Abstract: A clip for retaining a chip tray and lid, including in one example a pair of side walls, a rear wall, an upper peripheral edge extending from an upper section of each of the side walls and the rear wall and defining an upper region open area therebetween. A lower peripheral edge extending from a lower section of each of the side walls and the rear wall and defining a lower region open area therebetween. A front opening configured to receive the chip tray and lid. The chip tray has a plurality of pockets configured to hold the semiconductor devices. In one example the lid includes a shock absorbing layer and an electrostatic dissipative layer integrated into an interior of the lid.

Abstract: The present disclosure relates to a system and technique for a system for detecting fluorescing particles on a target comprising a viewing device configured to view the target and a light subsystem configured to illuminate the target, wherein the target includes a fluorescing particle that effectuates the fluorescent feedback second wavelength. In one example, no additional fluorescing agent or additive, other than the fluorescing particle, is added to the target. A passive cooling subsystem is configured to prevent overheating of the system without expending additional energy resources. The system includes a filter in operative communication with the viewing device having a selected filter wavelength configured to allow light to pass that is greater than the first wavelength and at least one non-transitory computer readable storage medium having instructions encoded thereon.

Abstract: A system for securely storing semiconductor die and devices employing a waffle pack lid configured to mate with a waffle pack tray. The lid body has an interior surface with a cavity including a shock absorbing layer. There is at least one electrostatic dissipative layer comprising attached to the shock absorbing layer such that the electrostatic dissipative layer seals the compartments on the waffle pack tray.

Abstract: The present disclosure relates to a system and technique for a system for detecting fluorescing particles on a target comprising a viewing device configured to view the target and a light subsystem configured to illuminate the target, wherein the target includes a fluorescing particle that effectuates the fluorescent feedback second wavelength. In one example, no additional fluorescing agent or additive, other than the fluorescing particle, is added to the target. A passive cooling subsystem is configured to prevent overheating of the system without expending additional energy resources. The system includes a filter in operative communication with the viewing device having a selected filter wavelength configured to allow light to pass that is greater than the first wavelength and at least one non-transitory computer readable storage medium having instructions encoded thereon.

Abstract: The present disclosure relates to a system and method utilizing a light source coupled with a viewing device to detect contaminant(s) on an electronic circuit board. This fluorescence microscopy apparatus can be easily integrated into a bench top stereoscope or microscope and does not require the use of expensive and destructive analytical techniques. Typically, blue light is used in conjunction with a filter to detect contamination from cured epoxy resins and many other contaminants on gold bond pads, wires, pads, or other electrically conductive elements on the electronic circuit.

Abstract: The present disclosure relates to a system and method utilizing a light source coupled with a viewing device to detect contaminant(s) on an electronic circuit board. This fluorescence microscopy apparatus can be easily integrated into a bench top stereoscope or microscope and does not require the use of expensive and destructive analytical techniques. Typically, blue light is used in conjunction with a filter to detect contamination from cured epoxy resins and many other contaminants on gold bond pads, wires, pads, or other electrically conductive elements on the electronic circuit.

Abstract: A specialized tool is provided for the removal of components in a microwave module in which a fixed tool having a channeled tip is positioned adjacent the component to be removed, with a hot stream of gas, forced through the channel to the top of the component which serves to heat the component, the component being removed through shearing when the component is forced against the tip.

Abstract: A specialized tool is provided for the removal of components in a microwave module in which a fixed tool having a channeled tip is positioned adjacent the component to be removed. A hot stream of gas, in one embodiment nitrogen, is then forced through the channel onto the top surface of the component to be removed, with the microwave module lying on a heated platen, such that the local increase in temperature at the component to be removed is enough hotter than the ambient temperature of the module as determined by the heated platen to soften the silver epoxy used to mount the component to the module without damaging nearby components. With the fixed tool adjacent the component to be removed and with the component provided with targeted heating, the module is moved against the tool to cause a shear force that moves the component away from its original position, thus breaking the epoxy bond, after which the component is plucked from the module.

Abstract: A specialized tool is provided for the removal of components in a microwave module in which a fixed tool having a channeled tip is positioned adjacent the component to be removed, with hot gas from the channeled tip melting the epoxy or solder and with the module forced against the fixed tool to remove it.

Abstract: A specialized tool is provided for the removal of components in a microwave module in which a fixed tool having a channeled tip is positioned adjacent the component to be removed. A hot stream of gas, in one embodiment nitrogen, is then forced through the channel onto the top surface of the component to be removed, with the microwave module lying on a heated platen, such that the local increase in temperature at the component to be removed is enough hotter than the ambient temperature of the module as determined by the heated platen to soften the silver epoxy used to mount the component to the module without damaging nearby components. With the fixed tool adjacent the component to be removed and with the component provided with targeted heating, the module is moved against the tool to cause a shear force that moves the component away from its original position, thus breaking the epoxy bond, after which the component is plucked from the module.

Abstract: A method and corresponding system for assembling collation sets from a split web consisting of two webstreams, each providing a series of collations of connected sheets. The method includes the steps of: alternately selecting the two webstreams and from the selected webstream drawing a sheet to a cutting or bursting station; cutting or bursting the sheet to separate it from the webstream; conveying the sheet to an accumulating station where sheets are accumulated; monitoring the sheet for determining whether the sheet is a beginning or an end of a collation; and ejecting the sheets accumulated from the selected webstream based on the determining of whether the sheet is the beginning or the end of a collation.