Abstract: An organic electronic device and a method of making an organic electronic device are provided. An embodiment of an electronic device includes a substrate, an active layer disposed on the substrate and a thin-layer encapsulation disposed on the active layer. The device further includes a first adhesive layer disposed on the thin-layer encapsulation, wherein the first adhesive layer comprises a getter material and a covering layer disposed on the first adhesive layer.

Abstract: An optoelectronic component may include a carrier, a first electrode over the carrier, an organically functional layer structure over the first electrode, a second electrode over the organically functional layer structure, and an encapsulation layer structure over the second electrode, the encapsulation layer structure encapsulating the organically functional layer structure and including a first layer structure facing toward the second electrode and a second layer structure facing away from the second electrode, the first layer structure alternately including first layers having a first expansion coefficient and second layers having a second expansion coefficient, which is not equal to the first expansion coefficient, and the second layer structure alternately including third layers having a third expansion coefficient and fourth layers having a fourth expansion coefficient, which is not equal to the third expansion coefficient.

Abstract: In at least one embodiment, an organic optoelectronic component, which is preferably an organic light emitting diode, includes a first electrode layer, a second electrode layer and an organic layer sequence situated between the electrode layers. Furthermore, the component includes a light-transmissive current confinement layer, which is fitted over the whole area between the first electrode layer and the organic layer sequence, such that the organic layer sequence is spaced apart from the first electrode layer. The current confinement layer is produced continuously from a common starting material and is structured by treatment and/or by action of temperature into at least one conductive region having a high electrical conductivity and into at least one insulating region having a low electrical conductivity. These electrical conductivities differ from one another by at least a factor of 10.

Abstract: A method for producing an optoelectronic component includes forming an optoelectronic layer structure including a functional layer structure above a carrier, forming a frame structure including a first metallic material on the optoelectronic layer structure such that a region above the functional layer structure is free of the frame structure and that the frame structure surrounds the region, forming an adhesion layer including a second metallic material above a covering body, applying a liquid first alloy to the optoelectronic layer structure and/or to the adhesion layer of the covering body in the region, coupling the covering body to the optoelectronic layer structure such that the adhesion layer is coupled to the frame structure and the liquid first alloy is in direct contact with the adhesion layer and the frame structure, and reacting part of the first alloy chemically with the metallic materials of the frame structure and the adhesion layer.

Abstract: A method for producing an optoelectronic component may include forming an optoelectronic layer structure having a first adhesion layer, which comprises a first metallic material, above a carrier, providing a covering body with a second adhesion layer, which comprises a second metallic material, applying a first alloy to one of the two adhesion layers, the melting point of the first alloy being so low that the first alloy is liquid, coupling the covering body to the optoelectronic layer structure in such a way that both adhesion layers are in direct contact with the liquid first alloy, and reacting at least part of the liquid first alloy chemically with the metallic materials, as a result of which at least one second alloy is formed, which has a higher melting point than the first alloy, wherein the second alloy solidifies and fixedly connects the covering body to the optoelectronic layer structure.

Abstract: A method for producing an optoelectronic component includes forming an optoelectronic layer structure including a functional layer structure above a carrier, forming a frame structure including a first metallic material on the optoelectronic layer structure such that a region above the functional layer structure is free of the frame structure and that the frame structure surrounds the region, forming an adhesion layer including a second metallic material above a covering body, applying a liquid first alloy to the optoelectronic layer structure and/or to the adhesion layer of the covering body in the region, coupling the covering body to the optoelectronic layer structure such that the adhesion layer is coupled to the frame structure and the liquid first alloy is in direct contact with the adhesion layer and the frame structure, and reacting part of the first alloy chemically with the metallic materials of the frame structure and the adhesion layer.

Abstract: In various embodiments, an organic optoelectronic component is provided. The organic optoelectronic component may include a first electrode, an organic functional layer structure over the first electrode, and a second electrode over the organic functional layer structure. Optionally, the organic functional layer structure includes a charge carrier pair generation layer structure. At least one of the electrodes and/or the charge carrier pair generation layer structure includes electrically conductive nanostructures, the surfaces of which are at least partially coated with a coating material.

Abstract: An organic light-emitting component includes a substrate on which a functional layer stack is applied, the stack including a first electrode, an organic functional layer stack thereover including an organic light-emitting layer and a translucent second electrode thereover, and a translucent halogen-containing thin-film encapsulation arrangement over the translucent second electrode, wherein a translucent protective layer having a refractive index of more than 1.6 is arranged directly on a translucent second electrode between the translucent second electrode and the thin-film encapsulation arrangement, and the thin-film encapsulation arrangement is arranged directly on the translucent protective layer.

