Abstract: A monolithic charge-coupled infrared imaging device (CCIRID) is fabricated on N-type HgCdTe. A native oxide layer on the semiconductor is used, in combination with ZnS to provide first level insulation. An opaque field plate over first level insulation is provided for signal channel definition. Second level insulation (ZnS) is substantially thicker than the first level, and is provided with a stepped or sloped geometry under the first level gates. Input and output diodes are provided with MIS guard rings to increase breakdown voltages.

Abstract: An infrared charge transfer device (CTD) imaging system is disclosed which includes an optic system for focusing infrared energy emanating from a scene, a detector matrix for receiving the focused infrared energy and converting it to electrical signals representative of the intensity of the infrared energy, and a video processor for processing the electrical signals into video signals. The detector matrix of the system is a plurality of IR detector cells arranged in rows and columns. Each detector cell includes a substrate of semiconductor material, an integrating electrode, a drain electrode, a transfer electrode and insulating layers. The integrating electrode is centrally disposed with respect to the drain and transfer electrodes with the integrating electrode in a spaced relationship with the drain electrode. The integrating and drain electrodes form first level MIS electrodes on the semiconductor substrate.

Abstract: An infrared charge transfer device (CTD) imager system is disclosed which includes an optic system, a charge transfer device detector matrix and a signal processor. The optic system focuses infrared energy from a scene onto the detector matrix. The detector matrix produces electrical signals representative of the impinging energy and the signal processor processes the electrical signals into video signals. The CTD detector matrix comprises a plurality of charge injection devices (CID). Each CID has an IR sensitive area, and two metal/insulator/semiconductor gate electrodes surrounded by a field plate. One, a column gate electrode, is centrally located within the IR sensitive area and the other, a row gate electrode, surrounds the column gate electrode.

Abstract: A scanning type infrared imaging system comprising a lens system, a scanner, an infrared sensing matrix and a signal processor. Said lens system is for focusing infrared energy emanating from a scene onto the infrared sensing matrix. Said scanner is for scanning the infrared energy emanating from the scene. Said infrared sensing matrix is for converting the infrared energy into charge packets representative of the impinging infrared energy, and said signal processor is for processing the electrical signals into video signals. Said infrared sensing matrix comprises an array of charge transfer device elements arranged in rows and columns. Each element has four electrodes for receiving phase 1, phase 2, phase 3 and phase 4 pulses. The phase 3 and phase 1 electrodes are for transfer gates and the phase 2 and phase 4 electrodes are for charge storage wells.

Abstract: A monolithic charge-coupled infrared imaging device (CCIRID) is fabricated on N-type HgCdTe. A native oxide layer on the semiconductor is used, in combination with ZnS to provide first level insulation. An opaque field plate over first level insulation is provided for signal channel definition. Second level insulation (ZnS) is substantially thicker than the first level, and is provided with a stepped or sloped geometry under the first level gates. Input and output diodes are provided with MIS guard rings to increase breakdown voltages.

Abstract: An electrochromic display cell having a transparent front panel with an internal conductive coating providing a pleasing external appearance, and masking a counter-electrode affixed thereto; said internal coating having a window area to permit external viewing of display electrodes affixed to the back panel, which is sealed to the front panel with a ring spacer to provide an electrolyte chamber about five to ten mils thick; external electrode contacts to the electrical leads to the display electrodes are arranged on the back or front panel.

Abstract: This disclosure defines an infrared image detector formed in a block of semiconductor material by etching slots in the semiconductor material. The slots define the individual detectors, effectively isolate them from each other both optically and electrically, and permit the detectors to be placed very close to each other.

Abstract: This disclosure is directed to a photovoltaic detector having specific response to the infrared range, wherein the detector comprises a metal-semiconductor diode having a semi-transparent electrode and disposed on a specially prepared substrate of a narrow band gap semiconductor material or on an epitaxial layer or evaporated film of such material provided on a substrate. In a specific example, the narrow band gap semiconductor material of the substrate is specially prepared (Pb,Sn)Te or an epitaxial layer or evaporated film of (Pb,Sn)Te on a (Pb,Sn)Te substrate. The detected radiation is transmitted through the semi-transparent electrode on top of the photovoltaic detector.