Patents by Inventor Rich Fogal
Rich Fogal has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
-
Patent number: 6276594Abstract: An extended travel wire bonding machine that includes a first positioning table movable along an X axis in a first horizontal plane, a second positioning table movable along X and Y axes in a second horizontal plane, the second positioning table being supported on the first positioning table, and a bond head supported on the second positioning table. The wire bonding machine may also include a bonding tool attached to the bond head and a carrier for supporting the leadframe strip under the bonding tool. The first positioning table is moveable for substantially the entire length of the leadframe strip to allow the bonding tool to be successively moved over each semiconductor die on the leadframe strip.Type: GrantFiled: October 23, 2000Date of Patent: August 21, 2001Assignee: Micron Technology, Inc.Inventors: Rich Fogal, Michael B. Ball
-
Patent number: 6253990Abstract: An extended travel wire bonding machine that includes a first positioning table movable along an X axis in a first horizontal plane, a second positioning table movable along X and Y axes in a second horizontal plane, the second positioning table being supported on the first positioning table, and a bond head supported on the second positioning table. The wire bonding machine may also include a bonding tool attached to the bond head and a carrier for supporting the leadframe strip under the bonding tool. The first positioning table is moveable for substantially the entire length of the leadframe strip to allow the bonding tool to be successively moved over each semiconductor die on the leadframe strip.Type: GrantFiled: October 23, 2000Date of Patent: July 3, 2001Assignee: Micron Technology, Inc.Inventors: Rich Fogal, Michael B. Ball
-
Patent number: 6253991Abstract: An extended travel wire bonding machine that includes a first positioning table movable along an X axis in a first horizontal plane, a second positioning table movable along X and Y axes in a second horizontal plane, the second positioning table being supported on the first positioning table, and a bond head supported on the second positioning table. The wire bonding machine may also include a bonding tool attached to the bond head and a carrier for supporting the leadframe strip under the bonding tool. The first positioning table is moveable for substantially the entire length of the leadframe strip to allow the bonding tool to be successively moved over each semiconductor die on the leadframe strip.Type: GrantFiled: October 23, 2000Date of Patent: July 3, 2001Assignee: Micron Technology, Inc.Inventors: Rich Fogal, Michael B. Ball
-
Patent number: 6237830Abstract: A precisor plate for an automatic wire bonder having a heat block attachment portion thereon to precisely attach a heat block thereto provides a simple and quickly adjustable precisor plate and method of alignment. The precisor plate includes fixed alignment pins to align the precisor plate relative to a lead frame in an automatic wire bonding machine. In a preferred embodiment, the heat block is integral with the precisor plate and includes internal bores and or passageways for receiving a heating element, a thermocouple, and/or a vacuum source.Type: GrantFiled: June 14, 1999Date of Patent: May 29, 2001Assignee: Micron Technology, Inc.Inventors: Rich Fogal, Michael B. Ball, Ronald W. Ellis
-
Patent number: 6223967Abstract: An extended travel wire bonding machine that includes a first positioning table movable along an X axis in a first horizontal plane, a second positioning table movable along X and Y axes in a second horizontal plane, the second positioning table being supported on the first positioning table, and a bond head supported on the second positioning table. The wire bonding machine may also include a bonding tool attached to the bond head and a carrier for supporting the leadframe strip under the bonding tool. The first positioning table is moveable for substantially the entire length of the leadframe strip to allow the bonding tool to be successively moved over each semiconductor die on the leadframe strip.Type: GrantFiled: February 1, 1999Date of Patent: May 1, 2001Assignee: Micron Technology, Inc.Inventors: Rich Fogal, Michael B. Ball
-
Patent number: 6196445Abstract: An extended travel wire bonding machine that includes a first positioning table movable along an X axis in a first horizontal plane, a second positioning table movable along X and Y axes in a second horizontal plane, the second positioning table being supported on the first positioning table, and a bond head supported on the second positioning table. The wire bonding machine may also include a bonding tool attached to the bond head and a carrier for supporting the leadframe strip under the bonding tool. The first positioning table is moveable for substantially the entire length of the leadframe strip to allow the bonding tool to be successively moved over each semiconductor die on the leadframe strip.Type: GrantFiled: December 8, 1998Date of Patent: March 6, 2001Assignee: Micron Technology, Inc.Inventors: Rich Fogal, Michael B. Ball
-
