Patents by Inventor Reynante Tamunan Alvarado

Reynante Tamunan Alvarado has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • SEMICONDUCTOR DEVICE COMPRISING MOLD FOR TOP SIDE AND SIDEWALL PROTECTION
    Publication number: 20140339712
    Abstract: Some implementations provide a semiconductor device that includes a substrate, several metal and dielectric layers coupled to the substrate, and a pad coupled to one of the several metal layers. The semiconductor device also includes a first metal layer coupled to the pad and an under bump metallization layer coupled to the first metal redistribution layer. The semiconductor device further includes a mold layer covering a first surface of the semiconductor device and at least a side portion of the semiconductor device. In some implementations, the mold layer is an epoxy layer. In some implementations, the first surface of the semiconductor device is the top side of the semiconductor device. In some implementations, the mold layer covers the at least side portion of the semiconductor device such that a side portion of at least one of the several metal layers and dielectric layers is covered with the mold layer.
    Type: Application
    Filed: May 20, 2013
    Publication date: November 20, 2014
    Applicant: QUALCOMM Incorporated
    Inventors: Reynante Tamunan Alvarado, Lizabeth Ann Keser, Jianwen Xu