Clip for a semiconductor chip tray
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The broken lines showing of a clip for a semiconductor chip tray which form no part of the claimed design.
Claims
The ornamental design for a clip for a semiconductor chip tray, as shown and described.
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Type: Grant
Filed: Nov 24, 2020
Date of Patent: Nov 29, 2022
Assignee: BAE Systems Information and Electronic Systems Integration Inc. (Nashua, NH)
Inventors: Richard Rochford (Litchfield, NH), Edward L. Brabant, Jr. (Dracut, MA)
Primary Examiner: Keli L Hill
Assistant Examiner: Harold E Blackwell, II
Application Number: 29/759,675