Patent number: 6133630Abstract: A condensed memory matrix is fabricated by conductively connecting the attachment bumps of a substrate with the attachment bumps of a wafer of DRAM chips and physically bonding the juxtaposed surfaces of the substrate and the wafer with a dielectric curable resin. An array of heat fins is bonded to the inactive surface of the wafer by a thermally conductive curable resin.Type: GrantFiled: April 7, 1999Date of Patent: October 17, 2000Assignee: Micron Technology, Inc.Inventors: Rich Fogal, Alan G. Wood
-
Patent number: 6117693Abstract: A method and system for fabricating electronic assemblies, such as multi chip modules, which include wire bonded semiconductor dice, are provided. Initially, dice having bond pads, and a substrate having corresponding bond pads, are provided. Using a wire bonding process, bonded connections are made between the bond pads on the dice, and the bond pads on the substrate. During the wire bonding process, electrical continuity in the bonded connections can be evaluated. Following wire bonding, but prior to subsequent processing of the assemblies, quick functionality tests can be performed to evaluate other electrical characteristics of the assemblies (e.g., gross functionality, open/short, pad leakage, cell defects). This permits defective assemblies to be identified prior to further processing. Once the assemblies have been completed, full functionality and parametric tests can be performed.Type: GrantFiled: November 18, 1998Date of Patent: September 12, 2000Assignee: Micron Technology, Inc.Inventors: Rich Fogal, Steve Heppler
-
Patent number: 6071757Abstract: A condensed memory matrix is fabricated by conductively connecting the attachment bumps of a substrate with the attachment bumps of a wafer of DRAM chips and physically bonding the juxtaposed surfaces of the substrate and the wafer with a dielectric curable resin. An array of heat fins is bonded to the inactive surface of the wafer by a thermally conductive curable resin.Type: GrantFiled: October 20, 1998Date of Patent: June 6, 2000Assignee: Micron Technology, Inc.Inventors: Rich Fogal, Alan G. Wood
-
Patent number: 6068174Abstract: A wire-bonding machine includes a heat block for supporting a lead frame during wire-bonding. A clamp mechanism in the machine clamps leads of the lead frame during wire-bonding by fixedly holding sets of the leads against the heat block one set at a time. A wire-bonding tool wire-bonds leads clamped by the clamp mechanism to bond pads on an integrated circuit die. By clamping leads of the lead frame in separate sets, the machine provides improved clamping for lead frames with leads requiring clamping in different planes.Type: GrantFiled: December 13, 1996Date of Patent: May 30, 2000Assignee: Micro)n Technology, Inc.Inventors: Michael B. Ball, Rich Fogal
-
Patent number: 6051886Abstract: An offset die stacking arrangement is disclosed having at least one upper level die having a width which is less than the distance separating the opposing bonding sites of the underlying die. The upper die is fixed above the lower die and rotated within a plane parallel to the lower die through an angle which insures that none of the bonding sites of the lower die are obstructed by the upper die. Once the dice are fixed in this manner, the entire assembly is subjected to the wire bonding process with all of the bonds being made in the same step.Type: GrantFiled: July 24, 1998Date of Patent: April 18, 2000Assignee: Micron Technology, Inc.Inventors: Rich Fogal, Michael B. Ball
-
Patent number: 6047468Abstract: An apparatus for stabilizing a semiconductor die and lead fingers of a lead frame during the process of wire bonding comprising a rigid clamp having at least one bond site window extending therethrough and at least one resilient secondary clamp which extends from an edge of the bond site window to a position over and in contact with lead fingers extending over the semiconductor die. The arrangement of the secondary clamp is such that the contact force with the semiconductor die is sufficient to minimize, dampen, or prevent movement of the semiconductor die and/or lead finger bounce during the wire bonding process. Methods of clamping are also disclosed.Type: GrantFiled: January 29, 1998Date of Patent: April 11, 2000Assignee: Micron Technology, Inc.Inventors: Rich Fogal, Michael B. Ball
-
Patent number: 6015079Abstract: An extended travel wire bonding machine that includes a first positioning table movable along an X axis in a first horizontal plane, a second positioning table movable along X and Y axes in a second horizontal plane, the second positioning table being supported on the first positioning table, and a bond head supported on the second positioning table. The wire bonding machine may also include a bonding tool attached to the bond head and a carrier for supporting the leadframe strip under the bonding tool. The first positioning table is moveable for substantially the entire length of the leadframe strip to allow the bonding tool to be successively moved over each semiconductor die on the leadframe strip.Type: GrantFiled: August 4, 1997Date of Patent: January 18, 2000Assignee: Micron Technology, Inc.Inventors: Rich Fogal, Michael B. Ball
-
