Patents by Inventor Ricardo A. Uscola

Ricardo A. Uscola has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20080291107
    Abstract: A device 20 includes a substrate 22 having an integrated circuit (IC) die 24 coupled thereto. A bond wire 28 interconnects a die bond pad 32 on the IC die 24 with an insulated bond pad 36. Another bond wire 38 interconnects a die bond pad 42 on the IC die 24 with another insulated bond pad 46. The bond wires 28 and 38 serve as radiating elements of a dipole antenna structure 64. A reflector 72 and director 74 can be located on the substrate 22 and/or the IC die 24 to reflect and/or direct a radiation pattern 66 emitted by or received by the antenna structure 64. A trace 82 can be interconnected between the insulated bond pads 36, 46 to form a folded dipole antenna structure 84.
    Type: Application
    Filed: May 25, 2007
    Publication date: November 27, 2008
    Applicant: FREESCALE SEMICONDUCTOR, INC.
    Inventors: Chi Taou Tsai, Ricardo A. Uscola
  • Publication number: 20080119214
    Abstract: A power amplifier (PA) line-up (210) and a method (500) for more efficiently utilizing battery power are disclosed. PA line-up (210) includes a driver (220), a matching circuit (214), and a PA (230) coupled to a matching circuit (216), wherein matching circuit (216) is configured to be coupled to a filter (260). PA line-up (210) includes a transmission line (260) coupled to matching circuit (216) and a switch (262) configured to selectively couple driver (220) to either matching circuit (214) or matching circuit (216) such that signal (205) is capable of by-passing PA (230) when signal (205) does not need to be amplified by PA (230). Furthermore, PA line-up (210) may include a second transmission line (250) so that signal (205) is capable of by-passing a driver (220) and a PA (230) when signal (205) does not need to be amplified by driver (220) and PA (230).
    Type: Application
    Filed: November 16, 2006
    Publication date: May 22, 2008
    Inventors: Lianjun Liu, Ricardo A. Uscola
  • Publication number: 20080039025
    Abstract: A transceiver includes a harmonic termination circuit that receives a tunable harmonic voltage from a power amplifier control. The harmonic termination circuit includes a variable capacitor that is capable of adjusting its capacitance in response to the tunable harmonic termination voltage to achieve at least two modes of operation. The at least two modes of operation may be EDGE mode and GSM mode. In this embodiment, the harmonic termination circuit allows for linearity specifications of EDGE to be met, while not degrading the efficiency of the transceiver when operating in GSM mode. In one embodiment, the harmonic termination circuit further includes an inductive element in series with the variable capacitor.
    Type: Application
    Filed: August 3, 2007
    Publication date: February 14, 2008
    Inventors: Marcus R. Ray, Darrell G. Hill, Ricardo A. Uscola