking performance around 600° C. or above during a deposition or etch process, or any other process that employ both high operating temperature and substrate clamping features.
    Type: Grant
    Filed: August 12, 2015
    Date of Patent: September 3, 2019
    Assignee: APPLIED MATERIALS, INC.
    Inventors: Zheng John Ye, Jay D. Pinson, II, Hiroji Hanawa, Jianhua Zhou, Xing Lin, Ren-Guan Duan, Kwangduk Douglas Lee, Bok Hoen Kim, Swayambhu P. Behera, Sungwon Ha, Ganesh Balasubramanian, Juan Carlos Rocha-Alvarez, Prashant Kumar Kulshreshtha, Jason K. Foster, Mukund Srinivasan, Uwe P. Haller, Hari K. Ponnekanti
  • Patent number: 10380223
    Abstract: A support tensor machine based neutral point grounding mode decision method and system adopts a support tensor machine method Based on three indexes, i.e., the power supply reliability index, safety index, and economical efficiency index, influences of different neutral point grounding modes are analyzed by employing the support tensor machine method to finally obtain a neutral point grounding mode capable of maximizing power supply reliability of a distribution network.
    Type: Grant
    Filed: March 5, 2018
    Date of Patent: August 13, 2019
    Assignees: STATE GRID ZHEJIANG ELECTRIC POWER COMPANY LIMITED, STATE GRID ZHEJIANG ECONOMIC RESEARCH INSTITUTE, STATE GRID NINGBO ELECTRIC POWER SUPPLY COMPANY LIMITED, ZHEJIANG HUAYUN ELECTRIC POWER ENGINEERING DESIGN CONSULTING CO. LTD
    Inventors: Yingjing He, Yangqing Dan, Weijun Liu, Weimin Zheng, Xiaodi Zhang, Chaoming Zheng, Xiran Wang, Shuyi Shen, Yan Yao, Yanwei Zhu, Fan Li, Lin Zhou, Jiandi Fang, Dan Yu, Ren Tang
  • Publication number: 20190203350
    Abstract: Implementations described herein protect a substrate support from corrosive cleaning gases used at high temperatures. In one embodiment, a substrate support has a shaft having an outer wall. The substrate support has a heater. The heater has a body having a top surface, a side surface and a bottom surface extending from the outer wall of the shaft. The top surface is configured to support a substrate during plasma processing of the substrate. A covering is provided for at least two of the top surface, side surface and bottom surface. The covering is selected to resist corrosion of the body at temperatures in excess of about 400 degrees Celsius. A sleeve circumscribing the shaft, the sleeve and the outer wall of the shaft forming a space therebetween, the space adapted to flow a purge gas therethrough in a direction toward the body.
    Type: Application
    Filed: March 8, 2019
    Publication date: July 4, 2019
    Inventors: Abdul Aziz KHAJA, Ren-Guan DUAN, Amit Kumar BANSAL, Jianhua ZHOU, Juan Carlos ROCHA-ALVAREZ
  • Patent number: 10289451
    Abstract: A method, an apparatus, and a system for adjusting a deployment location of a virtual machine in order resolve a problem that an inter-node communication cost has excessively great impact on an adjustment result in an existing solution for adjusting a deployment location of a virtual machine in a cloud computing system, the inter-node communication cost is corrected according to technical solutions provided in the embodiments of the present disclosure. Consequently, not only a corrected inter-node communication cost can exert impact on the result for adjusting a deployment location of a virtual machine, but also communication traffic can play a major role in affecting the adjustment result. Therefore, a more appropriate result for adjusting a deployment location of a virtual machine can be obtained, and bandwidth consumption inside the cloud computing system can be reduced.
    Type: Grant
    Filed: August 9, 2017
    Date of Patent: May 14, 2019
    Assignee: HUAWEI TECHNOLOGIES CO., LTD.
    Inventors: Ren Zhu, Wei Zhou, Tizheng Wang
  • Publication number: 20190096736
    Abstract: The invention discloses a support structure for a wafer pedestal; particularly the wafer pedestal has a wafer carrying surface defining holes for accommodation of the support structure. The support structure includes a first surface and extends therebetween. The first surface includes a rising portion for supporting wafer. A center of the first surface and a center of the second surface define an axis that is not parallel to the normal of the first surface. That is, the first surface extends oblique relatively to the second surface such that the support structure according to the invention can be received in the pedestal in an oblique way relative to the wafer carrying surface of the pedestal.
    Type: Application
    Filed: September 17, 2018
    Publication date: March 28, 2019
    Inventors: Ren Zhou, Xuyen Pham, Shichai Fang
  • Publication number: 20170271187
    Abstract: Disclosed is a load lock chamber which includes a chamber body including: at least one pair of cavities, defined in a layer structure of the chamber body to carry one or more wafer substrates; at least one internal conduit, defined between and coupled with the paired cavities, such that the paired cavities are communicated with each other and capable of conducting gas refilling and exhaustion; and a plurality of wafer supports for carrying the wafer substrates, the plurality of wafer supports being securely received in the paired cavities and able to calibrate with a machine arm frontend finger, wherein the wafer support includes grooves defined thereon for calibrating the machine arm frontend finger.