Patent number: 6000599Abstract: An apparatus and method of forming improved wire bonds between the contact pads on semiconductor devices and individual lead frame fingers of a lead frame. The present invention includes the use of an individual independent lead finger clamp during the wire bonding process to provide increased stability of the individual lead finger for improved bonding. If desired, the present invention also provides for the use of a conventional fixed clamp for the lead fingers during the wire bonding process in addition to the individual independent lead finger clamp during the wire bonding process to provide increased stability of the individual lead finger for improved bonding. The present invention also contemplates the replacement of the fixed clamp with another, or second, independent clamp in addition to the first individual independent lead finger clamp during the wire bonding process.Type: GrantFiled: May 30, 1997Date of Patent: December 14, 1999Assignee: Micron Technology, Inc.Inventors: Michael B. Ball, Rich Fogal
-
Patent number: 5977629Abstract: A condensed memory matrix is fabricated by conductively connecting the attachment bumps of a substrate with the attachment bumps of a wafer of DRAM chips and physically bonding the juxtaposed surfaces of the substrate and the wafer with a dielectric curable resin. An array of heat fins is bonded to the inactive surface of the wafer by a thermally conductive curable resin.Type: GrantFiled: January 24, 1996Date of Patent: November 2, 1999Assignee: Micron Technology, Inc.Inventors: Rich Fogal, Alan G. Wood
-
Patent number: 5971256Abstract: A precisor plate for an automatic wire bonder having a heat block attachment portion thereon to precisely attach a heat block thereto provides a simple and quickly adjustable precisor plate and method of alignment. The precisor plate includes fixed alignment pins to align the precisor plate relative to a lead frame in an automatic wire bonding machine. In a preferred embodiment, the heat block is integral with the precisor plate and includes internal bores and or passageways for receiving a heating element, a thermocouple, and/or a vacuum source.Type: GrantFiled: February 5, 1997Date of Patent: October 26, 1999Assignee: Micron Technology, Inc.Inventors: Rich Fogal, Michael B. Ball, Ronald W. Ellis
-
Patent number: 5963794Abstract: An offset die stacking arrangement having at least one upper level die having a width which is less than the distance separating the opposing bonding sites of the underlying die. The upper die is suspended above the lower die on one or more pillars and rotated within a plane parallel to the lower die through an angle which insures that none of the bonding sites of the lower die are obstructed by the upper die. Once the dice are fixed in this manner, the entire assembly is subjected to the wire bonding process with all of the bonds being made in the same step.Type: GrantFiled: February 24, 1998Date of Patent: October 5, 1999Assignee: Micron Technology, Inc.Inventors: Rich Fogal, Michael B. Ball
-
Patent number: 5954842Abstract: An apparatus for stabilizing a semiconductor die and lead fingers of a lead frame during the process of wire bonding comprising a rigid clamp having at least one bond site window extending therethrough and at least one resilient secondary clamp which extends from an edge of the bond site window to a position over and in contact with lead fingers extending over the semiconductor die. The arrangement of the secondary clamp is such that the contact force with the semiconductor die is sufficient to minimize, dampen, or prevent movement of the semiconductor die and/or lead finger bounce during the wire bonding process.Type: GrantFiled: January 26, 1996Date of Patent: September 21, 1999Assignee: Micron Technology, Inc.Inventors: Rich Fogal, Michael B. Ball
-
Patent number: 5918107Abstract: A method and system for fabricating electronic assemblies, such as multi chip modules, which include wire bonded semiconductor dice, are provided. Initially, dice having bond pads, and a substrate having corresponding bond pads, are provided. Using a wire bonding process, bonded connections are made between the bond pads on the dice, and the bond pads on the substrate. During the wire bonding process, electrical continuity in the bonded connections can be evaluated. Following wire bonding, but prior to subsequent processing of the assemblies, quick functionality tests can be performed to evaluate other electrical characteristics of the assemblies (e.g., gross functionality, open/short, pad leakage, cell defects). This permits defective assemblies to be identified prior to further processing. Once the assemblies have been completed, full functionality and parametric tests can be performed.Type: GrantFiled: April 13, 1998Date of Patent: June 29, 1999Assignee: Micron Technology, Inc.Inventors: Rich Fogal, Steve Heppler
-
Patent number: 5905305Abstract: A condensed memory matrix is fabricated by conductively connecting the attachment bumps of a substrate with the attachment bumps of a wafer of DRAM chips and physically bonding the juxtaposed surfaces of the substrate and the wafer with a dielectric curable resin. An array of heat fins is bonded to the inactive surface of the wafer by a thermally conductive curable resin.Type: GrantFiled: August 11, 1997Date of Patent: May 18, 1999Assignee: Micron Technology, Inc.Inventors: Rich Fogal, Alan G. Wood