Abstract: An element (1) is provided for stabilising an optoelectronic device (7), wherein the element (1) comprises a main body (1C), wherein the main body (1C) consists of a glass or at least comprises a glass and wherein the main body (1C) comprises a first and a second surface (1A, 1B). The first and second surface (1A, 1B) are opposite to one another and extend in each case in a lateral main direction of extension of the element (1), wherein a protective layer (2A, 2B) is formed at least at one of the surfaces (1A, 1B) and wherein the protective layer (2A, 2B) is configured and arranged in such a way that cracks (3) present in the main body (1C) are filled in by a material of the protective layer (2A, 2B). In addition, a method is provided for producing an element (1) for stabilising an optoelectronic device (7). In addition, an optoelectronic device (7) is provided.

Abstract: An organic light-emitting component includes a substrate on which a functional layer stack is applied, the stack including a first electrode, an organic functional layer stack thereover including an organic light-emitting layer and a translucent second electrode thereover, and a translucent halogen-containing thin-film encapsulation arrangement over the translucent second electrode, wherein a translucent protective layer having a refractive index of more than 1.6 is arranged directly on the translucent second electrode between the translucent second electrode and the thin-film encapsulation arrangement.

Abstract: The invention relates to an organic optoelectronic component comprising a substrate (101) on which a first electrode (102), then an organic functional layer stack (103) having at least one organic optoelectronic layer, and then a second electrode (104) are successively arranged. A thin film encapsulation (107) is arranged over the second electrode (104) and in addition to the second electrode (104), at least one first intermediate layer (121) having a hardness which is different from the layer which is directly adjacent thereto is arranged between the organic functional layer stack (103) and the thin-film encapsulation (107).

Abstract: An optoelectronic component having an outer surface facing the environment of the optoelectronic component and which is formed by a hydrophobic layer applied at least partly on a surface of the optoelectronic component.

Abstract: An encapsulation structure for an optoelectronic component, may include: a thin-film encapsulation for protecting the optoelectronic component against chemical impurities; an adhesive layer formed on the thin-film encapsulation; and a cover layer formed on the adhesive layer and serving for protecting the thin-film encapsulation and/or the optoelectronic component against mechanical damage, wherein the adhesive layer is formed such that particle impurities situated at the surface of the thin-film encapsulation are at least partly enclosed by the adhesive layer.

Abstract: The invention relates to a method for producing at least one layer (1) on a surface area (2) of an optoelectronic component (100, 101, 102, 103, 104, 105) comprising a functional layer sequence (41) with an active area which is suitable to produce or to detect the light when the optoelectronic component is in operation. Said method consists of the following steps: introducing the surface area (2) into a coating chamber (10); depositing the at least one layer (1) according to a flash-light supported atomic layer deposition method in which the surface area (2) is exposed to at least one gaseous first initial material (21) or at least one gaseous first initial material (21) and subsequently a gaseous second initial material (22) to form the at least one layer (1), and molecules of the first and/or second initial material (21, 22), which are absorbed on the surface area, are exposed to at least one flash of light, the molecules absorbed on the surface area being split.

Abstract: A method for producing an optoelectronic component may include forming a first electrode on a substrate, forming an organic functional layer structure on the first electrode; forming a second electrode on the organic functional layer structure, forming at least one contact for making contact with the first and/or second electrode, forming an encapsulation layer above the layer structure and the contact, removing the encapsulation layer above the contact with the aid of an anisotropic etching method, and cooling the substrate during the anisotropic etching method.

Abstract: An ALD coating system includes a storage container for an organometallic starting material and an intermediate container for a partial amount of the organometallic starting material. The intermediate container has a device for heating up the organometallic starting material. The intermediate container is arranged downstream of the storage container by way of a first multiway valve. The intermediate container is connected to a process chamber by way of a second multiway valve and to a collecting chamber by way of a third multiway valve.

Abstract: An organic light-emitting component includes a substrate on which a functional layer stack is applied, the stack including a first electrode, an organic functional layer stack thereover including an organic light-emitting layer and a translucent second electrode thereover, and a translucent halogen-containing thin-film encapsulation arrangement over the translucent second electrode, wherein a translucent protective layer having a refractive index of more than 1.6 is arranged directly on the translucent second electrode between the translucent second electrode and the thin-film encapsulation arrangement.

Abstract: Various embodiments may relate to an electronic component including a layer to be protected against moisture, and a moisture barrier layer arranged at least partly on or above and/or below the layer to be protected. The moisture bather layer includes a plurality of layers composed of the same material having different stoichiometric compositions.

Abstract: An optoelectronic component having an outer surface facing the environment of the optoelectronic component and which is formed by a hydrophobic layer applied at least partly on a surface of the optoelectronic component.

Abstract: A method for producing an optoelectronic component may include forming a first electrode on a substrate, forming an organic functional layer structure on the first electrode; forming a second electrode on the organic functional layer structure, forming at least one contact for making contact with the first and/or second electrode, forming an encapsulation layer above the layer structure and the contact, removing the encapsulation layer above the contact with the aid of an anisotropic etching method, and cooling the substrate during the anisotropic etching method.