    Type: Application
    Filed: September 16, 2016
    Publication date: September 21, 2017
    Inventors: Ren ZHOU, Xuyen Pham, Brian Lu, Sean Chang, Shicai Fang, Jie Lian, Enguo Men
  • Patent number: 9108846
    Abstract: Provided is a method for preparing sulfuric acid by using hydrogen sulfide. The method comprises the following steps: (1) performing a reduction-oxidation reaction between an H2S feed gas and oxygen to prepare SO2; (2) cooling the product acquired in step (1) to a temperature between 390° C. and 430° C., then performing a catalyzed oxidation reaction with oxygen; and (3) cooling the product acquired in step (2), then further cooling to a temperature between 60° C. and 120° C., collecting H2SO4 product. Also provided is a heat exchanger, comprising a housing and several glass pipes arranged within the housing along the direction of a long axis of the housing, arching between two lateral walls thereof; the adjacent glass pipes are connected head-to-tail. The method provides great hydrogen sulfide removal efficiency, simple process flow, and allows for economic efficiency of apparatus and reasonable utilization of energy.
    Type: Grant
    Filed: June 29, 2012
    Date of Patent: August 18, 2015
    Assignee: Shanghai Keyontechs Co., Ltd.
    Inventors: Ren Zhou, Rui Huang
  • Patent number: 9101772
    Abstract: A method of stimulation therapy and an apparatus for providing the therapy which addresses cardiac dysfunction including heart failure. The therapy employs atrial pacing pulses delivered to a heart after the atrial refractory period and timed so that they will not cause a ventricular contraction. These atrial pacing are timed to achieve beneficial effects on myocardial mechanics (efficacy) while maintaining an extremely low level of risk of arrhythmia induction. These methods may be employed individually or in combinations in an external or implantable ESS therapy delivery device.
    Type: Grant
    Filed: December 9, 2009
    Date of Patent: August 11, 2015
    Assignee: Medtronic, Inc.
    Inventors: Karen J. Kleckner, Kathleen A. Prieve, Jeffrey M. Gillberg, Ren Zhou, Kenneth M. Anderson, D. Curtis Deno, Glenn C. Zillmer, Ruth N. Klepfer, Vincent E. Splett, David E. Euler, Lawrence J. Mulligan, Edwin G. Duffin, David A. Igel, John E. Burnes
  • Patent number: 8789493
    Abstract: An electrode assembly for a plasma reaction chamber used in semiconductor substrate processing having a backing member having a bonding surface, an inner electrode having a lower surface on one side and a bonding surface on the other side, and an outer electrode having a lower surface on one side and a bonding surface on the other side. At least one of the electrodes has a flange, which extends underneath at least a portion of the lower surface of the other electrode.
    Type: Grant
    Filed: February 13, 2006
    Date of Patent: July 29, 2014
    Assignee: Lam Research Corporation
    Inventors: Daxing Ren, Enrico Magni, Eric Lenz, Ren Zhou
  • Publication number: 20140205534
    Abstract: Provided is a method for preparing sulfuric acid by using hydrogen sulfide. The method comprises the following steps: (1) performing a reduction-oxidation reaction between an H2S feed gas and oxygen comprised in an oxygen-rich air to prepare SO2, controlling residual oxygen after the reduction-oxidation reaction step at a molar percentage of ?2%; (2) cooling the product acquired in step (1) to a temperature between 390° C. and 430° C., and then performing a catalyzed oxidation reaction with oxygen, wherein the catalyzed oxidation reaction is performed in stages until the conversion rate of SO2 is ?98.7% or the outlet concentration of SO2 is ?550 mg/Nm3; and (3) cooling the product acquired in step (2) to a temperature ?10° C. over the dew point temperature of H2SO4, then further cooling to a temperature between 60° C. and 120° C., collecting H2SO4 product, and subjecting the gas acquired after cooling to a coalescent separation before discharging directly into the atmosphere.
    Type: Application
    Filed: June 29, 2012
    Publication date: July 24, 2014
    Applicant: SHANGHAI KEYONTECHS CO., LTD.
    Inventors: Ren Zhou, Rui Huang
  • Publication number: 20120303084
    Abstract: The above-described methods and apparatus are believed to be of particular benefit for patients suffering heart failure including cardiac dysfunction, chronic HF, and the like and all variants as described herein and including those known to those of skill in the art to which the invention is directed. It will understood that the present invention offers the possibility of monitoring and therapy of a wide variety of acute and chronic cardiac dysfunctions. The current invention provides systems and methods for delivering therapy for cardiac hemodynamic dysfunction via the innervated myocardial substrate receives one or more discrete pulses of electrical stimulation during the refractory period of said innervated myocardial substrate.
    Type: Application
    Filed: August 8, 2012
    Publication date: November 29, 2012
    Applicant: Medtronic, Inc.
    Inventors: Karen J. Kleckner, Kathleen A. Prieve, Jeffrey M. Gillberg, Ren Zhou, Kenneth M. Anderson, D. Curtis Deno, Glenn C. Zillmer, Ruth N. Klepfer, Vincent E. Splett, David E. Euler, Lawrence J. Mulligan, Edwin G. Duffin, David A. Igel, John E. Burnes